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The embedded die packaging technology market was valued at US$ 63.40 million in 2020 and is projected to reach US$ 242.80 million by 2028. The embedded die packaging technology market is expected to grow at a CAGR of 18.6% during the forecast period of 2021 to 2028.
Electronics devices are evolving at a rapid rate with the integration of more electronic components in circuit boards for advanced features. The devices are getting more compact in size with advanced packaging technology to offer enhanced control and space saving for customers. Miniaturization of electronic devices to optimize space in final devices is augmenting the market growth. Advent of Internet of things (IoT)-connected devices has increased the demand for embedded die packaging technology to integrate more IoT components in the same space. In addition, the growing adoption of smartphones and smart wearables is further supplementing the market growth. Smartphones and smart wearables are being designed using the embedded die packaging technology to optimize the available space for integrating more components.
Increasing adoption of compact electronics gadgets having internet connectivity is supporting the embedded die packaging technology to integrate maximum parts in a single package. The global embedded die packaging technology market is segmented based on platform, application, industry vertical, and geography. Based on platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board. In terms of application, the embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, and security devices. Based on industry, the embedded die packaging technology market is segmented as automotive, healthcare, consumer electronics, IT & telecommunication, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific (APAC), and Rest of the World.
Impact of COVID-19 Pandemic on Embedded Die Packaging Technology Market
The COVID-19 pandemic has hampered the semiconductor industry and economic growth of almost every country. The pandemic has severely impacted the manufacturing sector due to shutdown of facilities for a certain period. Sales of various industrial products, such as automotive cars and electronics, was declined. Office premises, public places, schools, transportation, and other spaces also remained closed which declined market growth owing to low sale. The semiconductor industry took a major hit as the demand for electronics components from every industrial sector and end consumers was reduced. The revenue model for microelectronics has declined as there was no mass production during the lockdown period. Post-lockdown, the semiconductor industry started to regain the market share as production facilities restarted their operations, with preventive measures.
Lucrative Regions in Embedded Die Packaging Technology Market
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Embedded Die Packaging Technology Market Insights
Growing Demand for Miniaturization of Electronic Devices
Electronics gadgets are being developed using small form factor electronic components to enhance the space and improve the final product design. Customers are preferring compact, small-sized handheld electronic devices offering maximum features. To enhance user experience, companies are developing miniaturized electronics to integrate maximum components on a single die. Integrating maximum number of components, such as sensors and processor, in a single die offers enhanced features for customers. Rising techno savvy population is one the major factors for the miniaturization of electronics as it has created stiff competition in market players to offer maximum number of features in a single device.
Platform-Based Market Insights
Packaging technology has evolved rapidly to enhance the packaging of small electronic components in a single die to optimize the space in the final device. In IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefits, such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. In terms of platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board.
Embedded Die Packaging Technology Market, by Platform – 2020 and 2028
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Source: The Insight Partners Analysis
Note: Inner circle represents market size for 2020 and outer circle represents 2028.
Application-Based Market Insights
In terms of application, the global embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, security devices, and others. The emerging need of microelectronics from various industry verticals, including automotive, healthcare, and consumer electronics, for small-form factor-based applications are supporting the market growth. Growing trend of size reduction and improving functionality of electronic devices are boosting the adoption of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in a smartphone design, as manufacturers are urging for a new solution to take the minimum space possible.
Industry-Based Market Insights
Based on industry, the global embedded die packaging technology is segmented into consumer electronics, it and telecommunication, automotive, healthcare, and others. Rise in adoption of smart devices and connected vehicles has increased the need for IoT devices developed by advanced packaging technology. In addition, smart wearables are playing a major role in human health monitors. Increasing demand for small electronics devices in the healthcare industry is supporting the market growth.
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Embedded Die Packaging Technology Market: Strategic Insights
Market Size Value in US$ 63.40 Million in 2020 Market Size Value by US$ 242.80 Million by 2028 Growth rate CAGR of 18.6% from 2021-2028 Forecast Period 2021-2028 Base Year 2021
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Customize Research To Suit Your Requirement
We can optimize and tailor the analysis and scope which is unmet through our standard offerings. This flexibility will help you gain the exact information needed for your business planning and decision making.
Embedded Die Packaging Technology Market: Strategic Insights
Market Size Value in | US$ 63.40 Million in 2020 |
Market Size Value by | US$ 242.80 Million by 2028 |
Growth rate | CAGR of 18.6% from 2021-2028 |
Forecast Period | 2021-2028 |
Base Year | 2021 |
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Speak to AnalystPlayers operating in the embedded die packaging technology market focus on strategies such as market initiatives, acquisitions, and product launches to maintain their positions in the market. A few developments by key players of the embedded die packaging technology market are:
- In August 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea.
- In August 2020, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) launched new 3D silicon tacking and advanced packaging technology.
The embedded die packaging technology market has been segmented as follows:
Embedded Die Packaging Technology Market – by Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
Embedded Die Packaging Technology Market – by Application
- Smartphones and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
Embedded Die Packaging Technology Market – by Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
Embedded Die Packaging Technology Market – by Region
- North America
- US
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Italy
- Russia
- Rest of Europe
- Asia Pacific (APAC)
- China
- Japan
- India
- Australia
- South Korea
- Rest of APAC
- Rest of the World
- MEA
- SAM
Embedded Die Packaging Technology Market – Company Profiles
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Platform , Application , and Industry , Geography
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Australia, Canada, China, France, Germany, India, Italy, Japan, MEA, Mexico, Russian Federation, SAM, South Korea, United Kingdom, United States
Frequently Asked Questions
The growth of the embedded die packaging technology market is primarily attributed to growing demand for miniaturization of electronic devices. Moreover, the rising developments in embedded die packaging technology, thereby substantially driving the embedded die packaging technology market.
The embedded die packaging technology has a huge opportunity in the smartphone and tablet market to offer advanced processors, transmitters, and other components. Embedded die packaging technology enhances the device performance and provides better space utilization solutions. A few market players are developing ICs and other components using the embedded die packaging technology, while for others, it is an excellent opportunity to innovate new solutions for smartphones and tablets. For instance, market players such as AT&S, SHINKO, and ASE Group offer the embedded die packaging technology for smartphones. The rising consumption of smartphones is a major supporting factor for the market growth in coming years. To grab a leading position, companies need to develop new processors with compact size and high-performance level. According to Ericsson, in 2016, almost 4 billion mobile connections were present in Asia Pacific, and are expected to reach 4.6 billion by 2021. Increasing demand in Asia Pacific alone shows the potential for embedded die packaging technology in the smartphone industry.
The embedded die packaging technology market is led by IC package substrate segment with highest share and is expected to dominate in the forecast period. In the semiconductor industry, ICs (integrated circuit) are using embedded die packaging technology to reduce the size and enhance the performance. In the IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefit—such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. The IC package substrate platform in embedded die packaging technology is used for a wide range of applications, such as MOSFET, regulator, DCDC, audio, sensor, optical, connectivity, memory, and image module.
The List of Companies - Embedded Die Packaging Technology Market
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- INFINEON TECHNOLOGIES AG
- Microsemi
- SCHWEIZER ELECTRONIC AG
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Taiwan Semiconductor Manufacturing Company, Limited
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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