Redistribution Layer Material Market Size, Growth & Analysis 2030

Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Global and Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application {Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others]}

Publication Month : Oct 2023

  • Report Code : TIPRE00002904
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 161
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[Research Report] The redistribution layer material market size is expected to grow from US$ 192.39 million in 2022 to US$ 460.15 million by 2030; it is estimated to record a CAGR of 11.5% from 2022 to 2030.

Market Insights and Analyst View:

The advanced packaging process starts at the die level, where the objective is always to lessen the die sizes without compromising the input-output (I/O) density. Several other budding packaging technologies play a key role in the heterogeneous integration of devices. Wafer-level fan-out packaging (WLFO) is one of the major packaging technologies that has emerged as a comprehensive packaging process. The WLFO process earlier had only single-die designs, i.e., a single redistribution layer (RDL) on one side of a reconstituted wafer. RDL acts as a crucial step in advanced wafer packaging. RDL serves as a rerouting of the I/O layout and allows a higher I/O number. A high I/O density usually creates better electrical performance, as more outputs result in faster electrical signals between the die and minimize the risk posed by electrical shorts. Besides, a higher I/O density enables the package to achieve better performance simultaneously. Moreover, the Asia's strategic location as a global manufacturing hub, coupled with competitive production costs, has attracted multinational corporations looking to optimize their supply chains. This has created a robust ecosystem for the redistribution layer material market, with various suppliers and manufacturers establishing a presence in the region. This factor is significantly driving the global redistribution layer material market growth.

Growth Drivers and Challenges:

Redistribution layer (RDL) materials are fundamental in enabling the miniaturization of semiconductor packages, which is essential to accommodate the increasing complexity of AI devices. The quest for more advanced AI capabilities necessitates the development of compact and densely integrated hardware components. As AI systems become more sophisticated, the demand for smaller and more efficient components grows. Thus, the growing demand for AI-based equipment and tools is driving the redistribution layer material market. Furthermore, the global redistribution layer material market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication. The ever-expanding production needs of the automotive industry propel the growth of the market. According to the ISEAS-Yusof Ishak Institute, Southeast Asia is an important automobile production base. Southeast Asia is the seventh largest automotive manufacturing hub worldwide and produced 3.5 million vehicles in 2021. However, fluctuations in raw material prices pose a significant challenge to the growth of the global redistribution layer material market. These price changes can have a significant impact on the industry, affecting production costs, pricing strategies, and overall market stability. One of the key issues is the dependency on imported raw materials. Many essential components for redistribution layer materials, such as specialized polymers, metals, and chemicals, are often sourced from international suppliers.

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Redistribution Layer Material Market: Strategic Insights

redistribution-layer-material-market
Market Size Value inUS$ 192.39 million in 2022
Market Size Value byUS$ 460.15 million by 2030
Growth rateCAGR of 11.5% from 2022 to 2030
Forecast Period2022-2030
Base Year2022
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Report Segmentation and Scope:

The global redistribution layer material market is bifurcated on the basis of type and application. Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. Geographically, the market is categorized into North America (US, Canada, and Mexico), Europe (Germany, France, Italy, UK, Russia, and Rest of Europe), Asia Pacific (Australia, China, Japan, India, South Korea, and Rest of Asia Pacific), Middle East & Africa (UAE, Saudi Arabia, South Africa, and Rest of Middle East & Africa), and South & Central America (Brazil, Argentina, and Rest of South & Central America).

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Segmental Analysis:

Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest market share in 2022. Polyimides are polymer-based thermoplastics with a high melt viscosity and require higher pressures for forming molded parts. Polyimides offer good chemical resistance, high mechanical strength, higher thermal stabilities, and exceptional electrical properties. For the IC packaging methods, polyimides are used as high-temperature adhesives, mechanical stress buffers, and as a film supporting the micro-sized circuitry. The only drawback with polyimides used was higher cure temperatures, while packaging demands lower cure temperatures. Several material suppliers have thus focused on providing polyimides with lower cure temperatures. PI is majorly used in all the flip-chip wafer bumping and WLP applications. Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging [high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others]. The redistribution layer material market share of the 2.5D/3D IC packaging segment was notable in 2022. The increased costs of lithography steps and wafer processing in general at the next-generation silicon nodes are driving the industry to find alternatives to improve the performance and functionality of electronic devices. Additionally, the need to integrate disparate technologies such as logic, memory, RF, and sensors in small form factors is driving the industry toward 3D integration as a solution. 

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Regional Analysis:

The redistribution layer material market is segmented into five key regions—North America, Europe, Asia Pacific, South & Central America, and the Middle East & Africa. Asia Pacific dominated the global redistribution layer material market, which accounted for ∼US$ 150 million in 2022. North America is also a major contributor, holding a significant global redistribution layer material market share. The North America redistribution layer material market is expected to reach over US$ 60 million by 2030. Europe is anticipated to record a considerable CAGR of over 10% from 2022 to 2030. The Asia Pacific redistribution layer material market, by country, is segmented into Australia, China, India, Japan, South Korea, and the Rest of Asia Pacific. The market is driven by the growing demand for redistribution layer material by the automotive and telecommunication industries. Taiwan dominates the regional market, followed by countries such as China, South Korea, Japan, and Vietnam. The region is considered a global manufacturing hub owing to the presence of diverse manufacturing industries. With China’s evolution into a high-skilled manufacturing hub, developing countries such as India, South Korea, Taiwan, and Vietnam are attracting several businesses that plan to relocate their low to medium-skilled manufacturing facilities to neighboring countries, which results in reduced labor costs.

Industry Developments and Future Opportunities:

Various initiatives taken by key players operating in the redistribution layer material market are listed below:

  1. In August 2022, ASE Technology hosted a ceremony for the construction of a new semiconductor assembly and testing facility in Penang, Malaysia. The new facility at ASE Malaysia (ASEM) will comprise two buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
  2. In July 2021, DuPont Mobility & Materials announced its plan to invest US$ 5 million in capital and operating resources at its manufacturing facilities in Germany and Switzerland to increase capacity for its high-performance automotive adhesives.

COVID-19 Pandemic Impact:

The COVID-19 pandemic adversely affected almost all industries in various countries. Lockdowns, business shutdowns, and travel restrictions in North America, Europe, Asia Pacific (APAC), South & Central America (SAM), and the Middle East & Africa (MEA) hampered the growth of several industries, including the chemical & materials industry. The shutdown of manufacturing units disturbed global supply chains, manufacturing activities, delivery schedules, and essential and nonessential product sales. Various companies reported delays in product deliveries and a slump in their product sales in 2020. Due to the pandemic-induced economic recession, consumers became cautious and selective in purchasing decisions. Consumers significantly reduced nonessential purchases due to lower incomes and uncertain earning prospects, especially in developing regions. Many redistribution layer material manufacturers reported declining profits due to reduced consumer demand during the initial phase of the pandemic. However, by the end of 2021, many countries were fully vaccinated, and governments announced relaxation in certain regulations, including lockdowns and travel bans. There has been a rise in disposable income of the population, due to which the focus on purchasing new furniture and renovation has increased, which boosted the demand for redistribution layer materials. All these factors boost the growth of the redistribution layer material market across different regions.

Competitive Landscape and Key Companies:

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd., NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are among the prominent players operating in the global redistribution layer material market. These players offer high-quality redistribution layer material and cater to many consumers across the world.

Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

Type, and Application

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

Frequently Asked Questions


What are the key drivers for the growth of the global redistribution layer material market?

The growing demand for AI-based equipment and tools is significantly impacting the redistribution layer material market. The quest for more advanced AI capabilities necessitates the development of more compact and densely integrated hardware components. Redistribution layer (RDL) materials are fundamental in enabling the miniaturization of semiconductor packages, which is essential to accommodate the increasing complexity of AI devices. As AI systems become more sophisticated, the demand for smaller and more efficient components grows.

What is the largest region of the global redistribution layer material market?

Asia Pacific accounted for the largest share of the global redistribution layer material market. Asia Pacific is one of the most significant regions for the redistribution layer material market owing to drastic increase in the demand for semiconductors.

Based on the application, which segment is projected to grow at the fastest CAGR over the forecast period?

Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging [high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others]. The redistribution layer material market share of the 2.5D/3D IC packaging segment was notable in 2022. The increased costs of lithography steps and wafer processing in general at the next-generation silicon nodes are driving the industry to find alternatives to improve the performance and functionality of electronic devices.

Based on type, why the polyimide (PI) segment accounted for the largest revenue share in 2022?

Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest market share in 2022. Polyimides are polymer-based thermoplastics with a high melt viscosity and require higher pressures for forming molded parts. Polyimides offer good chemical resistance, high mechanical strength, higher thermal stabilities, and exceptional electrical properties. For the IC packaging methods, polyimides are used as high-temperature adhesives, mechanical stress buffers, and as a film supporting the micro-sized circuitry.

Can you list some of the major players operating in the global redistribution layer material market?

The major players operating in the global redistribution layer material market are SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd., NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd.

What are the opportunities for redistribution layer material in the global market?

The Internet of Things (IoT) market across the globe has gained considerable popularity recently, with businesses acknowledging the significance of connectivity. IoT has enabled each device to be connected to the Internet. According to the International Data Corporation (IDC), 41.6 billion IoT devices will be in 2025, capable of generating 79.4 zettabytes (ZB) of data. This exponential increase in data traffic over the internet is due to the increasing penetration of smartphones and other consumer electronics that can be connected to the internet due to the rising popularity of IoT.

The List of Companies - Redistribution Layer Material Market

  1. SK Hynix Inc
  2. Samsung Electronics Co Ltd
  3. Infineon Technologies AG
  4. Dupont De Nemours Inc
  5. Fujifilm Holdings Corp
  6. Amkor Technology Inc
  7. ASE Technology Holding Co Ltd.
  8. NXP Semiconductors NV
  9. JCET Group Co Ltd
  10. Shin-Etsu Chemical Co Ltd

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • 3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • 3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • 3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • 3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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