Semiconductor Bonding Market Size, Share | Global Trends 2028

Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Technology (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)

Publication Month : Oct 2022

  • Report Code : TIPRE00029751
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 154
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The semiconductor bonding market was valued US$ 669.48 million in 2022, it is estimated to grow at a CAGR of 8.2% from 2022 to 2028.

The growing demand for semiconductor products, such as chips, from the automotive & industrial sectors, is expected to bolster the growth of the semiconductor bonding market. The automotive market registered a growth of 34.9% in 2021. Further, wireless communications, dominated by smartphones, had a growth of 24.6%. According to the Semiconductor Today data, the number of 5G handsets produced grew from 251 million units in 2020 to 556 million in 2021. Further, the rising demand for wearables, smartphones, and 5G services is anticipated to fuel the semiconductor bonding market growth over the forecast period.

According to the EU report, Europe aims to produce the next generation of leading-edge chips (2nm) by 2030. European semiconductor companies such as Infineon Technologies and ASML Holding are investing heavily in research and development to develop advanced semiconductor bonding solutions. Further, the growing number of European startups in semiconductor bonding is expected to provide new opportunities for digital technologies in the semiconductor industry. Moreover, the growing adoption of electric vehicles across European countries, with support from the government’s green initiatives, is expected to contribute to the semiconductor bonding market growth. For instance, the UK government has set an aim for all electric vehicles by 2030 to support environmental sustainability standards.

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Semiconductor Bonding Market: Strategic Insights

semiconductor-bonding-market
Market Size Value inUS$ 669.48 Million in 2022
Market Size Value byUS$ 1,076.82 Million by 2028
Growth rateCAGR of 8.2% from 2022 to 2028
Forecast Period2022-2028
Base Year2022
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Impact of COVID-19 Pandemic on Europe Semiconductor Bonding Market Growth

The Europe semiconductor bonding market was significantly hampered during the COVID-19 pandemic in the second quarter of 2020. The sales of semiconductors and motor vehicles fell during the second quarter of 2020; this shortfall in sales was more than offset by an increased need for computer and electronic equipment due to the shift to remote working and learning norms. Europe is home to various leading automakers such as Mercedes, Volkswagen, Skoda, BMW, and Audi. The automotive sector in Europe was severely affected due to delays in reopened assembly plants by original equipment manufacturers (OEMs), a shortage of semiconductors, and reduced vehicle sales. Thus, the shortage of semiconductor chips and shipping disruptions hampered the operations of automotive part suppliers and the delivery of semiconductor technology equipment.

The development and production of semiconductor bonding components in Europe mainly occur in Germany, France, Italy, the Netherlands, Belgium, Austria, and Ireland. European companies supply semiconductor products, including chips and wafer ICs, to the automotive, industrial automation, security, healthcare, aeronautics, energy production, and telecommunication sectors. For instance, the growing initiatives for the development of the 5G network across European countries are also expected to bolster the Europe semiconductor bonding market growth.

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Market Insights – Semiconductor Bonding Market

Rising Adoption of Stacked Die Technology in IoT Devices

The usage of stacked die significantly enhances the design processes of semiconductors. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live-tracking IoT gadgets are not available in large sizes. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market.

OEMs operating in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications, such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In IoT devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates, which will lead to the growth of the semiconductor bonding market.

Type-Based Insights – Semiconductor Bonding Market

Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment accounted for the largest share of the market in 2021.

The demand for wafer bonders is high due to the increasing need for stable joining and bonding of two substrates in industrial applications. Wafer bonding is one of the fastest solutions to fabricate multiple III–V lasers on Si material in a parallel system. The growing demand for consumer electronic devices such as smartphones, smart wearables, smart lighting, and other RF devices is one of the major factors generating new opportunities for market vendors for wafer semiconductor bonding applications.

The market is segmented on the basis of type, application, and geography. Based on type, the semiconductor bonding market size is segmented into die bonder, wafer bonder, and flip chip bonder. Based on application, the semiconductor bonding market analysis is categorized into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. Based on geography, the semiconductor bonding market size is primarily segmented into North America, Europe, Asia Pacific (APAC), the Middle East & Africa (MEA), and South America. In 2021, APAC held the largest semiconductor bonding market share and is expected to retain its dominance during the forecast period. The region is also expected to register the highest CAGR in the global semiconductor bonding market during the forecast period.

Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few key semiconductor bonding market players.

The semiconductor bonding market players focus on developing advanced and efficient systems. For instance:

  • In April 2021, ASM Pacific Technology introduced three new production processes utilizing X-Micro Celeprint's Transfer Publishing and ASM AMICRA's good reproducibility die bonding technology to enable significant intensity diverse incorporation of ultra-thin dies up to 300 mm base wafer.
  • In September 2021, Palomar Technologies launched a new Palomar 3880-II Die Bonder.
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

Type and Application

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

Argentina, Australia, Brazil, Canada, China, France, Germany, India, Italy, Japan, Mexico, Russia, Saudi Arabia, South Africa, South Korea, UAE, UK, US

Frequently Asked Questions


What is the estimated global market size for the semiconductor bonding market in 2021?

The global semiconductor bonding market was valued at US$ 620.8 Mn in 2021

What are the driving factors impacting the global semiconductor bonding market?

The key driving factors impacting semiconductor bonding market growth includes:
• Rising Adoption of Stacked Die Technology in IoT Devices
• Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions

Which are the key players holding the major market share of semiconductor bonding market?

The key players of semiconductor bonding market are encompassed with Palomar Technologies, Panasonic Corporation, Toray Industries Inc, Kulicke and Soffa Industries, Inc., HUTEM, DIAS Automation (HK) Ltd, ASMPT Ltd (formerly ASM Pacific Technology Ltd.), EV Group, Yamaha Motor Corporation (Yamaha Robotics Holdings), and WestBond, Inc.

Which is the fastest growing regional market during the forecast period?

APAC is the fastest-growing regional market in the global semiconductor bonding market between 2022-2028.

Which countries are registering a high growth rate during the forecast period?

Canada, France, rest of APAC, South Korea, the UAE, and Brazil are the countries registering high growth rate during the forecast period.

Which is the leading component segment in the semiconductor bonding market?

The wafer bonder segment led the global semiconductor bonding market in 2021.

The List of Companies - Semiconductor Bonding Market

  1. Palomar Technologies
  2. Panasonic Corporation
  3. Toray Industries Inc
  4. Kulicke & Soffa Industries, Inc.
  5. HUTEM
  6. DIAS Automation (HK) Ltd
  7. ASMPT Ltd (formerly ASM Pacific Technology Ltd.)
  8. EV Group
  9. Yamaha Motor Corporation (Yamaha Robotics Holdings)
  10. WestBond, Inc.

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • 3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • 3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • 3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • 3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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