Substrate-like PCBs (SLPs) are seen as the next step in the evolution of high-end high-density interconnector PCBs. The existing HDI PCB technology will be replaced by substrate-like PCB technology. It’s still a stiff PCB, but the manufacturing process is more closely aligned with semiconductor requirements. The Substrate-like PCB currently requires 30/30UM line width/line spacing, however, […]
