With CAGR of 17.8% , Substrate-Like PCB Market is projected to reach US$ 4,718.6 million by 2028.

Substrate-like PCBs (SLPs) are seen as the next step in the evolution of high-end high-density interconnector PCBs. The existing HDI PCB technology will be replaced by substrate-like PCB technology. It’s still a stiff PCB, but the manufacturing process is more closely aligned with semiconductor requirements. The Substrate-like PCB currently requires 30/30UM line width/line spacing, however, the production technique, raw materials, and design plan have yet to be defined.

AT&S, Unimicron, Compeq, Meiko and Zhen Ding – Prominent Market Participants In Substrate-Like PCB Market

 The substrate-like PCB market is growing because of the increasing acceptance of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices. The market for substrate-like PCBs is also growing due to the demand for downsizing and effective connectivity solutions. The current market is primarily reliant on the rise of high-end smartphones. According to industry analysts, there is a growing emphasis on shrinking electronic packaging to minimize power consumption and improve functionality. All of the miniaturized components must be organized in a small space, which is impossible to do on traditional printed circuit boards (PCBs). This constraint is driving the demand for substrate-like PCBs.

AT&S, Unimicron, Compeq, Meiko and Zhen Ding are some of the key market players operating in the global substrate-like PCB market. The listing of key players is derived by considering multiple factors such as overall revenue, current substrate-like PCB product portfolio, geographical reach, new product launches, market initiatives, investment in technology up-gradation, partnerships, and other market-related activities. In addition to these players, there are several other important players operating in the substrate-like PCB ecosystems which were studies analyzed during the course of this market research study, such as DAEDUCK ELECTRONICS Co., Ltd.; IBIDEN; KINSUS INTERCONNECT TECHNOLOGY CORP; Korea Circuit; SAMSUNG ELECTRO-MECHANICS; TTM Technologies Inc.;

Most of the market initiatives were observed in APAC region, which have a high potential of market-related products, solutions, and services. Few of the important market initiatives from the industry are mentioned below: