The Insight Partners
Electronics and Semiconductor

3D Measurement Sensors in Logistics: The Key to Efficiency and Accuracy

3D measurement sensors are used to obtain information electronically and use this data to improve the interfaces between humans, devices, and the world. These sensors work on 3D sensing technology, which uses near-infrared light reflection, photography, geometric principles, and advanced computing power to enable machines to acquire the details about people and objects, which can be further processed in meaningful information. The demand for 3D measurement sensors is witnessing tremendous growth as they are used in warehouse and logistic operations to increase efficiency. In warehouses, the sensors are used for order fulfilment as they help in monitoring product damage and other non-conformances more effectively, thus boosting the growth of the 3D measurement sensors in logistics market.

Micro-Epsilon Messtechnik GmbH & Co KG, Infineon Technologies AG, Sony Semiconductor Solutions Corp, Cognex Corp, Sick AG –Prominent Market Participants in 3D Measurement Sensors in Logistics Market

The demand for measurement sensors is increasing in the logistics industry worldwide as these sensors help to track the movement of goods within a warehouse. In addition, these sensors also help the companies to identify bottlenecks and optimize their warehouse layout as per the needs, driving the growth of the 3D measurement sensors in logistics market. Also, with the growing e-commerce industry, the logistics sector is growing tremendously. This growth is raising the need for automation to further enhance operational efficiency by providing real-time data through machine vision, asset tracking, data capture scanning, and object dimensioning, which is expected to boost the market growth during the forecast period. Furthermore, the use of 3D measurement sensors in robotics is increasing as the sensors help robots to be more aware of their surroundings, which can help them to efficiently perform pick-and-grasp operations in the warehouse, creating an opportunity for the growth of the 3D measurement sensors in logistics market.

APAC is expected to register the highest CAGR from 2022 to 2030. The APAC 3D measurement sensors in logistics market is witnessing tremendous growth due to the growing e-commerce in the region. Per the International Air Transport Association (IATA), APAC dominates the growth of the e-commerce market globally, with China generating ~50% of the world’s transactions. This growth in e-commerce creates the need for more warehouses in the region, which is expected to fuel the growth of the 3D measurement sensors in logistics market. In addition, the region is one of the largest producers of semiconductors. Countries other than China and Taiwan in the region have witnessed tremendous growth in semiconductor production and shipments. According to US Census data, the semiconductor shipments to the US have increased 34 times from India and 698% from Cambodia in 2022. Thus, the growing semiconductor industry is expected to further boost the 3D measurement sensors in logistics market growth during the forecast period.

The key players operating in the 3D measurement sensors in logistics market are Micro-Epsilon Messtechnik GmbH & Co KG, Infineon Technologies AG, Sony Semiconductor Solutions Corp, Cognex Corp, ifm Electronic GmbH, Intel Corp, LMI Technologies Inc, Keyence Corp, OMRON Corp, and Sick AG. The above listing of key players is derived by considering multiple factors such as overall market insights, dynamic trends, revenue, current general aviation portfolio, new product launches, market initiatives, investment in technology up-gradation, mergers & acquisitions, and other joint activities. A few of the important market initiatives and product developments from the industry are mentioned below:

Year News Country
2023 LMI Technologies Inc. released a new GoPxL IIOT vision inspection software platform that helps to build custom HMIs for displaying and reporting Gocator sensor data on PC, touchscreen, or mobile device. North America
2020 Infineon Technologies AG completed the acquisition of Cypress Semiconductor Corporation. The acquisition tends to offer customers the industry’s most comprehensive portfolio for linking the real with the digital world and shaping digitalization. Europe
2019 The SICK group completed its takeover of the Chilean joint venture SICK SpA by transferring the outstanding 50 percent of shares from the owning family Schädler in the joint venture. SICK has become the sole owner of SICK SpA as a result of this takeover, thereby strengthening its position in the South American market. Europe

 

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