IoT Sensors Market

IoT Sensors Market Grow at a CAGR of 23.9% to Account US$ 65.79 Billion by 2027

ROBERT BOSCH GMBH, BROADCOM, INC., TEXAS INSTRUMENTS INCORPORATED – PROMINENT MARKET PARTICIPANTS IN IOT SENSORS MARKET

The IoT sensors market is highly competitive in nature with considerable number of players capturing major share of the overall sales revenue. Most of the companies operating in the IoT sensors market are present globally and have wide distribution and sales network through partnerships or authorized dealers.

The key market players in IoT sensors market are Analog Devices, Inc., ARM Holdings PLC, Broadcom, Inc., Honeywell International, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Omron Corporation, Robert Bosch Gmbh, STMicroelectronics N.V., and Texas Instruments Incorporated among others.

Market leaders are involved in extensive IoT sensors market research for the development of new products with advanced technology. Many well-known as well as small local companies are present in the market to provide diversified product to its customers. The larger firms are adopting the strategy of partnership, contractual alliances for the deployment of new technological solutions to enhance its product portfolio and expand its footprint in different geographies. Few on the important market initiative from are mentioned below:

Year News Region
2019 TI unlocked mmWave technology for worldwide industrial market through new 60-GHz sensor portfolio. The newest 60-GHz mmWave sensors will be the first to include antenna-on-package offerings, which remove traditional challenges associated with radio-frequency (RF) design while shrinking size up to 75% and reducing overall cost. North America
2019 Texas Instruments (TI) introduced a new temperature sensor family that offers ±0.1°C accuracy across a wide temperature range and helps simplify system design for industrial and medical applications. North America
2018 Broadcom Inc. Completed Acquisition of CA Technologies. This acquisition strengthens Broadcom’s position as a leading provider of semiconductor and infrastructure software solutions and enables to better serve customers North America
2018 Bosch announced the start of construction of new 300mm Wafer Fab in Dresden. This facility will meet the growing requirement of innovative semiconductors for electro-mobility and automated driving functions. Europe
2018 Bosch introduced four new system-ICs at electronica 2018 in Munich, Germany. These chip are used in electric vehicles for shutting off the power during accident, and guarantee the safety of passengers and driver. Europe

 

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