EMEA and APAC Solder Materials Market is expected to reach US$ 6.72 billion by 2030

Rising Demand from Telecommunication and Automotive Industries Propels EMEA and APAC Solder Materials Market Growth

According to the latest market study on “EMEA and APAC Solder Materials Market Forecast to 2030 – Regional Share, Trend, and Growth Opportunity Analysis – by Product and Process,” the market was valued at US$ 4.73 billion in 2022 and is projected to reach US$ 6.72 billion by 2030; it is anticipated to record a CAGR of 4.5% from 2022 to 2030. The report highlights key factors contributing to the EMEA and APAC solder materials market size and prominent players, along with their developments in the market.

Solder is a metal alloy and is made mostly of tin and other metals such as lead, copper, silver, or antimony. Additional metals are added to pure tin to either alter the melting point or enhance the alloy. Solder preforms are widely used in industries ranging from PCB assembly to high-end power semiconductor packages and other industrial applications. The breadth of the product line mainly includes fluxed and unfluxed rectangles, sleeves, washers, and custom shapes for specific applications. An all-encompassing alloy portfolio includes high-reliability, standard assembly, and low melting point alloys. The use of tape, along with reel packaging, provides ease of implementation into standard SMT manufacturing lines. Solder preforms integrate PCBs into higher-level assemblies, power semiconductor packages, and many other soldering operations.

EMEA and APAC Solder Materials Market Breakdown – by Region

The EMEA and APAC solder materials market trends include the rising demand from the telecommunication and automotive industries. The telecommunication industry is evolving rapidly, particularly with the deployment of 5G technology. According to the GSM Association, 5G networks are likely to cover one-third (1.2 billion) of the world's population by 2025. There is a widespread rollout of 5G networks across the globe, which has led to an increased demand for smartphones and other consumer electronics. For instance, in October 2021, AIS and Samsung jointly launched a voice-over 5G radio service enabling voice calls on AIS's 5G standalone (SA) network in Thailand. Samsung Electronics and Viettel announced the launch of 5G commercial trials in Da Nang, Vietnam, in December 2021. In addition, according to Viavi Solutions Inc.'s report, in April 2023, over 92 countries across the world launched 5G networks. Further, 23 countries have pre-commercial 5G network trials underway, and 32 nations have announced their 5G rollout plans. The widespread rollout of 5G networks has led to an increased demand for smartphones and other consumer electronics products. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in solder materials, ensuring long-term reliability and avoiding costly repairs and field failures.

The ever-expanding production needs of the automotive industry propel the growth of the market. They registered the production of over 17.7 million commercial vehicles and passenger cars in 2022, an increase from 16.1 million commercial vehicles and passenger cars in 2021. As vehicles increasingly rely on advanced electronics for safety, entertainment, and autonomous capabilities, the demand for semiconductors has soared. Solder materials are used for wire harnesses, armatures, car electrical systems, and other parts required in the automotive industry. Therefore, the economic growth of the automotive and telecommunications sectors across the globe is driving the EMEA and APAC solder materials market growth.

The EMEA and APAC solder materials market analysis is carried out by identifying and evaluating key players in the market across different regions. Indium Corp, Fusion Inc, Element Solutions Inc, KOKI Co Ltd, Stannol GmbH & Co KG, AIM Metals & Alloys LP, Nihon Superior Co Ltd, GENMA Europe GmbH, and National Solder Co Ltd are among the key players profiled in the EMEA and APAC solder materials market report.

The report includes the segmentation of the EMEA and APAC solder materials market as follows:

The market is segmented on the basis of product and process. Based on product, the market is segmented into paste, bar, wire, spheres, and others. Based on process, the market is segmented into printer, laser, wave, reflow, and others. Based on product, the wire segment is estimated to hold the largest EMEA and APAC solder materials market share by 2030. The scope of the EMEA and APAC solder materials market report entails Europe (Germany, France, the UK, Italy, Russia, and the Rest of Europe), Asia Pacific (China, India, Japan, Australia, South Korea, and the Rest of Asia Pacific), and the Middle East & Africa (South Africa, Saudi Arabia, the UAE, and the Rest of Middle East & Africa).

Asia Pacific accounted for the largest EMEA and APAC solder materials market share in 2022 in terms of revenue. Electronics and semiconductor manufacturing in Asia Pacific has been a major driver of global trade. The increase in the number of on-fleet vehicles in Asian countries such as China, India, and South Korea propels the demand for PCBs and semiconductors. China is one of the high-skilled manufacturing hubs, whereas India, South Korea, and Taiwan are considered attractive business destinations for electronics companies looking for medium-skilled manufacturing infrastructure and low labor costs. As per the Semiconductor Industry Association study, ~75% of global semiconductor capacity is based in East Asia. Semiconductor companies will benefit from a cost advantage of 25% to 50% with the start of manufacturing activities in the region. These factors are driving the growth of the EMEA and APAC solder materials market.

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