Marktgröße und Marktanteil von Geräten zur Verarbeitung dünner Wafer bis 2025 – 2031
Thin Wafer Processing and Dicing Equipment Market Report Analysis
Thin Wafer Processing and Dicing Equipment Market
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CAGR (2025 - 2031)12.3% -
Market Size 2024
US$ XX million -
Market Size 2031
US$ XX Million
Report Coverage
- Market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
- Key future trends
- Detailed PEST/Porter’s Five Forces and SWOT analysis
- Industry landscape and competition analysis & recent developments
- Detailed company profiles
- Global and regional market analysis covering key market trends, major players, regulations, and recent market developments
Key Players
- Suzhou Delphi Laser Co. Ltd
- SPTS Technologies Limited
- Plasma-Therm LLC
- Han's Laser Technology Industry Group Co. Ltd.
- ASM Laser Separation International (ALSI) B.V.
- Disco Corporation
- Tokyo Seimitsu Co, Ltd. (Accretech)
- Neon Tech Co. Ltd.
- Nippon Pulse Motor Taiwan (NPMT)
Regional Overview
- North America
- Europe
- Asia-Pacific
- South and Central America
- Middle East and Africa
Market Segmentation
By Gerätetyp
- Dicing-Ausrüstung
- Blade-Dicing
- Laserablation
- Stealth-Dicing
- Plasma-Dicing
By Anwendung
- Speicher und Logik
- LED
- MEMS-Geräte
- Leistungsgeräte
- CMOS-Bildsensoren
- RFID
- Sonstiges
By Geographie
- Nordamerika
- Europa
- Asien-Pazifik
- Süd- und Mittelamerika
- Naher Osten und Afrika
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