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Southeast Asia Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00030090
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 117
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Análisis del alcance del informe de mercado de materiales de capa de redistribución del sudeste asiático y oportunidades para 2023-2030

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Southeast Asia Redistribution Layer Material Market Report Southeast Asia Redistribution Layer Material Market Size and Share Southeast Asia Redistribution Layer Material Market Scope and Analysis

Southeast Asia Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 54.51 Million
Market Size by 2030 US$ 150.11 Million
Global CAGR (2022 - 2030) 13.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By Tipo
  • Poliimida
  • Polibenzoxazol
  • Benzociclobuteno
By Aplicación
  • encapsulado a nivel de oblea en abanico
  • encapsulado de circuitos integrados 2
  • 5D/3D
Regions and Countries Covered Sudeste Asiático
  • Sudeste Asiático
Market leaders and key company profiles
  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc