sales@theinsightpartners.com
+1-646-491-9876 +44-20-8125-4005

Wafer Back Grinding Tape Market Scope And Analysis

  • Report Code : TIPRE00008035
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
Buy Now

Analyse de la dynamique et de la portée du marché des bandes de meulage arrière de plaquettes d'ici 2025-2031

Buy Now

Wafer Back Grinding Tape Market Report Wafer Back Grinding Tape Market Size and Share Wafer Back Grinding Tape Market Scope and Analysis

Wafer Back Grinding Tape Market Report Scope

Report Attribute Details
Market size in 2024 US$ XX million
Market Size by 2031 US$ XX Million
Global CAGR (2025 - 2031) 4.4%
Historical Data 2021-2023
Forecast period 2025-2031
Segments Covered By Type
  • durcissement UV
  • non UV
By Taille de la plaquette
  • 6 pouces
  • 8 pouces
  • 12 pouces
  • autres
By Géographie
  • Amérique du Nord
  • Europe
  • Asie-Pacifique
  • Amérique du Sud et centrale
  • Moyen-Orient et Afrique
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • AI Technology, Inc.
  • AMC Co., Ltd
  • Denka Company Limited
  • Force-One Applied Materials
  • FURUKAWA ELECTRIC CO., LTD.
  • LINTEC Corporation
  • Loadpoint
  • Mitsui Chemicals
  • NITTO DENKO CORPORATION