Emea And Apac Solder Materials Market Scope And Analysis

  • Report Code : TIPRE00039009
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 159
Buy Now

Analisi dell'ambito di mercato dei materiali per saldatura EMEA e APAC e dei concorrenti entro il 2023-2030

Buy Now

EMEA and APAC Solder Materials Market Report Scope

Report Attribute Details
Market size in 2022 US$ 4.73 Billion
Market Size by 2030 US$ 6.72 Billion
Global CAGR (2022 - 2030) 4.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By Prodotto
  • pasta
  • barra
  • filo
  • sfere
By Processo
  • stampante
  • laser
  • onda
  • riflusso
Regions and Countries Covered Medio Oriente e Africa
  • Sudafrica
  • Arabia Saudita
  • Emirati Arabi Uniti
  • resto del Medio Oriente e delAfrica
Asia-Pacifico
  • Cina
  • India
  • Giappone
  • Australia
  • resto delAsia-Pacifico
Market leaders and key company profiles
  • AIM Metals & Alloys LP
  • KOKI Co Ltd
  • Fusion Inc
  • Stannol GmbH & Co KG
  • National Solder Co (PTY) Ltd
  • Nihon Superior Co Ltd
  • GENMA Europe GmbH
  • Indium Corp
  • Element Solutions Inc