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Southeast Asia Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00030090
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 117
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Analisi dell'ambito di mercato e dei concorrenti dei materiali per strati di ridistribuzione nel Sud-est asiatico entro il 2023-2030

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Southeast Asia Redistribution Layer Material Market Report Southeast Asia Redistribution Layer Material Market Size and Share Southeast Asia Redistribution Layer Material Market Scope and Analysis

Southeast Asia Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 54.51 Million
Market Size by 2030 US$ 150.11 Million
Global CAGR (2022 - 2030) 13.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By Tipo
  • Poliimmide
  • Polibenzoxazolo
  • Benzociclobutene
By Applicazione
  • confezionamento a livello di wafer fan-out
  • confezionamento di circuiti integrati 2
  • 5D/3D
Regions and Countries Covered Asia sud-orientale
  • Asia sud-orientale
Market leaders and key company profiles
  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc