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Southeast Asia Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00030090
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 117
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2030년까지 동남아시아 재분배 레이어 소재 시장 점유율 및 규모 분석

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Southeast Asia Redistribution Layer Material Market Report Southeast Asia Redistribution Layer Material Market Size and Share Southeast Asia Redistribution Layer Material Market Scope and Analysis

Southeast Asia Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 54.51 Million
Market Size by 2030 US$ 150.11 Million
Global CAGR (2022 - 2030) 13.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By 유형
  • 폴리이미드
  • 폴리벤조옥사졸
  • 벤조사이클로부텐
By 응용 분야
  • 팬아웃 웨이퍼 레벨 패키징
  • 2 5D/3D IC 패키징
Regions and Countries Covered 동남아시아
  • 동남아시아
Market leaders and key company profiles
  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc