Embedded Die Packaging Technology Market is expected to reach US$ 242.80 Mn in 2028

Growing Demand for Miniaturization of Electronic Devices to Provide Growth Opportunities for Embedded Die Packaging Technology Market

According to our latest market study on “Embedded Die Packaging Technology Market Forecast to 2028 – COVID-19 Impact and Global Analysis – by Platform, Application, Industry Vertical, and Geography,” the market was valued at US$ 63.40 million in 2020 and is projected to reach US$ 242.80 million by 2028; it is expected to grow at a CAGR of 18.6% during the forecast period of 2021 to 2028.

Growing trend of the small form factor based handheld electronic devices is one of the major factors, which is accelerating the market growth. The technological advancements in electronics manufacturing, such as miniaturization, have influenced various markets, including military, aerospace, medical, media, retail, and consumer electronics. The devices with small form factor-based packages embed more functionality. They are becoming an alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphones, compact PCs, and other devices are designed with embedded die packaging technology-based components, such as processor, sensors, RF modules, and others. Continuous developments in advanced packaging technologies, such as IC package substrate and flexible board, are further boosting the device performance by resolving the technical challenges. This, in turn, is driving the embedded die packaging technology market.

Geographically, Asia Pacific held the largest share of the embedded die packaging technology market in 2020, followed by North America and Europe. Further, North America is projected to witness the highest growth rate during the forecast period. The embedded die packaging technology market is segmented into platform, application, industry vertical, and geography. Based on platform, the embedded die packaging technology market is further categorized into IC package substrate, rigid board, and flexible board. Based on application, the embedded die packaging technology market is further segmented into smartphones & tablets, medical and wearable devices, industrial devices, and security devices. Based on industry, the embedded die packaging technology market is further segmented into automotive, healthcare, consumer electronics, IT & telecommunication, and others.

Impact of COVID-19 Pandemic on Embedded Die Packaging Technology Market

The COVID-19 pandemic has hampered the semiconductor industry and economic growth of almost every country. The semiconductor industry took a major hit as the demand for electronics components from every industrial sector and end consumers was reduced. The revenue model for microelectronics has declined as there was no mass production during the lockdown period. Post-lockdown, the semiconductor industry started to regain the market share as production facilities restarted their operations, with preventive measures. In addition, work from home and remote monitoring strategies also helped to increase the sale of advanced electronics products for better connectivity. According to the Semiconductor Industry Association (SIA), the COVID-19 pandemic created a major impact on the semiconductor industry for the first half of the year 2020, while in third quarter worldwide sales increased by around 11%.

ASE Group; Microsemi; General Electric Company; Taiwan Semiconductor Manufacturing Company, Limited; Fujikura Ltd.; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; Amkor Technology, Inc.; Infineon Technologies Ag; and AT & S Austria Technologie & Systemtechnik Aktiengesellschaft are among the few major companies operating in the embedded die packaging technology market.

Embedded Die Packaging Technology Market – by Geography, 2020

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Embedded Die Packaging Technology Market to Grow at a CAGR of 18.6% to reach US$ 242.80 Million from 2021 to 2028

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Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphones and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries), Geography

The embedded die packaging technology market has been segmented as follows:

Embedded Die Packaging Technology Market – by Platform

• IC Package Substrate
• Rigid Board
• Flexible Board

Embedded Die Packaging Technology Market – by Application

• Smartphones and Tablets
• Medical and Wearable Devices
• Industrial Devices
• Security Devices
• Other Applications

Embedded Die Packaging Technology Market – by Industry

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Other Industries

Embedded Die Packaging Technology Market – by Region

• North America
  • US
  • Canada
  • Mexico
• Europe
  • UK
  • Germany
  • France
  • Italy
  • Russia
  • Rest of Europe
• Asia Pacific (APAC)
  • China
  • Japan
  • India
  • Australia
  • South Korea
  • Rest of APAC
• Rest of the World
  • MEA
  • SAM