Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphones and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries), Geography

Publication Month: Mar 2021 | Report Code: TIPRE00004132 | No. of Pages: 158 | Category: Electronics and Semiconductor | Status: Published

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The embedded die packaging technology market was valued at US$ 63.40 million in 2020 and is projected to reach US$ 242.80 million by 2028. The embedded die packaging technology market is expected to grow at a CAGR of 18.6% during the forecast period of 2021 to 2028.

 

Electronics devices are evolving at a rapid rate with the integration of more electronic components in circuit boards for advanced features. The devices are getting more compact in size with advanced packaging technology to offer enhanced control and space saving for customers. Miniaturization of electronic devices to optimize space in final devices is augmenting the market growth. Advent of Internet of things (IoT)-connected devices has increased the demand for embedded die packaging technology to integrate more IoT components in the same space. In addition, the growing adoption of smartphones and smart wearables is further supplementing the market growth. Smartphones and smart wearables are being designed using the embedded die packaging technology to optimize the available space for integrating more components. 

 

Increasing adoption of compact electronics gadgets having internet connectivity is supporting the embedded die packaging technology to integrate maximum parts in a single package. The global embedded die packaging technology market is segmented based on platform, application, industry vertical, and geography. Based on platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board. In terms of application, the embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, and security devices. Based on industry, the embedded die packaging technology market is segmented as automotive, healthcare, consumer electronics, IT & telecommunication, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific (APAC), and Rest of the World.

 

Impact of COVID-19 Pandemic on Embedded Die Packaging Technology Market

The COVID-19 pandemic has hampered the semiconductor industry and economic growth of almost every country. The pandemic has severely impacted the manufacturing sector due to shutdown of facilities for a certain period. Sales of various industrial products, such as automotive cars and electronics, was declined. Office premises, public places, schools, transportation, and other spaces also remained closed which declined market growth owing to low sale. The semiconductor industry took a major hit as the demand for electronics components from every industrial sector and end consumers was reduced. The revenue model for microelectronics has declined as there was no mass production during the lockdown period. Post-lockdown, the semiconductor industry started to regain the market share as production facilities restarted their operations, with preventive measures.

 

Lucrative Regions in Embedded Die Packaging Technology Market

Lucrative Regions in Embedded Die Packaging Technology Market

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Embedded Die Packaging Technology Market Insights

Growing Demand for Miniaturization of Electronic Devices

Electronics gadgets are being developed using small form factor electronic components to enhance the space and improve the final product design. Customers are preferring compact, small-sized handheld electronic devices offering maximum features. To enhance user experience, companies are developing miniaturized electronics to integrate maximum components on a single die. Integrating maximum number of components, such as sensors and processor, in a single die offers enhanced features for customers. Rising techno savvy population is one the major factors for the miniaturization of electronics as it has created stiff competition in market players to offer maximum number of features in a single device.

 

Platform-Based Market Insights

Packaging technology has evolved rapidly to enhance the packaging of small electronic components in a single die to optimize the space in the final device. In IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefits, such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. In terms of platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board.

 

Embedded Die Packaging Technology Market, by Platform – 2020 and 2028

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Source: The Insight Partners Analysis

Note: Inner circle represents market size for 2020 and outer circle represents 2028.

 

Application-Based Market Insights

In terms of application, the global embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, security devices, and others. The emerging need of microelectronics from various industry verticals, including automotive, healthcare, and consumer electronics, for small-form factor-based applications are supporting the market growth. Growing trend of size reduction and improving functionality of electronic devices are boosting the adoption of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in a smartphone design, as manufacturers are urging for a new solution to take the minimum space possible.

 

Industry-Based Market Insights

Based on industry, the global embedded die packaging technology is segmented into consumer electronics, it and telecommunication, automotive, healthcare, and others. Rise in adoption of smart devices and connected vehicles has increased the need for IoT devices developed by advanced packaging technology. In addition, smart wearables are playing a major role in human health monitors. Increasing demand for small electronics devices in the healthcare industry is supporting the market growth.

 

Strategic Insights

Players operating in the embedded die packaging technology market focus on strategies such as market initiatives, acquisitions, and product launches to maintain their positions in the market. A few developments by key players of the embedded die packaging technology market are:

 

  • In August 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea.

 

  • In August 2020, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) launched new 3D silicon tacking and advanced packaging technology.

 

The embedded die packaging technology market has been segmented as follows:

Embedded Die Packaging Technology Market – by Platform

  • IC Package Substrate
  • Rigid Board
  • Flexible Board

Embedded Die Packaging Technology Market – by Application

  • Smartphones and Tablets
  • Medical and Wearable Devices
  • Industrial Devices
  • Security Devices
  • Other Applications

Embedded Die Packaging Technology Market – by Industry

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Other Industries

Embedded Die Packaging Technology Market – by Region

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Russia
    • Rest of Europe
  • Asia Pacific (APAC)
    • China
    • Japan
    • India
    • Australia
    • South Korea
    • Rest of APAC
  • Rest of the World
    • MEA
    • SAM

 

Embedded Die Packaging Technology Market – Company Profiles

  • Amkor Technology, Inc.
  • ASE Group
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • General Electric Company
  • INFINEON TECHNOLOGIES AG
  • Microsemi
  • SCHWEIZER ELECTRONIC AG
  • SHINKO ELECTRIC INDUSTRIES CO., LTD.
  • Taiwan Semiconductor Manufacturing Company, Limited

1.             Introduction

1.1       Study Scope

1.2       The Insight Partners Research Report Guidance

1.3       Market Segmentation

1.3.1        Embedded Die Packaging Technology Market – By Platform

1.3.2        Embedded Die Packaging Technology Market – By Application

1.3.3        Embedded Die Packaging Technology Market – By Industry

1.3.4        Embedded Die Packaging Technology Market- By Region

2.             Key Takeaways

3.             Research Methodology

3.1       Coverage                                                                                

3.2       Secondary Research

3.3       Primary Research

4.             Embedded Die Packaging Technology Market Landscape

4.1       Market Overview

4.2       PEST Analysis

4.2.1        North America – PEST Analysis

4.2.2        Europe – PEST Analysis

4.2.3        Asia-Pacific – PEST Analysis

4.2.4        Rest of World – PEST Analysis

4.3       Ecosystem Analysis

4.4       Expert Opinion

5.             Embedded Die Packaging Technology Market – Key Market Dynamics

5.1       Market Drivers

5.1.1        Growing Demand for Miniaturization of Electronic Devices

5.1.2        Rising Developments in Embedded Die Packaging Technology

5.2       Market Restraints

5.2.1        Technical Issues and Availability of Alternative Solutions

5.3       Market Opportunities

5.3.1        Increasing Demand to Enhance Smartphone and Automotive Device Performance

5.4       Future Trends

5.4.1        Rapid Growth in Wearable Devices and Internet of Things

5.5       Impact Analysis of Drivers and Restraints

6.             Embedded Die Packaging Technology Market – Global Analysis

6.1       Embedded Die Packaging Technology Market Global Overview

6.2       Embedded Die Packaging Technology Market – Global Revenue and Forecast to 2028 (US$ Million)

6.3       Market Positioning – Five Key Players

7.             Embedded Die Packaging Technology Market Analysis – By Platform

7.1       Overview

7.2       Embedded Die Packaging Technology Market, By Platform (2020 and 2028)

7.3       IC Package Substrate

7.3.1        Overview

7.3.2        IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

7.4       Rigid Board

7.4.1        Overview

7.4.2        Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

7.5       Flexible Board

7.5.1        Overview

7.5.2        Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

8.             Embedded Die Packaging Technology Market – By Application

8.1       Overview

8.2       Embedded Die Packaging Technology Market, by Application (2020 and 2028)

8.3       Smartphone and Tablets

8.3.1        Overview

8.3.2        Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

8.4       Medical and Wearable Devices

8.4.1        Overview

8.4.2        Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

8.5       Industrial Devices

8.5.1        Overview

8.5.2        Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

8.6       Security Devices

8.6.1        Overview

8.6.2        Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

8.7       Other Applications

8.7.1        Overview

8.7.2        Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

9.             Embedded Die Packaging Technology Market – By Industry

9.1       Overview

9.2       Embedded Die Packaging Technology Market, by Industry (2020 and 2028)

9.3       Consumer Electronics

9.3.1        Overview

9.3.2        Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

9.4       IT and Telecommunication

9.4.1        Overview

9.4.2        IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

9.5       Automotive

9.5.1        Overview

9.5.2        Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

9.6       Healthcare

9.6.1        Overview

9.6.2        Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

9.7       Other Industries

9.7.1        Overview

9.7.2        Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

10.          Embedded Die Packaging Technology Market – Geographic Analysis

10.1    Overview

10.2    North America: Embedded Die Packaging Technology Market

10.2.1     North America: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

10.2.2     North America: Embedded Die Packaging Technology Market- By Platform

10.2.3     North America: Embedded Die Packaging Technology Market- By Application

10.2.4     North America: Embedded Die Packaging Technology Market- By Industry

10.2.5     North America: Embedded Die Packaging Technology Market- by Key Country

10.2.5.1    US: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.2.5.1.1    US: Embedded Die Packaging Technology Market- By Platform

10.2.5.1.2    US: Embedded Die Packaging Technology Market- By Application

10.2.5.1.3    US: Embedded Die Packaging Technology Market- By Industry

10.2.5.2    Canada: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.2.5.2.1    Canada: Embedded Die Packaging Technology Market- By Platform

10.2.5.2.2    Canada: Embedded Die Packaging Technology Market- By Application

10.2.5.2.3    Canada: Embedded Die Packaging Technology Market- By Industry

10.2.5.3    Mexico: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.2.5.3.1    Mexico: Embedded Die Packaging Technology Market- By Platform

10.2.5.3.2    Mexico: Embedded Die Packaging Technology Market- By Application

10.2.5.3.3    Mexico: Embedded Die Packaging Technology Market- By Industry

10.3    Europe: Embedded Die Packaging Technology Market

10.3.1     Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

10.3.2     Europe: Embedded Die Packaging Technology Market- By Platform

10.3.3     Europe: Embedded Die Packaging Technology Market- By Application

10.3.4     Europe: Embedded Die Packaging Technology Market- By Industry

10.3.5     Europe: Embedded Die Packaging Technology Market- by Key Country

10.3.5.1    Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.3.5.1.1    Germany: Embedded Die Packaging Technology Market- By Platform

10.3.5.1.2    Germany: Embedded Die Packaging Technology Market- By Application

10.3.5.1.3    Germany: Embedded Die Packaging Technology Market- By Industry

10.3.5.2    France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.3.5.2.1    France: Embedded Die Packaging Technology Market- By Platform

10.3.5.2.2    France: Embedded Die Packaging Technology Market- By Application

10.3.5.2.3    France: Embedded Die Packaging Technology Market- By Industry

10.3.5.3    Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.3.5.3.1    Italy: Embedded Die Packaging Technology Market- By Platform

10.3.5.3.2    Italy: Embedded Die Packaging Technology Market- By Application

10.3.5.3.3    Italy: Embedded Die Packaging Technology Market- By Industry

10.3.5.4    UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.3.5.4.1    UK: Embedded Die Packaging Technology Market- By Platform

10.3.5.4.2    UK: Embedded Die Packaging Technology Market- By Application

10.3.5.4.3    UK: Embedded Die Packaging Technology Market- By Industry

10.3.5.5    Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.3.5.5.1    Russia: Embedded Die Packaging Technology Market- By Platform

10.3.5.5.2    Russia: Embedded Die Packaging Technology Market- By Application

10.3.5.5.3    Russia: Embedded Die Packaging Technology Market- By Industry

10.3.5.6    Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.3.5.6.1    Rest of Europe: Embedded Die Packaging Technology Market- By Platform

10.3.5.6.2    Rest of Europe: Embedded Die Packaging Technology Market- By Application

10.3.5.6.3    Rest of Europe: Embedded Die Packaging Technology Market- By Industry

10.4    APAC: Embedded Die Packaging Technology Market

10.4.1     APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

10.4.2     APAC: Embedded Die Packaging Technology Market- By Platform

10.4.3     APAC: Embedded Die Packaging Technology Market- By Application

10.4.4     APAC: Embedded Die Packaging Technology Market- By Industry

10.4.5     APAC: Embedded Die Packaging Technology Market- by Key Country

10.4.5.1    Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.4.5.1.1    Australia: Embedded Die Packaging Technology Market- By Platform

10.4.5.1.2    Australia: Embedded Die Packaging Technology Market- By Application

10.4.5.1.3    Australia: Embedded Die Packaging Technology Market- By Industry

10.4.5.2    China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.4.5.2.1    China: Embedded Die Packaging Technology Market- By Platform

10.4.5.2.2    China: Embedded Die Packaging Technology Market- By Application

10.4.5.2.3    China: Embedded Die Packaging Technology Market- By Industry

10.4.5.3    India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.4.5.3.1    India: Embedded Die Packaging Technology Market- By Platform

10.4.5.3.2    India: Embedded Die Packaging Technology Market- By Application

10.4.5.3.3    India: Embedded Die Packaging Technology Market- By Industry

10.4.5.4    Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.4.5.4.1    Japan: Embedded Die Packaging Technology Market- By Platform

10.4.5.4.2    Japan: Embedded Die Packaging Technology Market- By Application

10.4.5.4.3    Japan: Embedded Die Packaging Technology Market- By Industry

10.4.5.5    South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.4.5.5.1    South Korea: Embedded Die Packaging Technology Market- By Platform

10.4.5.5.2    South Korea: Embedded Die Packaging Technology Market- By Application

10.4.5.5.3    South Korea: Embedded Die Packaging Technology Market- By Industry

10.4.5.6    Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.4.5.6.1    Rest of APAC: Embedded Die Packaging Technology Market- By Platform

10.4.5.6.2    Rest of APAC: Embedded Die Packaging Technology Market- By Application

10.4.5.6.3    Rest of APAC: Embedded Die Packaging Technology Market- By Industry

10.5    Rest of World: Embedded Die Packaging Technology Market

10.5.1     Rest of World: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

10.5.2     Rest of World: Embedded Die Packaging Technology Market- By Platform

10.5.3     Rest of World: Embedded Die Packaging Technology Market- By Application

10.5.4     Rest of World: Embedded Die Packaging Technology Market- By Industry

10.5.5     Rest of World: Embedded Die Packaging Technology Market- by Key Region

10.5.5.1    MEA: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.5.5.1.1    MEA: Embedded Die Packaging Technology Market- By Platform

10.5.5.1.2    MEA: Embedded Die Packaging Technology Market- By Application

10.5.5.1.3    MEA: Embedded Die Packaging Technology Market- By Industry

10.5.5.2    SAM: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

10.5.5.2.1    SAM: Embedded Die Packaging Technology Market- By Platform

10.5.5.2.2    SAM: Embedded Die Packaging Technology Market- By Application

10.5.5.2.3    SAM: Embedded Die Packaging Technology Market- By Industry

11.          Embedded Die Packaging Technology Market- COVID-19 Impact Analysis

11.1    Overview

11.2    North America

11.3    Europe

11.4    Asia Pacific

11.5    Rest of World

12.          Industry Landscape

12.1    Overview

12.2    Market Initiative

12.3    New Product Development

13.          Company Profiles

13.1    ASE Group

13.1.1     Key Facts

13.1.2     Business Description

13.1.3     Products and Services

13.1.4     Financial Overview

13.1.5     SWOT Analysis

13.1.6     Key Developments

13.2    Amkor Technology, Inc.

13.2.1     Key Facts

13.2.2     Business Description

13.2.3     Products and Services

13.2.4     Financial Overview

13.2.5     SWOT Analysis

13.2.6     Key Developments

13.3    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

13.3.1     Key Facts

13.3.2     Business Description

13.3.3     Products and Services

13.3.4     Financial Overview

13.3.5     SWOT Analysis

13.3.6     Key Developments

13.4    Fujikura Ltd.

13.4.1     Key Facts

13.4.2     Business Description

13.4.3     Products and Services

13.4.4     Financial Overview

13.4.5     SWOT Analysis

13.4.6     Key Developments

13.5    General Electric Company

13.5.1     Key Facts

13.5.2     Business Description

13.5.3     Products and Services

13.5.4     Financial Overview

13.5.5     SWOT Analysis

13.5.6     Key Developments

13.6    Infineon Technologies AG

13.6.1     Key Facts

13.6.2     Business Description

13.6.3     Products and Services

13.6.4     Financial Overview

13.6.5     SWOT Analysis

13.6.6     Key Developments

13.7    Microsemi

13.7.1     Key Facts

13.7.2     Business Description

13.7.3     Products and Services

13.7.4     Financial Overview

13.7.5     SWOT Analysis

13.7.6     Key Developments

13.8    Shinko Electric Industries Co., Ltd.

13.8.1     Key Facts

13.8.2     Business Description

13.8.3     Products and Services

13.8.4     Financial Overview

13.8.5     SWOT Analysis

13.8.6     Key Developments

13.9    Schweizer Electronic AG

13.9.1     Key Facts

13.9.2     Business Description

13.9.3     Products and Services

13.9.4     Financial Overview

13.9.5     SWOT Analysis

13.9.6     Key Developments

13.10 Taiwan Semiconductor Manufacturing Company, Limited

13.10.1   Key Facts

13.10.2   Business Description

13.10.3   Products and Services

13.10.4   Financial Overview

13.10.5   SWOT Analysis

13.10.6   Key Developments

14.          Appendix

14.1    About The Insight Partners

14.2    Word Index

LIST OF TABLES

Table 1.             Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Million)

Table 2.             North America: Embedded Die Packaging Technology Market- By Platform – Revenue and Forecast to 2028 (US$ Thousand)

Table 3.             North America: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)

Table 4.             North America: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)

Table 5.             US: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 6.             US: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 7.             US: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 8.             Canada: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 9.             Canada: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 10.          Canada: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 11.          Mexico: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 12.          Mexico: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 13.          Mexico: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 14.          Europe: Embedded Die Packaging Technology Market- By Platform – Revenue and Forecast to 2028 (US$ Thousand)

Table 15.          Europe: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)

Table 16.          Europe: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)

Table 17.          Germany: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 18.          Germany: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 19.          Germany: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 20.          France: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 21.          France: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 22.          France: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 23.          Italy: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 24.          Italy: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 25.          Italy: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 26.          UK: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 27.          UK: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 28.          UK: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 29.          Russia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 30.          Russia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 31.          Russia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 32.          Rest of Europe: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 33.          Rest of Europe: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 34.          Rest of Europe: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 35.          APAC: Embedded Die Packaging Technology Market- By Platform – Revenue and Forecast to 2028 (US$ Thousand)

Table 36.          APAC: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)

Table 37.          APAC: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)

Table 38.          Australia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 39.          Australia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 40.          Australia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 41.          China: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 42.          China: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 43.          China: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 44.          India: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 45.          India: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 46.          India: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 47.          Japan: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 48.          Japan: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 49.          Japan: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 50.          South Korea: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 51.          South Korea: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 52.          South Korea: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 53.          Rest of APAC: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 54.          Rest of APAC: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 55.          Rest of APAC: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 56.          Rest of World: Embedded Die Packaging Technology Market- By Platform– Revenue and Forecast to 2028 (US$ Thousand)

Table 57.          Rest of World: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)

Table 58.          Rest of World: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)

Table 59.          MEA: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 60.          MEA: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 61.          MEA: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 62.          SAM: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)

Table 63.          SAM: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)

Table 64.          SAM: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)

Table 65.          List of Abbreviation

 

 

LIST OF FIGURES

Figure 1.           Embedded Die Packaging Technology Market Segmentation

Figure 2.           Embedded Die Packaging Technology Market Segmentation – By Geography

Figure 3.           Global Embedded Die Packaging Technology Market Overview

Figure 4.           IC Package Substrate Platform Held the Largest Market Share in 2020

Figure 5.           Smartphones and Tablets Held the Largest Market Share in 2020

Figure 6.           Consumer Electronics Held the Largest Market Share in 2020

Figure 7.           Asia Pacific was the Largest Revenue Contributor in 2020

Figure 8.           North America – PEST Analysis

Figure 9.           Europe – PEST Analysis

Figure 10.        Asia-Pacific – PEST Analysis

Figure 11.        Rest of World – PEST Analysis

Figure 12.        Embedded Die Packaging Technology Market– Ecosystem Analysis

Figure 13.        Expert Opinion

Figure 14.        Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints

Figure 15.        Geographic Overview of Embedded Die Packaging Technology Market

Figure 16.        Global Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 17.        Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)

Figure 18.        IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 19.        Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 20.        Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 21.        Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)

Figure 22.        Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 23.        Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 24.        Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 25.        Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 26.        Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 27.        Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)

Figure 28.        Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 29.        IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 30.        Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 31.        Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 32.        Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 33.        Embedded Die Packaging Technology Market Revenue Share, By Region (2020 and 2028)

Figure 34.        North America: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 35.        North America: Embedded Die Packaging Technology Market Revenue Share, By Platform (2020 and 2028)

Figure 36.        North America: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)

Figure 37.        North America: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)

Figure 38.        North America: Embedded Die Packaging Technology Market Revenue Share, by Key Country (2020 and 2028)

Figure 39.        US: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 40.        Canada: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 41.        Mexico: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 42.        Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 43.        Europe: Embedded Die Packaging Technology Market Revenue Share, By Technology (2020 and 2028)

Figure 44.        Europe: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)

Figure 45.        Europe: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)

Figure 46.        Europe: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)

Figure 47.        Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 48.        France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 49.        Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 50.        UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 51.        Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 52.        Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 53.        APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 54.        APAC: Embedded Die Packaging Technology Market Revenue Share, By Technology (2020 and 2028)

Figure 55.        APAC: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)

Figure 56.        APAC: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)

Figure 57.        APAC: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)

Figure 58.        Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 59.        China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 60.        India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 61.        Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 62.        South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 63.        Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 64.        Rest of World: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)

Figure 65.        Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Technology (2020 and 2028)

Figure 66.        Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)

Figure 67.        Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)

Figure 68.        Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Key Region (2020 and 2028)

Figure 69.        MEA: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 70.        SAM: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)

Figure 71.        Impact of COVID-19 Pandemic in North American Country Markets

Figure 72.        Impact of COVID-19 Pandemic in Europe Country Markets

Figure 73.        Impact of COVID-19 Pandemic in APAC Country Markets

Figure 74.        Impact of COVID-19 Pandemic in Rest of World Markets

The List of Companies - Embedded Die Packaging Technology Market

  1. Amkor Technology, Inc.
  2. ASE Group
  3. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  4. Fujikura Ltd.
  5. General Electric Company
  6. INFINEON TECHNOLOGIES AG
  7. Microsemi
  8. SCHWEIZER ELECTRONIC AG
  9. SHINKO ELECTRIC INDUSTRIES CO., LTD.
  10. Taiwan Semiconductor Manufacturing Company, Limited

 

  • Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the global embedded die packaging technology market
  • Highlights key business priorities in order to assist companies to realign their business strategies
  • The key findings and recommendations highlight crucial progressive industry trends in the global embedded die packaging technology market, thereby allowing players across the value chain to develop effective long-term strategies
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
  • Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution

 

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Frequently Asked Questions

The growth of the embedded die packaging technology market is primarily attributed to growing demand for miniaturization of electronic devices. Moreover, the rising developments in embedded die packaging technology, thereby substantially driving the embedded die packaging technology market.

The embedded die packaging technology has a huge opportunity in the smartphone and tablet market to offer advanced processors, transmitters, and other components. Embedded die packaging technology enhances the device performance and provides better space utilization solutions. A few market players are developing ICs and other components using the embedded die packaging technology, while for others, it is an excellent opportunity to innovate new solutions for smartphones and tablets. For instance, market players such as AT&S, SHINKO, and ASE Group offer the embedded die packaging technology for smartphones. The rising consumption of smartphones is a major supporting factor for the market growth in coming years. To grab a leading position, companies need to develop new processors with compact size and high-performance level. According to Ericsson, in 2016, almost 4 billion mobile connections were present in Asia Pacific, and are expected to reach 4.6 billion by 2021. Increasing demand in Asia Pacific alone shows the potential for embedded die packaging technology in the smartphone industry.

The embedded die packaging technology market is led by IC package substrate segment with highest share and is expected to dominate in the forecast period. In the semiconductor industry, ICs (integrated circuit) are using embedded die packaging technology to reduce the size and enhance the performance. In the IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefit—such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. The IC package substrate platform in embedded die packaging technology is used for a wide range of applications, such as MOSFET, regulator, DCDC, audio, sensor, optical, connectivity, memory, and image module.

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