Advanced Packaging Market Forecast to 2027 - Covid-19 Impact and Global Analysis - by Technology (Wafer-level Chip-scale Packaging, 3D Integrated Circuit Packaging, Silicon in Package, 3D Wafer level Package, 2.5 D, Flip Chip); and Application (Consumer Electronics, Automotive, IT & Telecommunication, Healthcare, Aerospace & Defense, and Others)
Encapsulation of an Integrated Circuit (IC) in a supporting case to prevent it from corrosion and any physical damage implies semiconductor packaging which is essentially the last step in the electronics manufacturing process. Different ICs manufactured have different packaging requirements, and the factors that govern such requirement include power dissipation, size, field-operating conditions, and cost. Advanced packaging having higher abilities than the conventional packages is one of the key trends anticipated to be witnessed in the near future in the advanced packaging market.
Rising demands for smart as well as power-efficient devices by the consumers and exponential adoptions of IoT by various industry verticals are expected to be one of the driving factors for the players in the advanced packaging market. High initial costs of advanced packaging with higher maintenance costs of these systems is one factor that would hinder the future growth of the advanced packaging market. The rise in the usage of advanced packaging by the automotive industry is create further large opportunities for the players operating in the advanced packaging market.
The "Global Advanced Packaging Market Analysis to 2027" is a specialized and in-depth study of the advanced packaging industry with a focus on the global market trend. The report aims to provide an overview of global advanced packaging market with detailed market segmentation by technology, application, and geography. The global advanced packaging market is expected to witness steady growth during the forecast period. The report provides key statistics on the market status of the leading market players operating in the advanced packaging market and offers key trends and opportunities in the market.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global Advanced packaging market based on technology, and application. It also provides market size and forecast till 2027 for overall advanced packaging market with respect to four major regions, namely; North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 15 countries globally along with current trend and opportunities prevailing in the region for advanced packaging market.
Besides this, the report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, Rest of the World after evaluating political, economic, social and technological factors affecting the Advanced packaging market in these regions.
Also, key advanced packaging market players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products, and services offered, financial information for the last 3 years, the key development in the past five years. Some of the key players influencing the market are as follows:
- Amkor Technology Inc.
- ASE Technology Holding Co., Ltd.
- Intel Corporation
- International Business Machines Corporation
- Qualcomm Technologies, Inc.
- Semiconductor Manufacturing International Corporation,
- STATS ChipPAC Ltd
- SÜSS MicroTec SE
- Taiwan Semiconductor Manufacturing Company
- United Microelectronics Corporation
1. INTRODUCTION
1.1. SCOPE OF THE STUDY
1.2. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3. MARKET SEGMENTATION
1.3.1 Advanced Packaging Market - By Technology
1.3.2 Advanced Packaging Market - By Application
1.3.3 Advanced Packaging Market - By Region
1.3.3.1 By Country
2. KEY TAKEAWAYS
3. RESEARCH METHODOLOGY
4. ADVANCED PACKAGING MARKET LANDSCAPE
4.1. OVERVIEW
4.2. PEST ANALYSIS
4.2.1 North America - Pest Analysis
4.2.2 Europe - Pest Analysis
4.2.3 Asia-Pacific - Pest Analysis
4.2.4 Middle East and Africa - Pest Analysis
4.2.5 South and Central America - Pest Analysis
4.3. ECOSYSTEM ANALYSIS
4.4. EXPERT OPINIONS
5. ADVANCED PACKAGING MARKET - KEY MARKET DYNAMICS
5.1. KEY MARKET DRIVERS
5.2. KEY MARKET RESTRAINTS
5.3. KEY MARKET OPPORTUNITIES
5.4. FUTURE TRENDS
5.5. IMPACT ANALYSIS OF DRIVERS, RESTRAINTS & EXPECTED INFLUENCE OF COVID-19 PANDEMIC
6. ADVANCED PACKAGING MARKET - GLOBAL MARKET ANALYSIS
6.1. ADVANCED PACKAGING - GLOBAL MARKET OVERVIEW
6.2. ADVANCED PACKAGING - GLOBAL MARKET AND FORECAST TO 2027
6.3. MARKET POSITIONING/MARKET SHARE
7. ADVANCED PACKAGING MARKET - REVENUE AND FORECASTS TO 2027 – TECHNOLOGY
7.1. OVERVIEW
7.2. TECHNOLOGY MARKET FORECASTS AND ANALYSIS
7.3. WAFER-LEVEL
7.3.1. Overview
7.3.2. Wafer-level Market Forecast and Analysis
7.4. CHIP-SCALE PACKAGING
7.4.1. Overview
7.4.2. Chip-scale Packaging Market Forecast and Analysis
7.5. 3D INTEGRATED CIRCUIT PACKAGING
7.5.1. Overview
7.5.2. 3D Integrated Circuit Packaging Market Forecast and Analysis
7.6. SILICON IN PACKAGE
7.6.1. Overview
7.6.2. Silicon in Package Market Forecast and Analysis
7.7. 3D WAFER LEVEL PACKAGE
7.7.1. Overview
7.7.2. 3D Wafer level Package Market Forecast and Analysis
7.8. 2.5 D
7.8.1. Overview
7.8.2. 2.5 D Market Forecast and Analysis
7.9. FLIP CHIP
7.9.1. Overview
7.9.2. Flip Chip Market Forecast and Analysis
8. ADVANCED PACKAGING MARKET - REVENUE AND FORECASTS TO 2027 – APPLICATION
8.1. OVERVIEW
8.2. APPLICATION MARKET FORECASTS AND ANALYSIS
8.3. CONSUMER ELECTRONICS
8.3.1. Overview
8.3.2. Consumer electronics Market Forecast and Analysis
8.4. AUTOMOTIVE
8.4.1. Overview
8.4.2. Automotive Market Forecast and Analysis
8.5. IT AND TELECOMMUNICATION
8.5.1. Overview
8.5.2. IT and Telecommunication Market Forecast and Analysis
8.6. HEALTHCARE
8.6.1. Overview
8.6.2. Healthcare Market Forecast and Analysis
8.7. AEROSPACE AND DEFENSE
8.7.1. Overview
8.7.2. Aerospace and Defense Market Forecast and Analysis
8.8. OTHERS
8.8.1. Overview
8.8.2. Others Market Forecast and Analysis
9. ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2027 – GEOGRAPHICAL ANALYSIS
9.1. NORTH AMERICA
- 9.1.1 North America Advanced Packaging Market Overview
- 9.1.2 North America Advanced Packaging Market Forecasts and Analysis
- 9.1.3 North America Advanced Packaging Market Forecasts and Analysis - By Technology
- 9.1.4 North America Advanced Packaging Market Forecasts and Analysis - By Application
- 9.1.5 North America Advanced Packaging Market Forecasts and Analysis - By Countries
9.1.5.1 United States Advanced Packaging Market
- 9.1.5.1.1 United States Advanced Packaging Market by Technology
- 9.1.5.1.2 United States Advanced Packaging Market by Application
9.1.5.2 Canada Advanced Packaging Market
- 9.1.5.2.1 Canada Advanced Packaging Market by Technology
- 9.1.5.2.2 Canada Advanced Packaging Market by Application
9.1.5.3 Mexico Advanced Packaging Market
- 9.1.5.3.1 Mexico Advanced Packaging Market by Technology
- 9.1.5.3.2 Mexico Advanced Packaging Market by Application
9.2. EUROPE
- 9.2.1 Europe Advanced Packaging Market Overview
- 9.2.2 Europe Advanced Packaging Market Forecasts and Analysis
- 9.2.3 Europe Advanced Packaging Market Forecasts and Analysis - By Technology
- 9.2.4 Europe Advanced Packaging Market Forecasts and Analysis - By Application
- 9.2.5 Europe Advanced Packaging Market Forecasts and Analysis - By Countries
9.2.5.1 Germany Advanced Packaging Market
- 9.2.5.1.1 Germany Advanced Packaging Market by Technology
- 9.2.5.1.2 Germany Advanced Packaging Market by Application
9.2.5.2 France Advanced Packaging Market
- 9.2.5.2.1 France Advanced Packaging Market by Technology
- 9.2.5.2.2 France Advanced Packaging Market by Application
9.2.5.3 Italy Advanced Packaging Market
- 9.2.5.3.1 Italy Advanced Packaging Market by Technology
- 9.2.5.3.2 Italy Advanced Packaging Market by Application
9.2.5.4 United Kingdom Advanced Packaging Market
- 9.2.5.4.1 United Kingdom Advanced Packaging Market by Technology
- 9.2.5.4.2 United Kingdom Advanced Packaging Market by Application
9.2.5.5 Russia Advanced Packaging Market
- 9.2.5.5.1 Russia Advanced Packaging Market by Technology
- 9.2.5.5.2 Russia Advanced Packaging Market by Application
9.2.5.6 Rest of Europe Advanced Packaging Market
- 9.2.5.6.1 Rest of Europe Advanced Packaging Market by Technology
- 9.2.5.6.2 Rest of Europe Advanced Packaging Market by Application
9.3. ASIA-PACIFIC
- 9.3.1 Asia-Pacific Advanced Packaging Market Overview
- 9.3.2 Asia-Pacific Advanced Packaging Market Forecasts and Analysis
- 9.3.3 Asia-Pacific Advanced Packaging Market Forecasts and Analysis - By Technology
- 9.3.4 Asia-Pacific Advanced Packaging Market Forecasts and Analysis - By Application
- 9.3.5 Asia-Pacific Advanced Packaging Market Forecasts and Analysis - By Countries
9.3.5.1 Australia Advanced Packaging Market
- 9.3.5.1.1 Australia Advanced Packaging Market by Technology
- 9.3.5.1.2 Australia Advanced Packaging Market by Application
9.3.5.2 China Advanced Packaging Market
- 9.3.5.2.1 China Advanced Packaging Market by Technology
- 9.3.5.2.2 China Advanced Packaging Market by Application
9.3.5.3 India Advanced Packaging Market
- 9.3.5.3.1 India Advanced Packaging Market by Technology
- 9.3.5.3.2 India Advanced Packaging Market by Application
9.3.5.4 Japan Advanced Packaging Market
- 9.3.5.4.1 Japan Advanced Packaging Market by Technology
- 9.3.5.4.2 Japan Advanced Packaging Market by Application
9.3.5.5 South Korea Advanced Packaging Market
- 9.3.5.5.1 South Korea Advanced Packaging Market by Technology
- 9.3.5.5.2 South Korea Advanced Packaging Market by Application
9.3.5.6 Others Advanced Packaging Market
- 9.3.5.6.1 Others Advanced Packaging Market by Technology
- 9.3.5.6.2 Others Advanced Packaging Market by Application
9.4. MIDDLE EAST AND AFRICA
- 9.4.1 Middle East and Africa Advanced Packaging Market Overview
- 9.4.2 Middle East and Africa Advanced Packaging Market Forecasts and Analysis
- 9.4.3 Middle East and Africa Advanced Packaging Market Forecasts and Analysis - By Technology
- 9.4.4 Middle East and Africa Advanced Packaging Market Forecasts and Analysis - By Application
- 9.4.5 Middle East and Africa Advanced Packaging Market Forecasts and Analysis - By Countries
9.4.5.1 South Africa Advanced Packaging Market
- 9.4.5.1.1 South Africa Advanced Packaging Market by Technology
- 9.4.5.1.2 South Africa Advanced Packaging Market by Application
9.4.5.2 Saudi Arabia Advanced Packaging Market
- 9.4.5.2.1 Saudi Arabia Advanced Packaging Market by Technology
- 9.4.5.2.2 Saudi Arabia Advanced Packaging Market by Application
9.4.5.3 U.A.E Advanced Packaging Market
- 9.4.5.3.1 U.A.E Advanced Packaging Market by Technology
- 9.4.5.3.2 U.A.E Advanced Packaging Market by Application
9.4.5.4 Rest of Middle East and Africa Advanced Packaging Market
- 9.4.5.4.1 Rest of Middle East and Africa Advanced Packaging Market by Technology
- 9.4.5.4.2 Rest of Middle East and Africa Advanced Packaging Market by Application
9.5. SOUTH AND CENTRAL AMERICA
- 9.5.1 South and Central America Advanced Packaging Market Overview
- 9.5.2 South and Central America Advanced Packaging Market Forecasts and Analysis
- 9.5.3 South and Central America Advanced Packaging Market Forecasts and Analysis - By Technology
- 9.5.4 South and Central America Advanced Packaging Market Forecasts and Analysis - By Application
- 9.5.5 South and Central America Advanced Packaging Market Forecasts and Analysis - By Countries
9.5.5.1 Brazil Advanced Packaging Market
- 9.5.5.1.1 Brazil Advanced Packaging Market by Technology
- 9.5.5.1.2 Brazil Advanced Packaging Market by Application
9.5.5.2 Argentina Advanced Packaging Market
- 9.5.5.2.1 Argentina Advanced Packaging Market by Technology
- 9.5.5.2.2 Argentina Advanced Packaging Market by Application
9.5.5.3 Rest of South and Central America Advanced Packaging Market
- 9.5.5.3.1 Rest of South and Central America Advanced Packaging Market by Technology
- 9.5.5.3.2 Rest of South and Central America Advanced Packaging Market by Application
10. INDUSTRY LANDSCAPE
10.1. MERGERS AND ACQUISITIONS
10.2. AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
10.3. NEW PRODUCT LAUNCHES
10.4. EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS
11. ADVANCED PACKAGING MARKET, KEY COMPANY PROFILES
11.1. AMKOR TECHNOLOGY INC.
11.1.1. Key Facts
11.1.2. Business Description
11.1.3. Products and Services
11.1.4. Financial Overview
11.1.5. SWOT Analysis
11.1.6. Key Developments
11.2. ASE TECHNOLOGY HOLDING CO., LTD.
11.2.1. Key Facts
11.2.2. Business Description
11.2.3. Products and Services
11.2.4. Financial Overview
11.2.5. SWOT Analysis
11.2.6. Key Developments
11.3. INTEL CORPORATION
11.3.1. Key Facts
11.3.2. Business Description
11.3.3. Products and Services
11.3.4. Financial Overview
11.3.5. SWOT Analysis
11.3.6. Key Developments
11.4. INTERNATIONAL BUSINESS MACHINES CORPORATION
11.4.1. Key Facts
11.4.2. Business Description
11.4.3. Products and Services
11.4.4. Financial Overview
11.4.5. SWOT Analysis
11.4.6. Key Developments
11.5. QUALCOMM TECHNOLOGIES, INC.
11.5.1. Key Facts
11.5.2. Business Description
11.5.3. Products and Services
11.5.4. Financial Overview
11.5.5. SWOT Analysis
11.5.6. Key Developments
11.6. SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION,
11.6.1. Key Facts
11.6.2. Business Description
11.6.3. Products and Services
11.6.4. Financial Overview
11.6.5. SWOT Analysis
11.6.6. Key Developments
11.7. STATS CHIPPAC LTD
11.7.1. Key Facts
11.7.2. Business Description
11.7.3. Products and Services
11.7.4. Financial Overview
11.7.5. SWOT Analysis
11.7.6. Key Developments
11.8. SÜSS MICROTEC SE
11.8.1. Key Facts
11.8.2. Business Description
11.8.3. Products and Services
11.8.4. Financial Overview
11.8.5. SWOT Analysis
11.8.6. Key Developments
11.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
11.9.1. Key Facts
11.9.2. Business Description
11.9.3. Products and Services
11.9.4. Financial Overview
11.9.5. SWOT Analysis
11.9.6. Key Developments
11.10. UNITED MICROELECTRONICS CORPORATION
11.10.1. Key Facts
11.10.2. Business Description
11.10.3. Products and Services
11.10.4. Financial Overview
11.10.5. SWOT Analysis
11.10.6. Key Developments
12. APPENDIX
12.1. ABOUT THE INSIGHT PARTNERS
12.2. GLOSSARY OF TERMS
The List of Companies
- Amkor Technology Inc.
- ASE Technology Holding Co., Ltd.
- Intel Corporation
- International Business Machines Corporation
- Qualcomm Technologies, Inc.
- Semiconductor Manufacturing International Corporation,
- STATS ChipPAC Ltd
- SÜSS MicroTec SE
- Taiwan Semiconductor Manufacturing Company
- United Microelectronics Corporation