Advanced Packaging Market to 2025 - Global Analysis and Forecasts by Technology (Wafer-level Chip-scale Packaging, 3D Integrated Circuit Packaging, Silicon in Package, 3D Wafer level Package, 2.5 D, Flip Chip); and Application (Consumer Electronics, Automotive, IT & Telecommunication, Healthcare, Aerospace & Defense, and Others)
Report Code: TIPEL00002151 No. of Pages: 150 Category: Electronics and Semiconductor Status: Upcoming
Encapsulation of an Integrated Circuit (IC) in a supporting case to prevent it from corrosion and any physical damage implies semiconductor packaging which is essentially the last step in the electronics manufacturing process. Different ICs manufactured have different packaging requirements, and the factors that govern such requirement include power dissipation, size, field-operating conditions, and cost. Advanced packaging having higher abilities than the conventional packages is one of the key trends anticipated to be witnessed in the near future in the advanced packaging market.
Rising demands for smart as well as power-efficient devices by the consumers and exponential adoptions of IoT by various industry verticals are expected to be one of the driving factors for the players in the advanced packaging market. High initial costs of advanced packaging with higher maintenance costs of these systems is one factor that would hinder the future growth of the advanced packaging market. The rise in the usage of advanced packaging by the automotive industry is create further large opportunities for the players operating in the advanced packaging market.
The "Global Advanced Packaging Market Analysis to 2025" is a specialized and in-depth study of the advanced packaging industry with a focus on the global market trend. The report aims to provide an overview of global advanced packaging market with detailed market segmentation by technology, application, and geography. The global advanced packaging market is expected to witness steady growth during the forecast period. The report provides key statistics on the market status of the leading market players operating in the advanced packaging market and offers key trends and opportunities in the market.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global Advanced packaging market based on technology, and application. It also provides market size and forecast till 2025 for overall advanced packaging market with respect to four major regions, namely; North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 15 countries globally along with current trend and opportunities prevailing in the region for advanced packaging market.
Besides this, the report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, Rest of the World after evaluating political, economic, social and technological factors affecting the Advanced packaging market in these regions.
Also, key advanced packaging market players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products, and services offered, financial information for the last 3 years, the key development in the past five years. Some of the key players influencing the market are Advanced Semiconductor Engineering Inc., SSS MicroTec AG., Semiconductor Manufacturing International Corporation, Intel Corporation, and Qualcomm Technologies, Inc. Also, United Microelectronics Corporation, Siliconware Precision Industries Co., Ltd. (SPIL), Amkor Technology Inc., Taiwan Semiconductor Manufacturing Company, and STATS ChipPAC Ltd are few other important players in the advanced packaging market.
Rising demands for smart as well as power-efficient devices by the consumers and exponential adoptions of IoT by various industry verticals are expected to be one of the driving factors for the players in the advanced packaging market. High initial costs of advanced packaging with higher maintenance costs of these systems is one factor that would hinder the future growth of the advanced packaging market. The rise in the usage of advanced packaging by the automotive industry is create further large opportunities for the players operating in the advanced packaging market.
The "Global Advanced Packaging Market Analysis to 2025" is a specialized and in-depth study of the advanced packaging industry with a focus on the global market trend. The report aims to provide an overview of global advanced packaging market with detailed market segmentation by technology, application, and geography. The global advanced packaging market is expected to witness steady growth during the forecast period. The report provides key statistics on the market status of the leading market players operating in the advanced packaging market and offers key trends and opportunities in the market.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global Advanced packaging market based on technology, and application. It also provides market size and forecast till 2025 for overall advanced packaging market with respect to four major regions, namely; North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 15 countries globally along with current trend and opportunities prevailing in the region for advanced packaging market.
Besides this, the report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, Rest of the World after evaluating political, economic, social and technological factors affecting the Advanced packaging market in these regions.
Also, key advanced packaging market players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products, and services offered, financial information for the last 3 years, the key development in the past five years. Some of the key players influencing the market are Advanced Semiconductor Engineering Inc., SSS MicroTec AG., Semiconductor Manufacturing International Corporation, Intel Corporation, and Qualcomm Technologies, Inc. Also, United Microelectronics Corporation, Siliconware Precision Industries Co., Ltd. (SPIL), Amkor Technology Inc., Taiwan Semiconductor Manufacturing Company, and STATS ChipPAC Ltd are few other important players in the advanced packaging market.
Table of Contents
1 INTRODUCTION
1.1 THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
2 KEY TAKEAWAYS
3 ADVANCED PACKAGING MARKET LANDSCAPE
3.1 OVERVIEW
3.2 MARKET SEGMENTATION
3.2.1 Advanced Packaging Market - By Technology
3.2.2 Advanced Packaging Market - By Application
3.2.3 Advanced Packaging Market - By Region
3.2.3.1 By Countries
3.2.4 PEST Analysis
3.2.4.1 North America - PEST Analysis
3.2.4.2 Europe - PEST Analysis
3.2.4.3 Asia Pacific (APAC) - PEST Analysis
3.2.4.4 Rest of the World (RoW) - PEST Analysis
4 ADVANCED PACKAGING MARKET - KEY INDUSTRY DYNAMICS
4.1 KEY MARKET DRIVERS
4.2 KEY MARKET RESTRAINTS
4.3 KEY MARKET OPPORTUNITIES
4.4 FUTURE TRENDS
4.5 IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS
5 ADVANCED PACKAGING MARKET - GLOBAL MARKET ANALYSIS
5.1 ADVANCED PACKAGING- GLOBAL MARKET OVERVIEW
5.2 ADVANCED PACKAGING- GLOBAL MARKET AND FORECAST TO 2025
6 ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2025 - TECHNOLOGY
6.1 OVERVIEW
6.2 TECHNOLOGY MARKET FORECASTS AND ANALYSIS
6.3 WAFER-LEVEL CHIP-SCALE PACKAGING MARKET
6.3.1 Overview
6.3.2 Wafer-level Chip-scale Packaging market forecast and analysis
6.4 3D INTEGRATED CIRCUIT PACKAGING MARKET
6.4.1 Overview
6.4.2 3D Integrated Circuit Packaging market forecast and analysis
6.5 SILICON IN PACKAGE MARKET
6.5.1 Overview
6.5.2 Silicon in Package market forecast and analysis
6.6 3D WAFER LEVEL PACKAGE MARKET
6.6.1 Overview
6.6.2 3D Wafer Level Package market forecast and analysis
6.7 2.5 D MARKET
6.7.1 Overview
6.7.2 2.5 D market forecast and analysis
6.8 FLIP CHIP MARKET
6.8.1 Overview
6.8.2 Flip Chip market forecast and analysis
6.9 OTHERS MARKET
6.9.1 Overview
6.9.2 Others market forecast and analysis
7 ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2025 - APPLICATION
7.1 OVERVIEW
7.2 APPLICATION MARKET FORECASTS AND ANALYSIS
7.3 CONSUMER ELECTRONICS MARKET
7.3.1 Overview
7.3.2 Consumer Electronics market forecast and analysis
7.4 AUTOMOTIVE MARKET
7.4.1 Overview
7.4.2 Automotive market forecast and analysis
7.5 IT & TELECOMMUNICATION MARKET
7.5.1 Overview
7.5.2 IT & Telecommunication market forecast and analysis
7.6 HEALTHCARE MARKET
7.6.1 Overview
7.6.2 Healthcare market forecast and analysis
7.7 AEROSPACE & DEFENSE MARKET
7.7.1 Overview
7.7.2 Aerospace & Defense market forecast and analysis
7.8 OTHERS MARKET
7.8.1 Overview
7.8.2 Others market forecast and analysis
8 ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2025 - GEOGRAPHICAL ANALYSIS
8.1 NORTH AMERICA
8.1.1 North America Advanced Packaging Market Overview
8.1.2 North America Advanced Packaging Market Forecasts and Analysis
8.1.3 North America Market Forecasts and Analysis - By Countries
8.1.3.1 US market
8.1.3.2 Canada market
8.1.3.3 Mexico market
8.1.4 North America Market Forecasts and Analysis - By Technology
8.1.5 North America Market Forecasts and Analysis - By Application
8.2 EUROPE
8.2.1 Europe Advanced Packaging Market Overview
8.2.2 Europe Advanced Packaging Market Forecasts and Analysis
8.2.3 Europe Market Forecasts and Analysis - By Countries
8.2.3.1 France market
8.2.3.2 Germany market
8.2.3.3 Italy market
8.2.3.4 Spain market
8.2.3.5 UK market
8.2.4 Europe Market Forecasts and Analysis - By Technology
8.2.5 Europe Market Forecasts and Analysis - By Application
8.3 ASIA PACIFIC (APAC)
8.3.1 Asia Pacific Advanced Packaging Market Overview
8.3.2 Asia Pacific Advanced Packaging Market Forecasts and Analysis
8.3.3 Asia Pacific Market Forecasts and Analysis - By Countries
8.3.3.1 South Korea market
8.3.3.2 China market
8.3.3.3 Taiwan market
8.3.3.4 Japan market
8.3.4 Asia Pacific Market Forecasts and Analysis - By Technology
8.3.5 Asia Pacific Market Forecasts and Analysis - By Application
8.4 REST OF THE WORLD (ROW)
8.4.1 Rest of the World Advanced Packaging Market Overview
8.4.2 Rest of the World Advanced Packaging Market Forecasts and Analysis
8.4.3 Rest of the World Market Forecasts and Analysis - By Countries
8.4.3.1 Africa market
8.4.3.2 Middle East market
8.4.3.3 South America market
8.4.4 Rest of the World Market Forecasts and Analysis - By Technology
8.4.5 Rest of the World Market Forecasts and Analysis - By Application
9 INDUSTRY LANDSCAPE
9.1 MERGERS & ACQUISITIONS
9.2 MARKET INITIATIVES
9.3 NEW DEVELOPMENTS
9.4 INVESTMENT SCENARIOS
10 COMPETITIVE LANDSCAPE
10.1 COMPETITIVE PRODUCT MAPPING
10.2 MARKET POSITIONING/ MARKET SHARE
11 ADVANCED PACKAGING MARKET, KEY COMPANY PROFILES
11.1 ADVANCED SEMICONDUCTOR ENGINEERING INC.
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Financial Overview
11.1.4 SWOT Analysis
11.1.5 Key Developments
11.2 SSS MICROTEC AG.
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Financial Overview
11.2.4 SWOT Analysis
11.2.5 Key Developments
11.3 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Financial Overview
11.3.4 SWOT Analysis
11.3.5 Key Developments
11.4 INTEL CORPORATION
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Financial Overview
11.4.4 SWOT Analysis
11.4.5 Key Developments
11.5 QUALCOMM TECHNOLOGIES, INC.
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Financial Overview
11.5.4 SWOT Analysis
11.5.5 Key Developments
11.6 UNITED MICROELECTRONICS CORPORATION
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Financial Overview
11.6.4 SWOT Analysis
11.6.5 Key Developments
11.7 SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Financial Overview
11.7.4 SWOT Analysis
11.7.5 Key Developments
11.8 AMKOR TECHNOLOGY INC.
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Financial Overview
11.8.4 SWOT Analysis
11.8.5 Key Developments
11.9 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Financial Overview
11.9.4 SWOT Analysis
11.9.5 Key Developments
11.10 STATS CHIPPAC LTD.
11.10.1 Key Facts
11.10.2 Business Description
11.10.3 Financial Overview
11.10.4 SWOT Analysis
11.10.5 Key Developments
12 APPENDIX
12.1 ABOUT THE INSIGHT PARTNERS
12.2 GLOSSARY OF TERMS
12.3 RESEARCH METHODOLOGY
1 INTRODUCTION
1.1 THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
2 KEY TAKEAWAYS
3 ADVANCED PACKAGING MARKET LANDSCAPE
3.1 OVERVIEW
3.2 MARKET SEGMENTATION
3.2.1 Advanced Packaging Market - By Technology
3.2.2 Advanced Packaging Market - By Application
3.2.3 Advanced Packaging Market - By Region
3.2.3.1 By Countries
3.2.4 PEST Analysis
3.2.4.1 North America - PEST Analysis
3.2.4.2 Europe - PEST Analysis
3.2.4.3 Asia Pacific (APAC) - PEST Analysis
3.2.4.4 Rest of the World (RoW) - PEST Analysis
4 ADVANCED PACKAGING MARKET - KEY INDUSTRY DYNAMICS
4.1 KEY MARKET DRIVERS
4.2 KEY MARKET RESTRAINTS
4.3 KEY MARKET OPPORTUNITIES
4.4 FUTURE TRENDS
4.5 IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS
5 ADVANCED PACKAGING MARKET - GLOBAL MARKET ANALYSIS
5.1 ADVANCED PACKAGING- GLOBAL MARKET OVERVIEW
5.2 ADVANCED PACKAGING- GLOBAL MARKET AND FORECAST TO 2025
6 ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2025 - TECHNOLOGY
6.1 OVERVIEW
6.2 TECHNOLOGY MARKET FORECASTS AND ANALYSIS
6.3 WAFER-LEVEL CHIP-SCALE PACKAGING MARKET
6.3.1 Overview
6.3.2 Wafer-level Chip-scale Packaging market forecast and analysis
6.4 3D INTEGRATED CIRCUIT PACKAGING MARKET
6.4.1 Overview
6.4.2 3D Integrated Circuit Packaging market forecast and analysis
6.5 SILICON IN PACKAGE MARKET
6.5.1 Overview
6.5.2 Silicon in Package market forecast and analysis
6.6 3D WAFER LEVEL PACKAGE MARKET
6.6.1 Overview
6.6.2 3D Wafer Level Package market forecast and analysis
6.7 2.5 D MARKET
6.7.1 Overview
6.7.2 2.5 D market forecast and analysis
6.8 FLIP CHIP MARKET
6.8.1 Overview
6.8.2 Flip Chip market forecast and analysis
6.9 OTHERS MARKET
6.9.1 Overview
6.9.2 Others market forecast and analysis
7 ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2025 - APPLICATION
7.1 OVERVIEW
7.2 APPLICATION MARKET FORECASTS AND ANALYSIS
7.3 CONSUMER ELECTRONICS MARKET
7.3.1 Overview
7.3.2 Consumer Electronics market forecast and analysis
7.4 AUTOMOTIVE MARKET
7.4.1 Overview
7.4.2 Automotive market forecast and analysis
7.5 IT & TELECOMMUNICATION MARKET
7.5.1 Overview
7.5.2 IT & Telecommunication market forecast and analysis
7.6 HEALTHCARE MARKET
7.6.1 Overview
7.6.2 Healthcare market forecast and analysis
7.7 AEROSPACE & DEFENSE MARKET
7.7.1 Overview
7.7.2 Aerospace & Defense market forecast and analysis
7.8 OTHERS MARKET
7.8.1 Overview
7.8.2 Others market forecast and analysis
8 ADVANCED PACKAGING MARKET REVENUE AND FORECASTS TO 2025 - GEOGRAPHICAL ANALYSIS
8.1 NORTH AMERICA
8.1.1 North America Advanced Packaging Market Overview
8.1.2 North America Advanced Packaging Market Forecasts and Analysis
8.1.3 North America Market Forecasts and Analysis - By Countries
8.1.3.1 US market
8.1.3.2 Canada market
8.1.3.3 Mexico market
8.1.4 North America Market Forecasts and Analysis - By Technology
8.1.5 North America Market Forecasts and Analysis - By Application
8.2 EUROPE
8.2.1 Europe Advanced Packaging Market Overview
8.2.2 Europe Advanced Packaging Market Forecasts and Analysis
8.2.3 Europe Market Forecasts and Analysis - By Countries
8.2.3.1 France market
8.2.3.2 Germany market
8.2.3.3 Italy market
8.2.3.4 Spain market
8.2.3.5 UK market
8.2.4 Europe Market Forecasts and Analysis - By Technology
8.2.5 Europe Market Forecasts and Analysis - By Application
8.3 ASIA PACIFIC (APAC)
8.3.1 Asia Pacific Advanced Packaging Market Overview
8.3.2 Asia Pacific Advanced Packaging Market Forecasts and Analysis
8.3.3 Asia Pacific Market Forecasts and Analysis - By Countries
8.3.3.1 South Korea market
8.3.3.2 China market
8.3.3.3 Taiwan market
8.3.3.4 Japan market
8.3.4 Asia Pacific Market Forecasts and Analysis - By Technology
8.3.5 Asia Pacific Market Forecasts and Analysis - By Application
8.4 REST OF THE WORLD (ROW)
8.4.1 Rest of the World Advanced Packaging Market Overview
8.4.2 Rest of the World Advanced Packaging Market Forecasts and Analysis
8.4.3 Rest of the World Market Forecasts and Analysis - By Countries
8.4.3.1 Africa market
8.4.3.2 Middle East market
8.4.3.3 South America market
8.4.4 Rest of the World Market Forecasts and Analysis - By Technology
8.4.5 Rest of the World Market Forecasts and Analysis - By Application
9 INDUSTRY LANDSCAPE
9.1 MERGERS & ACQUISITIONS
9.2 MARKET INITIATIVES
9.3 NEW DEVELOPMENTS
9.4 INVESTMENT SCENARIOS
10 COMPETITIVE LANDSCAPE
10.1 COMPETITIVE PRODUCT MAPPING
10.2 MARKET POSITIONING/ MARKET SHARE
11 ADVANCED PACKAGING MARKET, KEY COMPANY PROFILES
11.1 ADVANCED SEMICONDUCTOR ENGINEERING INC.
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Financial Overview
11.1.4 SWOT Analysis
11.1.5 Key Developments
11.2 SSS MICROTEC AG.
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Financial Overview
11.2.4 SWOT Analysis
11.2.5 Key Developments
11.3 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Financial Overview
11.3.4 SWOT Analysis
11.3.5 Key Developments
11.4 INTEL CORPORATION
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Financial Overview
11.4.4 SWOT Analysis
11.4.5 Key Developments
11.5 QUALCOMM TECHNOLOGIES, INC.
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Financial Overview
11.5.4 SWOT Analysis
11.5.5 Key Developments
11.6 UNITED MICROELECTRONICS CORPORATION
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Financial Overview
11.6.4 SWOT Analysis
11.6.5 Key Developments
11.7 SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Financial Overview
11.7.4 SWOT Analysis
11.7.5 Key Developments
11.8 AMKOR TECHNOLOGY INC.
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Financial Overview
11.8.4 SWOT Analysis
11.8.5 Key Developments
11.9 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Financial Overview
11.9.4 SWOT Analysis
11.9.5 Key Developments
11.10 STATS CHIPPAC LTD.
11.10.1 Key Facts
11.10.2 Business Description
11.10.3 Financial Overview
11.10.4 SWOT Analysis
11.10.5 Key Developments
12 APPENDIX
12.1 ABOUT THE INSIGHT PARTNERS
12.2 GLOSSARY OF TERMS
12.3 RESEARCH METHODOLOGY
The List of Companies
1. Advanced Semiconductor Engineering Inc.
2. SSS MicroTec AG.
3. Semiconductor Manufacturing International Corporation
4. Intel Corporation
5. Qualcomm Technologies, Inc.
6. United Microelectronics Corporation
7. Siliconware Precision Industries Co., Ltd. (SPIL)
8. Amkor Technology Inc.
9. Taiwan Semiconductor Manufacturing Company
10. STATS ChipPAC Ltd.
1. Advanced Semiconductor Engineering Inc.
2. SSS MicroTec AG.
3. Semiconductor Manufacturing International Corporation
4. Intel Corporation
5. Qualcomm Technologies, Inc.
6. United Microelectronics Corporation
7. Siliconware Precision Industries Co., Ltd. (SPIL)
8. Amkor Technology Inc.
9. Taiwan Semiconductor Manufacturing Company
10. STATS ChipPAC Ltd.