RF GaN Semiconductor Device Market Size, Share, Growth, Trends, and Forecast by 2031

Historic Data: 2021-2023   |   Base Year: 2024   |   Forecast Period: 2025-2031

Coverage: RF GaN Semiconductor Device Market covers analysis by Material (GaN-On-SiC, GaN-On-Silicon, GaN-On-Diamond); Applications (Wireless Infrastructure, Power Storage, Satellite Communication, PV Inverter, Others); End-Users (Aerospace and Defense, IT and Telecom, Consumer Electronics, Automotive, Others) , and Geography (North America, Europe, Asia Pacific, and South and Central America)

  • Report Code : TIPRE00010128
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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MARKET INTRODUCTION



RF GaN is one of the developing technologies for power electronics applications that need high-power density RF performance. There are several services and products which use RF-based power amplifiers in their transmitter circuitry. The GaN has a large bandgap owning to which the GaN material has a high breakdown field, letting the GaN device to function at higher voltages than normal semiconductor devices.

MARKET DYNAMICS



The increase in demand for gallium nitride in automotive and consumer electronics, the success of gallium nitride in RF power electronics, wide bandgap property of gallium nitride material encouraging innovative applications, and increasing adoption of gallium nitride RF semiconductor device in defense, military, and aerospace application are some of the significant factors driving the growth of the RF GaN Semiconductor Device Market. Moreover, the growing demand for RF GaN devices for IT & telecommunication equipment is anticipated to boost the growth of the RF GaN Semiconductor Device Market

MARKET SCOPE



The "Global RF GaN Semiconductor Device Market Analysis to 2031" is a specialized and in-depth study of the RF GaN semiconductor device market with a special focus on the global market trend analysis. The report aims to provide an overview of RF GaN semiconductor device market with detailed market segmentation by material, applications, end user. The global RF GaN semiconductor device market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading RF GaN semiconductor device market players and offers key trends and opportunities in the RF GaN semiconductor device market.

MARKET SEGMENTATION



The global RF GaN semiconductor device market is segmented on the basis of material, applications, end user. On the basis of material, the market is segmented as GaN-On-SiC, GaN-On-Silicon, GaN-On-diamond. On the basis of applications, the market is segmented as wireless infrastructure, power storage satellite communication, PV inverter, others. On the basis of end user, the market is segmented as aerospace and defense, IT and Telecom, consumer electronics, automotive, others.

REGIONAL FRAMEWORK



The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global RF GaN semiconductor device market based on various segments. It also provides market size and forecast estimates from year 2021 to 2031 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The RF GaN semiconductor device market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.

The report analyzes factors affecting RF GaN semiconductor device market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the RF GaN semiconductor device market in these regions.

MARKET PLAYERS



The reports cover key developments in the RF GaN semiconductor device market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from RF GaN semiconductor device market are anticipated to lucrative growth opportunities in the future with the rising demand for RF GaN semiconductor device market. Below mentioned is the list of few companies engaged in the RF GaN semiconductor device market.

The report also includes the profiles of key RF GaN semiconductor device market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.


  •  Cree, Inc
  •  Hitachi, Ltd.
  •  Infineon Technologies AG
  •  Mitsubishi Electric Corporation
  •  Panasonic Corporation
  •  Raytheon Company.
  •  Renesas Electronics Corporation
  •  STMicroelectronics
  •  Sumitomo Electric Industries, Ltd.
  •  Toshiba


The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.

RF GaN Semiconductor Device Report Scope

Report Attribute Details
Market size in 2024 US$ XX million
Market Size by 2031 US$ XX Million
Global CAGR (2025 - 2031) XX%
Historical Data 2021-2023
Forecast period 2025-2031
Segments Covered By Material
  • GaN-On-SiC
  • GaN-On-Silicon
  • GaN-On-Diamond
By Applications
  • Wireless Infrastructure
  • Power Storage
  • Satellite Communication
  • PV Inverter
By End-Users
  • Aerospace and Defense
  • IT and Telecom
  • Consumer Electronics
  • Automotive
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Cree, Inc
  • Hitachi, Ltd.
  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • Panasonic Corporation
  • Raytheon Company.
  • Renesas Electronics Corporation
  • STMicroelectronics
  • Sumitomo Electric Industries, Ltd.
    • Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
    • PEST and SWOT Analysis
    • Market Size Value / Volume - Global, Regional, Country
    • Industry and Competitive Landscape
    • Excel Dataset
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    Report Coverage

    Report Coverage

    Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

    Segment Covered

    Segment Covered

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    to segments covered.

    Regional Scope

    Regional Scope

    North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

    Country Scope

    Country Scope

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    to country scope.

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    The List of Companies

    1. Cree, Inc
    2. Hitachi, Ltd.
    3. Infineon Technologies AG
    4. Mitsubishi Electric Corporation
    5. Panasonic Corporation
    6. Raytheon Company.
    7. Renesas Electronics Corporation
    8. STMicroelectronics
    9. Sumitomo Electric Industries, Ltd.
    10. Toshiba
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