North America SiP Technology Market Trends and Analysis by 2027

North America SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

Report Date : Jan 2021
Report Code : TIPRE00018173

Category : Electronics and Semiconductor
Status : Published

Available Report Formats :
No. of Pages : 135

The SiP technology market in North America is expected to grow from US$ 4553.9 million in 2019 to US$ 7676.1 million by 2027; it is estimated to grow at a CAGR of 9.1% from 2020 to 2027.

The US, Canada, and Mexico are major economies in North America. Electronic miniaturization is at high demand and this is the major factor driving the North America SiP technology market. Growing trend of the small form factor based handheld electronic devices is one of the major factors, which accelerates market growth. The technological advancement in electronics forming such as miniaturization has influenced various markets such as military, aerospace, medical, media, retail and consumer electronics. The devices with small form factor-based packages embed more functionality and becoming alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphone, compact PCs and others devices are occupied with system in package technology-based components such as processor, sensors, RF modules and others. Continuous development in advanced packaging technology such as 3D IC, 2.5D IC and others are further supplementing the North America SiP technology market by resolving the technical challenges. The innovation is solutions is enhancing device performance as smaller space increase connectivity and control. Market players are also taking effort to further optimize the system in package technology for better solution formation. Apple Company is announced to use system in package technology for upcoming devices to reduce the size through miniaturization. Hence the Such rising development and demand for miniaturized electronics devices is expected to create a significant demand for SiP technology in the coming years, which would ultimately drive the market in North America.

Further, the ongoing COVID-19 is having a very devastating impact over the North America region. Presently, the US is the worst-affected country due to the COVID-19 outbreak. North America is one of the most important regions for the adoption and growth of new technologies owing to favorable government policies to boost innovation, the presence of a high-tech companies, and high purchasing power, especially in developed countries such as the US and Canada. North American market suffered huge loss in the first half of 2020 owing to high number of COVID-19 patient’s cases, specifically in the US. Post lockdown a market witnessed increasing demand for the digital devices. North America is among the eminent regions in the adoption of advanced network connection devices owing to favorable infrastructure support for high speed internet services. The adoption of the 5G network is supposed to drive the market growth post lockdown. The effect has major impact on manufacturing facilities as production capacities was lowered. Although, the demand for electronics remained still which helped the market to resume the growth. For instance, in December, 2020, Qualcomm Inc a leading manufacturer of microprocessors has predicted that shipments of 5G smartphones will double in year 2022, driven by increasing 5G network deployment. Such increasing adoption of 5G network is lowering the COVID-19 impact for the post lockdown period, while in lockdown it certainly hampered the market growth.

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North America SiP Technology Market Segmentation

North America SiP Technology Market – By Packaging Technology

2D IC
2.5D IC
3D IC

North America SiP Technology Market – By Packaging Type

Flip-Chip/Wire-Bond SiP
Fan-Out SiP
Embedded SiP

North America SiP Technology Market – By Interconnection Technique

Small Outline
Flat Packages
Pin Grid Arrays
Surface Mount
Others

North America SiP Technology Market – By End-User Industry

Automotive
Aerospace and Defense
Consumer Electronics
Telecommunication
Others

North America SiP Technology Market, by Country

US
Canada
Mexico

North America SiP Technology Market - Companies Mentioned

Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
ChipMOS TECHNOLOGIES INC.
JCET Group Co., Ltd.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments Incorporated

Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered

Packaging Technology, Packaging Type, Interconnection technique, and End-User Industry

Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope

US, Canada

TABLE OF CONTENTS

1. Introduction

1.1 Scope of the Study

1.2 The Insight Partners Research Report Guidance

1.3 Market Segmentation

1.3.1 North America System in Package (SiP) Technology Market – By Packaging Technology

1.3.2 North America System in Package (SiP) Technology Market – By Packaging Type

1.3.3 North America System in Package (SiP) Technology Market – By Interconnection Technology

1.3.4 North America System in Package (SiP) Technology Market – By End-User Industry

1.3.5 North America System in Package (SiP) Technology Market – By Country

2. Key Takeaways

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. North America SiP Technology – Market Landscape

4.1 Market Overview

4.2 North America PEST Analysis

4.3 Ecosystem Analysis

5. North America SiP Technology –Market Dynamics

5.1 Key Market Drivers

5.1.1 Electronic Miniaturization at High Demand

5.1.2 5G Network Services Developing at Fast Pace

5.2 Key Market Restraints

5.2.1 Issues Related to Technology and Other Alternatives

5.3 Key Market Opportunities

5.3.1 Smartphone and PC performance To Enhance Due to Rising Demand

5.4 Future Trends

5.4.1 Wearable technology including IoT Witnessing Growth

5.5 Impact Analysis of Drivers and Restraints

6. SiP Technology Market – North America Analysis

6.1 North America System in Package (SiP) Technology Market Overview

6.2 North America System in Package (SiP) Technology Market Revenue Forecast and Analysis

6.3 Market Positioning – Five Key Players

7. North America SiP Technology Market Analysis – by Packaging Technology

7.1 Overview

7.2 North America SiP Technology Market Breakdown, by packaging technology, 2019 & 2027

7.3 2D IC

7.3.1 Overview

7.3.2 2D IC Market Forecast and Analysis

7.4 2.5D IC

7.4.1 Overview

7.4.2 2.5D IC Market Forecast and Analysis

7.5 3D IC

7.5.1 Overview

7.5.2 3D IC Market Forecast and Analysis

8. North America SiP Technology Market Analysis – Packaging Type

8.1 Overview

8.2 North America SiP Technology Market Breakdown, By Packaging Type, 2019 &2027

8.3 Flip-Chip/Wire-Bond SiP Market

8.3.1 Overview

8.3.2 Flip-Chip/Wire-Bond SiP Market Forecast and Analysis

8.4 Fan-Out SiP Market

8.4.1 Overview

8.4.2 Fan-Out SiP Market Forecast and Analysis

8.5 Embedded SiP Market

8.5.1 Overview

8.5.2 Embedded SiP Market Forecast and Analysis

9. North America SiP Technology Market Analysis – By Interconnection Technique

9.1 Overview

9.2 North America SiP technology Market Breakdown, By Interconnection Technique, 2019 &2027

9.3 Small Outline

9.3.1 Overview

9.3.2 Small Outline Market Forecast and Analysis

9.4 Flat Packages

9.4.1 Overview

9.4.2 Flat Packages Market Forecast and Analysis

9.5 Pin Grid Arrays

9.5.1 Overview

9.5.2 Pin Grid Arrays Market Forecast and Analysis

9.6 Surface Mount

9.6.1 Overview

9.6.2 Surface Mount Market Forecast and Analysis

9.7 Others

9.7.1 Overview

9.7.2 Others Market Forecast and Analysis

10. North America SiP Technology Market Analysis – By End-User Industry

10.1 Overview

10.2 North America SiP technology Market Breakdown, By END-USER INDUSTRY, 2017 &2027

10.3 Automotive

10.3.1 Overview

10.3.2 Automotive Market Forecast and Analysis

10.4 Aerospace & Defense

10.4.1 Overview

10.4.2 Aerospace and Defense Market Forecast and Analysis

10.5 Consumer Electronics

10.5.1 Overview

10.5.2 Consumer Electronics

10.6 Telecommunications

10.6.1 Overview

10.6.2 Telecommunication Market Forecast and Analysis

10.7 Others

10.7.1 Overview

10.7.2 Others Market Forecast and Analysis

11. North America SiP Technology Market – Country Analysis

11.1 Overview

11.1.1 North America: SiP technology Market, By Country

11.1.2 United States: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)

11.1.2.1 United States System in Package (SiP) Technology Market, by Packaging Technology

11.1.2.2 United States System in Package (SiP) Technology Market, by Packaging Type

11.1.2.3 United States System in Package (SiP) Technology Market, by Interconnection Technology

11.1.2.4 United States System in Package (SiP) Technology Market, by End-user Industry

11.1.3 Canada: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)

11.1.3.1 Canada System in Package (SiP) Technology Market, by Packaging Technology

11.1.3.2 Canada System in Package (SiP) Technology Market, by Packaging Type

11.1.3.3 Canada System in Package (SiP) Technology Market, by Interconnection Technology

11.1.3.4 Canada System in Package (SiP) Technology Market, by End-user

11.1.4 Mexico: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)

11.1.4.1 Mexico System in Package (SiP) Technology Market, by Packaging Technology

11.1.4.2 Mexico System in Package (SiP) Technology Market, by Packaging

11.1.4.3 Mexico System in Package (SiP) Technology Market, by Interconnection Technology

11.1.4.4 Mexico System in Package (SiP) Technology Market, by End-user Industry

12. North America SiP Technology Market - COVID-19 Impact Analysis

12.1 North America: Impact Assessment of COVID-19 Pandemic

13. Industry Landscape

13.1 Overview

13.2 Market Initiative

14. Company Profiles

14.1 Amkor Technology, Inc.

14.1.1 Key Facts

14.1.2 Business Description

14.1.3 Products and Services

14.1.4 Financial Overview

14.1.5 SWOT Analysis

14.1.6 Key Developments

14.2 ASE Technology Holding Co. Ltd

14.2.1 Key Facts

14.2.2 Business Description

14.2.3 Products and Services

14.2.4 Financial Overview

14.2.5 SWOT Analysis

14.2.6 Key Developments

14.3 ChipMOS TECHNOLOGIES INC.

14.3.1 Key Facts

14.3.2 Business Description

14.3.3 Products and Services

14.3.4 Financial Overview

14.3.5 SWOT Analysis

14.3.6 Key Developments

14.4 JCET Group Co., Ltd.

14.4.1 Key Facts

14.4.2 Business Description

14.4.3 Products and Services

14.4.4 SWOT Analysis

14.4.5 Key Developments

14.5 QUALCOMM INCORPORATED

14.5.1 Key Facts

14.5.2 Business Description

14.5.3 Products and Services

14.5.4 Financial Overview

14.5.5 SWOT Analysis

14.5.6 Key Developments

14.6 Samsung

14.6.1 Key Facts

14.6.2 Business Description

14.6.3 Products and Services

14.6.4 Financial Overview

14.6.5 SWOT Analysis

14.6.6 Key Developments

14.7 Renesas Electronics Corporation

14.7.1 Key Facts

14.7.2 Business Description

14.7.3 Products and Services

14.7.4 Financial Overview

14.7.5 SWOT Analysis

14.7.6 Key Developments

14.8 Texas Instruments Incorporated

14.8.1 Key Facts

14.8.2 Business Description

14.8.3 Products and Services

14.8.4 Financial Overview

14.8.5 SWOT Analysis

14.8.6 Key Developments

14.9 Taiwan Semiconductor Manufacturing Company, Limited

14.9.1 Key Facts

14.9.2 Business Description

14.9.3 Products and Services

14.9.4 Financial Overview

14.9.5 SWOT Analysis

14.9.6 Key Developments

15. Appendix

15.1 About The Insight Partners

15.2 Glossary of Terms

LIST OF TABLES

Table 1. North America System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)

Table 2. United States System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 3. United States System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 4. United States System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 5. United States System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 6. Canada System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 7. Canada System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 8. Canada System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 9. Canada System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 10. Mexico System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 11. Mexico System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 12. Mexico System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 13. Mexico System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 14. Glossary of Terms

LIST OF FIGURES

Figure 1. North America System in Package (SiP) Technology Market Segmentation

Figure 2. North America System in Package (SiP) Technology Market Segmentation – Country

Figure 3. North America System in Package (SiP) Technology Market Overview

Figure 4. US Held the Largest Share in North America System in Package (SiP) Technology Market in 2019

Figure 5. North America System in Package (SiP) Technology Market, By Packaging Technology

Figure 6. North America System in Package (SiP) Technology Market, By Packaging Type

Figure 7. North America System in Package (SiP) Technology Market, By Interconnection Technology

Figure 8. North America System in Package (SiP) Technology Market, By End-User Industry

Figure 9. North America: PEST Analysis

Figure 10. North America System in package (SiP) technology Market- Ecosystem Analysis

Figure 11. North America System in package (SiP) technology Market Impact Analysis of Drivers and Restraints

Figure 12. North America System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)

Figure 13. North America SiP technology Market Breakdown, by packaging technology, 2019 & 2027 (%)

Figure 14. North America 2D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 15. 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 16. North America 3D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 17. North America SiP Technology Market Breakdown, By Packaging Type, 2019 & 2027 (%)

Figure 18. North America Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)

Figure 19. North America Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 20. North America Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 21. North America SiP Technology Market Breakdown, By Interconnection Technique, 2019 &2027 (%)

Figure 22. North America Small Outline Market Revenue and Forecast to 2027 (US$ Mn)

Figure 23. North America Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)

Figure 24. North America Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)

Figure 25. North America Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)

Figure 26. North America Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 27. North America SiP Technology Market Breakdown, By END-USER INDUSTRY, 2019 &2027 (%)

Figure 28. North America Automotive Market Revenue and Forecast to 2027 (US$ Mn)

Figure 29. North America Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)

Figure 30. North America Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)

Figure 31. North America Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)

Figure 32. North America Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 33. North America SiP Technology Market Revenue Share, By Country (2019 and 2027)

Figure 34. United States: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)

Figure 35. Canada: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)

Figure 36. Mexico: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)

Figure 37. Impact of COVID-19 Pandemic in North American Country Markets

Some of the leading companies are:

Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
ChipMOS TECHNOLOGIES INC.
JCET Group Co., Ltd.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments Incorporated

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
Validates and strengthens in-house secondary research findings
Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

Industry participants: VPs, business development managers, market intelligence managers and national sales managers
Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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