Emea And Apac Solder Materials Market Scope And Analysis

  • Report Code : TIPRE00039009
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 159
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EMEA and APAC Solder Materials Market Scope, Analysis, and Trends by 2030

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EMEA and APAC Solder Materials Market Report Scope

Report Attribute Details
Market size in 2022 US$ 4.73 Billion
Market Size by 2030 US$ 6.72 Billion
Global CAGR (2022 - 2030) 4.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By Product
  • Paste
  • Bar
  • Wire
  • Spheres
By Process
  • Printer
  • Laser
  • Wave
  • Reflow
Regions and Countries Covered Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
Market leaders and key company profiles
  • AIM Metals Alloys LP
  • KOKI Co Ltd
  • Fusion Inc
  • Stannol GmbH Co KG
  • National Solder Co PTY Ltd
  • Nihon Superior Co Ltd
  • GENMA Europe GmbH
  • Indium Corp
  • Element Solutions Inc