North America Hermetic Packaging Market Scope And Analysis

  • Report Code : TIPRE00007126
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 150
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North America Hermetic Packaging Market Analysis, Trends, and Scope 2019 to 2027

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North America Hermetic Packaging Market Report Scope

Report Attribute Details
Market size in 2018 US$ 1.16 Billion
Market Size by 2027 US$ 2.02 Billion
Global CAGR (2019 - 2027) 6.4%
Historical Data 2016-2017
Forecast period 2019-2027
Segments Covered By Product
  • Passivation Glass
  • Transponder Glass
  • Reed Glass
  • Glass-to-Metal Sealing
  • Ceramic-to-Metal Sealing
By Application
  • Transistors
  • MEMS
  • Sensors
  • Lasers
  • Photo Diodes
  • Airbag Ignitors
By Industry Vertical
  • Aerospace
  • Medical
  • Telecommunications
  • Consumer Electronics
  • Military and Defense
  • Automotive
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Market leaders and key company profiles
  • Ametek Inc
  • Egide SA
  • Kyocera Corporation
  • Legacy Technologies Inc
  • Materion Corporation
  • Micross Components
  • Renesas Electronics Corporation
  • Schott AG
  • Teledyne Technologies Incorporated