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Southeast Asia Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00030090
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 117
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Southeast Asia Redistribution Layer Material Market Scope and Analysis by 2030

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Southeast Asia Redistribution Layer Material Market Report Southeast Asia Redistribution Layer Material Market Size and Share Southeast Asia Redistribution Layer Material Market Scope and Analysis

Southeast Asia Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 54.51 Million
Market Size by 2030 US$ 150.11 Million
Global CAGR (2022 - 2030) 13.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By Type
  • Polyimide
  • Polybenzoxazole
  • Benzocylobutene
By Application
  • Fan-Out Wafer Level Packaging
  • 2 5D/3D IC Packaging
Regions and Countries Covered Southeast Asia
  • Southeast Asia
Market leaders and key company profiles
  • Advanced Semiconductor Engineering Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co Ltd
  • Shin Etsu Chemical Co Ltd
  • SK Hynix Inc