基于(关键地区、市场参与者、规模和份额)的集成无源器件市场 - 到 2031 年的预测

  • Report Code : TIPEL00002371
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 177
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2018 年全球集成无源器件市场规模为 8.206 亿美元,预计 2019 年预测期内复合年增长率为 8.3% –到 2027 年,这一数字将达到 16.478 亿美元。

亚太地区预计将成为集成无源器件市场增长最快的市场。亚太地区地域广阔,工业和经济增长迅猛,预计IPD的大量应用将促进亚太地区集成无源器件市场的增长。此外,北美国家的消费电子产品使用率较高,由于该地区技术先进,加上个人可支配收入较高,消费电子行业在该地区蓬勃发展。 2018 年北美地区的消费电子产品总支出超过 1,159 亿美元,预计将推动该地区的集成无源器件市场。

 利润丰厚的区域市场

市场洞察

消费电子产品的高采用率

消费电子行业在全球范围内经历了巨大的增长,并且是主要驱动力推动这种增长的是对小型化的需求。在当前情况下,全球消费者使用多种消费电子设备来执行多种任务。平板电脑、智能手表、智能手机等消费电子设备已成为用户生活中必不可少的一部分。生活方式。随着技术的进步,消费设备变得越来越智能。支持人工智能的应用程序增强了对更便宜的芯片组的需求,这些芯片组需要更少的设备内部安装空间。由于多家半导体公司定期推出吸引该行业的先进技术,消费电子市场正在快速增长。这将在预测期内推动集成无源器件市场。

定制集成无源器件(IPD)的新兴需求

电信等各行业对先进电子器件的需求不断增长、医疗保健、汽车等领域对设备小型化的要求日益增加。 IPD 集成在这些电子设备中,即: RF IPD 集成到包括移动电话和平板电脑在内的连接设备中。这些产品通过引线键合、微凸块等多种组装方式互连,从而为根据客户的要求定制产品提供了空间。最终用户要求芯片制造商使用IPD代替分立元件来定制芯片,以满足器件小型化的需求,这是集成无源器件市场即将到来的趋势。

Material Insights< /p>

按材料划分的全球集成无源器件市场以硅材料类型细分市场为主导。集成无源器件市场考虑的其他材料包括玻璃等。

应用见解

集成无源器件市场按应用分为 ESD/EMI 保护、数字和混合信号、射频 IPD 等。电子设备、汽车信息娱乐系统、智能可穿戴设备和其他物联网设备的采用不断增加。然而,技术的快速变化需要制造设备的不断变化。此外,定制 IPD 的普及和 5G 技术的蓬勃发展预计将为集成无源器件市场的主要参与者提供巨大的增长机会。

欧洲集成无源器件市场(按应用)


战略洞察

新的市场举措被认为是全球集成无源器件市场最常采用的战略。下面列出了最近的一些市场举措:

2019 年:意法半导体宣布与 Truphone 合作,向 Murata 提供其技术,为 IoT/M2M 设备领域推出低功耗蜂窝模块。

2018 年:3D Glass Solutions 宣布在阿尔伯克基设立新总部,并在未来五年投资约 2300 万美元。通过此次扩张,公司专注于科学和技术领域的持续增长。

2018 年:恩智浦半导体与塔塔咨询服务公司签署协议,共同为汽车、安全和物联网行业开发独特的解决方案。

2018 年:恩智浦半导体与塔塔咨询服务公司签署协议,共同为汽车、安全和物联网行业开发独特的解决方案。 >

全球集成无源器件 –市场细分

按材料

  • 玻璃
  • 其他

按产品

  • 巴伦
  • 滤波器
  • 双工器
  • 耦合器
  • 其他
  • 按应用

    • ESD/EMI 保护
    • 数字和混合信号
    • RF IPD
    • 其他< /li>

    最终用户

    • 消费电子产品
    • 医疗保健
    • 电信
    • 航空航天和国防
    • 汽车

    按地理位置

    • 北美
      • 美国
      • 加拿大< /li>
      • 墨西哥
    • 欧洲
      • 法国
      • 德国
      • 意大利
      • 荷兰
      • 英国
      • 欧洲其他地区
    • 亚太地区 (APAC)
      • 台湾< /li>
      • 中国
      • 印度
      • 韩国
      • 日本
      • 亚太地区其他地区
    • 世界其他地区
      • 中东和非洲 (MEA)
      • 南美洲 (SAM)
    • < /ul>

      公司简介

      • Johanson Technology, Inc.
      • 意法半导体
      • 村田制作所
      • OnChip Devices, Inc.
      • 3D Glass Solutions, Inc.
      • AVX Corporation
      • STATS ChipPAC Pte.有限公司
      • NXP Semiconductors NV
      • 安森美半导体
      • 英飞凌科技
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

This text is related
to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

The List of Companies

  1. Johanson Technology, Inc.
  2. STMicroelectronics N.V.
  3. Murata Manufacturing Co., Ltd.
  4. OnChip Devices, Inc.
  5. 3D Glass Solutions, Inc.
  6. AVX Corporation
  7. STATS ChipPAC Pte. Ltd.
  8. NXP Semiconductors N.V.
  9. ON Semiconductor
  10. Infineon Technologies

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  1. Data Triangulation and Final Review:

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