Emea And Apac Solder Materials Market Scope And Analysis

  • Report Code : TIPRE00039009
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 159
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2030 年欧洲、中东和非洲地区及亚太地区焊料材料市场分析、份额及增长

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EMEA and APAC Solder Materials Market Report Scope

Report Attribute Details
Market size in 2022 US$ 4.73 Billion
Market Size by 2030 US$ 6.72 Billion
Global CAGR (2022 - 2030) 4.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By 产品
  • 膏状
  • 棒状
  • 线状
  • 球状
By 工艺
  • 打印机
  • 激光
  • 波峰焊
  • 回流焊
Regions and Countries Covered
Market leaders and key company profiles
  • AIM Metals & Alloys LP
  • KOKI Co Ltd
  • Fusion Inc
  • Stannol GmbH & Co KG
  • National Solder Co (PTY) Ltd
  • Nihon Superior Co Ltd
  • GENMA Europe GmbH
  • Indium Corp
  • Element Solutions Inc