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Emea And Apac Solder Materials Market Scope And Analysis

  • Report Code : TIPRE00039009
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 159
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2023 年至 2030 年欧洲、中东和非洲地区及亚太地区焊锡材料市场预测及范围

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EMEA and APAC Solder Materials Market Report EMEA and APAC Solder Materials Market Size and Share EMEA and APAC Solder Materials Market Scope and Analysis

EMEA and APAC Solder Materials Market Report Scope

Report Attribute Details
Market size in 2022 US$ 4.73 Billion
Market Size by 2030 US$ 6.72 Billion
Global CAGR (2022 - 2030) 4.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By 产品
  • 膏状
  • 棒状
  • 线状
  • 球状
By 工艺
  • 打印机
  • 激光
  • 波峰焊
  • 回流焊
Regions and Countries Covered 中东和非洲
  • 南非
  • 沙特阿拉伯
  • 阿联酋
  • 中东和非洲其他地区
亚太地区
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太地区其他地区
Market leaders and key company profiles
  • AIM Metals & Alloys LP
  • KOKI Co Ltd
  • Fusion Inc
  • Stannol GmbH & Co KG
  • National Solder Co (PTY) Ltd
  • Nihon Superior Co Ltd
  • GENMA Europe GmbH
  • Indium Corp
  • Element Solutions Inc