Southeast Asia Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00030090
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 117
Buy Now

2023-2030 年东南亚再分配层材料市场预测及范围

Buy Now

Southeast Asia Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 54.51 Million
Market Size by 2030 US$ 150.11 Million
Global CAGR (2022 - 2030) 13.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By 类型
  • 聚酰亚胺
  • 聚苯并恶唑
  • 苯并环丁烯
By 应用
  • 扇出型晶圆级封装
  • 25D/3D IC封装
Regions and Countries Covered 东南亚
  • 东南亚
Market leaders and key company profiles
  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc