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Southeast Asia Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00030090
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 117
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2023-2030 年东南亚再分配层材料市场预测及范围

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Southeast Asia Redistribution Layer Material Market Report Southeast Asia Redistribution Layer Material Market Size and Share Southeast Asia Redistribution Layer Material Market Scope and Analysis

Southeast Asia Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 54.51 Million
Market Size by 2030 US$ 150.11 Million
Global CAGR (2022 - 2030) 13.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By 类型
  • 聚酰亚胺
  • 聚苯并恶唑
  • 苯并环丁烯
By 应用
  • 扇出型晶圆级封装
  • 25D/3D IC封装
Regions and Countries Covered 东南亚
  • 东南亚
Market leaders and key company profiles
  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc