3D Stacking Market is expected to reach US$ 5.93 billion by 2030

3D Stacking Market: Key Insights

According to our latest study on "3D Stacking Market Global and Regional Share, Trend, and Growth Opportunity Analysis – by Interconnecting Technology, Device Type, End User, and Geography," the market was valued at US$ 1.81 billion in 2022 and is expected to reach US$ 5.93 billion by 2030; it is projected to register a CAGR of 16.0% from 2022 to 2030. The growing adoption of 3D stacking technology to provide shorter interconnects and reduce power consumption is a key factor contributing to the 3D stacking market growth. This technology enables faster data processing and reduces latency, benefiting data analytics, machine learning, and cloud computing.

The scope of the 3D stacking market report covers North America (the US, Canada, and Mexico), Europe (Spain, the UK, Germany, France, Italy, and the Rest of Europe), Asia Pacific (South Korea, China, India, Japan, Australia, and the Rest of Asia Pacific), Middle East & Africa (South Africa, Saudi Arabia, the UAE, and the Rest of Middle East & Africa), and South & Central America (Brazil, Argentina, and the Rest of South & Central America). The Asia Pacific 3D stacking market includes countries such as Japan, China, South Korea, India, Taiwan, Australia, and the Rest of Asia-Pacific. Rapid technological advancements and the adoption of 3D stacking solutions in the region are the primary drivers for the market in the region. Countries such as China, Taiwan, South Korea, and Japan serve as global manufacturing hubs for semiconductors and electronic components. This strong industrial base is an important growth factor for the market in the region. Furthermore, the growing adoption of 5G technology, expanding IoT applications, and the growing middle-class population in countries such as China, South Korea, Taiwan, and Japan have driven the demand for energy-efficient semiconductor solutions, leading to an increase in the use of 3D stacked die packaging in the consumer electronics industry. Thus, such application is expected to bring new 3D stacking market trends in the coming years.

The China 3D stacking market is experiencing substantial growth, fueled by various factors shaping the country's urban development landscape. China's booming consumer electronics market, driven by a large population and rising disposable incomes, has fueled the demand for 3D stacking technologies. China has made significant investments in the semiconductor industry, with the government allocating over US$ 150 billion from 2014 to 2030. This has made the country increasingly competitive in certain semiconductor market segments. All these factors collectively contributed to China’s position as a dynamic and influential player within the global 3D stacking market size.

The 3D stacking market in India is poised for substantial growth due to several key factors. India boasts a substantial consumer market for electronic products and a sizable pool of skilled workers, presenting a prime opportunity to establish a local semiconductor ecosystem. The government's recent policies and initiatives, including Make in India, Production Linked Incentive (PLI), and Design Linked Incentive (DLI), are expediting India's ambition to emerge as a global center for electronic system design and manufacturing. The 3D-IC chipset sector also holds significant potential for expansion of 3D stacking market and the creation for commercial third-party chipsets, enabling India to cultivate expertise and assume a pivotal role in the semiconductor industry and contributing to the growing 3D stacking market size in the country.

Increasing Use of Heterogeneous Integration and Component Optimization to Drive 3D Stacking Market Growth

The increasing use of heterogeneous integration and component optimization to improve the manufacturing of electronic components is a major factor driving the growth of the 3D stacking market globally. This approach allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy efficient.

Heterogeneous integration and component optimization involve integrating diverse technologies into a composite device, which may include stacking of chips and packages, using multiple semiconductor materials, and employing various electrical routing techniques such as ball grid arrays, through-silicon vias (TSVs), interposers, and wire bonding. This, in turn, presents a bright future for the 3D stacking market while offering new opportunities for businesses operating in this sector.

3D Stacking Market: Segmental Overview

Based on interconnecting technology, the 3D stacking market is segmented into 3D hybrid bonding, through-silicon via, and monolithic 3D integration. The through-silicon via segment dominated the 3D stacking market share in 2022. The growing demand for compact and advanced consumer electronic products, such as laptops, smartphones, and tablets, is a prime factor driving the market. The need for superior functionality in these devices is pushing the industry toward 3D integration technologies, including TSVs, to improve performance and functionality while lowering costs. Thus, such benefits led to the dominance of the through-silicon via segment in the 3D stacking market share.

3D Stacking Market Analysis: Competitive Landscape and Key Developments

Taiwan Semiconductor Manufacturing Company Limited; Intel Corporation; Advanced Micro Devices; NXP Semiconductors; Broadcom Inc.; ASE Technology; Texas Instruments Incorporated; MediaTek Inc., Amkor Technology; and Samsung Semiconductor, Inc. are a few players profiled in the 3D stacking market report. The market players focus on strategies such as new product launches, expansion and diversification, and acquisition. The 3D stacking market forecast can help stakeholders plan their growth strategies.

• In September 2023, At the TSMC 2023 OIP Ecosystem Forum, TSMC unveiled the new 3Dblox 2.0 open standard and highlighted significant achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0 introduces early 3D IC design capabilities aimed at significantly enhancing design efficiency, while the 3DFabric Alliance continues to drive integration in memory, substrate, testing, manufacturing, and packaging. TSMC is committed to advancing 3D IC innovation and making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to all customers. This strategic move underscores TSMC's dedication to pushing the boundaries of 3D IC innovation and ensuring that its advanced packaging technologies are readily available to a wide range of customers.
  
  
• In December 2023, At the 2023 IEEE International Electron Devices Meeting (IEDM), Intel presented significant advancements in 3D stacked CMOS transistors, incorporating backside power and direct backside contacts. This showcase highlights Intel's commitment to ongoing innovation and the evolution of Moore's Law. The company also outlined strategies for scaling recent research and development breakthroughs in backside power delivery, including the implementation of backside contacts. Notably, Intel achieved a groundbreaking milestone by successfully demonstrating large-scale 3D monolithic integration of silicon transistors with gallium nitride (GaN) transistors on the same 300-millimeter (mm) wafer rather than on a package.

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