3D Stacking Market Forecast to 2030 - Analysis, Growth, Size

The 3D stacking market was valued at US$ 1.81 billion in 2022 and is expected to reach US$ 5.93 billion by 2030; it is projected to register a CAGR of 16.0% from 2022 to 2030. The 3D stacking market report emphasizes the key factors driving the market and showcases the developments of prominent players.

Analyst Perspective:

The growing adoption of 3D stacking technology to provide shorter interconnects and reduce power consumption is a key factor contributing to the 3D stacking market growth. This technology allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy efficient.

Market Overview:

3D stacking technology represents a transformative advancement in the field of semiconductor packaging, offering a paradigm shift in the way electronic components are integrated and interconnected. This cutting-edge technology involves vertically stacking multiple integrated circuit (IC) layers, typically using through-silicon vias (TSVs) to establish connections between the stacked layers. 3D stacking technology holds the potential to revolutionize product design and performance across various industries, providing a means to achieve superior functionality in a more compact form factor.

3D stacking technology enables the efficient integration of disparate components, such as memory, logic, and sensors, into a single package, leading to enhanced performance and reduced footprint. This consolidation of components translates into streamlined manufacturing processes, optimized supply chain management, and, ultimately, cost savings.

Shorter interconnects within a 3D stacked configuration result in reduced power consumption and improved signal integrity, making it an attractive solution for energy-efficient and high-performance applications. Additionally, 3D stacking technology facilitates the development of innovative, feature-rich products, particularly in the consumer electronics sector. The ability to stack memory and logic components vertically allows for the creation of more powerful and compact devices, aligning with the market demand for sleek, high-performance gadgets. Furthermore, this technology empowers businesses to stay at the forefront of technological innovation, fostering a competitive edge in the rapidly evolving landscape of electronic devices and semiconductor solutions.

Customize Research To Suit Your Requirement

We can optimize and tailor the analysis and scope which is unmet through our standard offerings. This flexibility will help you gain the exact information needed for your business planning and decision making.

Get 10% FREE CUSTOMIZATION

3D Stacking Market: Strategic Insights

Market Size Value in	US$ 1.81 billion in 2022
Market Size Value by	US$ 5.93 billion by 2030
Growth rate	CAGR of 16.0% from 2022 to 2030
Forecast Period	2022-2030
Base Year	2022

Naveen

Have a question?

Naveen will walk you through a 15-minute call to present the report’s content and answer all queries if you have any.

 Speak to Analyst

Market Driver:

Rising Demand for Consumer Electronics to Drive 3D Stacking Market Growth

The consumer electronics industry has undoubtedly been at the forefront of the 3D stacking market. The insatiable demand for sleek, feature-rich, and power-efficient gadgets such as smartphones, tablets, smartwatches, and portable devices has placed immense pressure on manufacturers to deliver compact, high-performance solutions. In this context, 3D stacked die packaging emerges as a pivotal enabler, revolutionizing the design and functionality of these devices. One of the most compelling aspects of 3D stacked die packaging is its capability to significantly reduce form factors without compromising performance. By vertically stacking multiple layers of integrated circuits, this technology allows for the seamless integration of diverse components within a compact space. This consolidation not only streamlines the design and assembly processes but also enables manufacturers to create slimmer, more aesthetically appealing devices that align with the evolving preferences of consumers.

The enhanced performance achieved through 3D stacked die packaging is instrumental in meeting the escalating performance demands of modern consumer electronics. From advanced image processing in smartphones to real-time data analysis in smartwatches, the need for efficient and powerful semiconductor solutions is paramount. By leveraging 3D stacking technology, manufacturers can integrate memory, logic, and sensor components in a vertically interconnected manner, thereby enhancing processing capabilities while maintaining a compact form factor. Such benefits associated with the 3D stacking technology are contributing to the growing 3D stacking market size.

Segmentation and Scope:

The 3D stacking market analysis has been carried out by considering the following segments: interconnecting technology, device type, end user, and geography. Based on interconnecting technology, the market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. Based on device type, the 3D stacking market is segmented into memory devices, MEMS/Sensors devices, MEMS/Sensors, LEDs, imaging & optoelectronics, and others. Based on end user, the market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. Based on geography, the market is segmented into North America, Europe, Asia Pacific, the Middle East & Africa, and South & Central America.

Access Data

Segmental Analysis:

Based on end user, the 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment dominated the 3D stacking market share in 2022. The demand for smartphones, tablets, smartwatches, and other portable devices has fueled the need for compact and efficient semiconductor solutions. 3D stacked die packaging, with its ability to reduce form factors and improve performance, allows manufacturers to create slimmer and more feature-rich devices while enhancing battery life, thus driving the 3D stacking market share.

Regional Analysis:

The Asia Pacific 3D stacking market has gained prominence owing to the presence of well-established manufacturing facilities of renowned companies—such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Semiconductor, Inc.—in the region. Moreover, countries such as China, Taiwan, South Korea, and Japan are global manufacturing hubs for semiconductors and electronic components. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones, tablets, and wearables, drives the adoption of 3D stacking technologies in this industry.

Asia Pacific has witnessed remarkable growth in the industrial applications of 3D stacking technologies. Industries such as aerospace, automotive, and healthcare are increasingly utilizing 3D stacking for various purposes. For instance, in the aerospace industry, the demand for lightweight aircraft components has led to the widespread adoption of additive manufacturing, which includes 3D stacking techniques. Thus, the growing application of 3D stacking in the aerospace industry is anticipated to be one of the key 3D stacking market trends in the region.

Key Player Analysis:

Taiwan Semiconductor Manufacturing Company Limited; Intel Corporation; Advanced Micro Devices; NXP Semiconductors; Broadcom Inc.; ASE Technology; Texas Instruments Incorporated; MediaTek Inc., Amkor Technology; and Samsung Semiconductor, Inc. are a few players profiled in the 3D stacking market report. The market players focus on new product launches, expansion and diversification, and acquisition, which allow them to access prevailing business opportunities.

Recent Developments:

Inorganic and organic strategies of the key players, such as mergers and acquisitions, are profiled in the market report. The 3D stacking market forecast can help stakeholders plan their growth strategies. A few recent strategies implemented by key market players are listed below:

• In January 2023, NXP unveiled its latest i.MX 95 family represents a significant advancement for the 9 series in terms of 3D graphics, NPU functionality, and other capabilities. The processor's primary CPU domain features up to six Arm Cortex A55 CPU cores organized in a coherent cluster. Moreover, it incorporates a distinct domain housing a real-time Arm Cortex M7 MCU, along with a low-power real-time domain powered by a low-power (safety) Arm Cortex M33 CPU.
• In September 2023, At the TSMC 2023 OIP Ecosystem Forum, TSMC unveiled the new 3Dblox 2.0 open standard and highlighted significant achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0 introduces early 3D IC design capabilities aimed at significantly enhancing design efficiency, while the 3DFabric Alliance continues to drive integration in memory, substrate, testing, manufacturing, and packaging. TSMC is committed to advancing 3D IC innovation and making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to all customers. This strategic move underscores TSMC's dedication to pushing the boundaries of 3D IC innovation and ensuring that its advanced packaging technologies are readily available to a wide range of customers.
• In October 2023, Samsung Electronics announced that it is presently committed to the research and development of 11nm-level DRAM and ninth-generation 3D NAND Flash. The objective is to elevate integration to an industry-leading level, achieve established mass production plans, and sustain its technological edge. The memory sector is intensifying its focus on NAND with 300 or more layers, driving competition. Notably, Samsung's utilization of double-stack technology entails the sequential manufacture of NAND in two stages, followed by their combination.
• In December 2023, At the 2023 IEEE International Electron Devices Meeting (IEDM), Intel presented significant advancements in 3D stacked CMOS transistors, incorporating backside power and direct backside contacts. This showcase highlights Intel's commitment to ongoing innovation and the evolution of Moore's Law. The company also outlined strategies for scaling recent research and development breakthroughs in backside power delivery, including the implementation of backside contacts. Notably, Intel achieved a groundbreaking milestone by successfully demonstrating large-scale 3D monolithic integration of silicon transistors with gallium nitride (GaN) transistors on the same 300-millimeter (mm) wafer rather than on a package.
• In October 2019, Samsung Electronics achieved a significant milestone by developing the industry's first 12-layer 3D-TSV chip packaging technology. This groundbreaking innovation is recognized as one of the most demanding packaging technologies for mass-producing high-performance chips. The process involves the precise vertical interconnection of 12 DRAM chips through a three-dimensional configuration comprising over 60,000 TSV holes, each measuring one-twentieth the thickness of a single strand of human hair.