Asia Pacific Substrate like PCB Market Trends and Analysis by 2028
Historic Data: 2019-2020 | Base Year: 2021 | Forecast Period: 2022-2028Asia Pacific Substrate like PCB Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Line/Space (25/25 and 30/30 µm, and less than 25/25 µm), Inspection Technologies (Automated Optical Inspection, Direct Imaging, and Automated Optical Shaping), Application (Consumer Electronics, Automotive, Medical, Industrial, and Others)
- Report Date : Feb 2022
- Report Code : TIPRE00027099
- Category : Electronics and Semiconductor
- Status : Published
- Available Report Formats :
- No. of Pages : 136
The Asia Pacific substrate like PCB market is expected to reach US$ 3,922.8 million by 2028 from US$ 1,180.2 million in 2021. The market is estimated to grow at a CAGR of 18.7% from 2021–2028.
Smartphones have evolved from 4G LTE to 5G, and the complexity of Massive MIMO antenna configurations has made RF front-ends take up more space in 5G smartphones. In addition, the amount of data processed by the 5G system is expected to grow geometrically shortly, increasing the requirement for high battery capacity, which means that PCBs and other electronic components must be compressed to achieve higher density and smaller form factor, which has pushed substrate-like PCB toward thinner, smaller, and more complex processes. Substrate-like PCB (SLP PCB) is the next generation of high-density PCB, which requires trace/spacing equal to or less than 30/30 μm (now 40/40 μm is the limit for HDI), for further reducing the device size, leaving more space for other components. The rising adoption of SLP by smartphone players due to the transition from 4G to 5G technology provides a massive opportunity to the Asia Pacific substrate-like PCB market. The expansion in 5G infrastructure is expected to increase the demand for PCBs and substrates for mainboards and modules in various end-use industries, such as consumer electronics, automotive, medical, industrial, telecommunication, and others.
APAC is a crucial region in terms of manufacturing and industrial growth and any disruptions may negatively impact the growth of various industries. With the COVID-19 outbreak, the IC substrate production came to an abrupt end in China from February 2020 to March 2020. Thus, this influenced the demand for the product, worldwide, and influenced the price. The governments of various countries of this region are taking drastic measures to reduce the effects of coronavirus outbreaks by announcing lockdowns, travel and trade bans. All these measures hurt the adoption and growth of substrate-like PCB till Mid-2021.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the substrate like PCB market. The Asia Pacific substrate like PCB market is expected to grow at a good CAGR during the forecast period.
Asia Pacific Substrate like PCB Market Revenue and Forecast to 2028 (US$ Million)
- This FREE sample will include data analysis, ranging from market trends to estimates and forecasts.
Asia Pacific Substrate like PCB Market Segmentation
By Line/Space
- 25/25 and 30/30 um
- Less than 25/25 um
By Inspection Technology
- Automated Optical Inspection
- Direct Imaging
- Automated Optical Shaping
By Application
- Consumer electronics
- Automotive
- Medical
- Industrial
- Others
By Country
- Asia Pacific
- China
- Japan
- India
- Australia
- South Korea
- Vietnam
- Rest of APAC
Companies Mentioned
- Compaq Manufacturing Co., Ltd.
- DAEDUCK ELECTRONICS CO., LTD.
- Ibiden Co, Ltd.
- Kinsus Interconnect Technology
- SAMSUNG ELECTRO-MECHANICS CO, Ltd
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Zhen Ding Tech. Group Technology Holding Limited
- Technologies Inc.
- Korea Circuit
- Unimicron Technology Corp.
Asia Pacific Substrate like PCB Report Scope
Report Attribute
Details
Market size in 2021
US$ 1,180.2 Million
Market Size by 2028
US$ 3,922.8 Million
Global CAGR (2021 - 2028)
18.7%
Historical Data
2019-2020
Forecast period
2022-2028
Segments Covered
By Line/Space - 25/25 and 30/30
By Inspection Technologies - Automated Optical Inspection
- Direct Imaging
- Automated Optical Shaping
By Application - Consumer Electronics
- Automotive
- Medical
- Industrial
Regions and Countries Covered
Asia-Pacific - China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Market leaders and key company profiles
Compaq Manufacturing Co., Ltd.
DAEDUCK ELECTRONICS CO., LTD.
Ibiden Co, Ltd.
Kinsus Interconnect Technology
SAMSUNG ELECTRO-MECHANICS CO, Ltd
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Zhen Ding Tech. Group Technology Holding Limited
Technologies Inc.
Korea Circuit
| Report Attribute | Details |
|---|---|
| Market size in 2021 | US$ 1,180.2 Million |
| Market Size by 2028 | US$ 3,922.8 Million |
| Global CAGR (2021 - 2028) | 18.7% |
| Historical Data | 2019-2020 |
| Forecast period | 2022-2028 |
| Segments Covered |
By Line/Space
|
| Regions and Countries Covered | Asia-Pacific
|
| Market leaders and key company profiles |
- Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
- PEST and SWOT Analysis
- Market Size Value / Volume - Global, Regional, Country
- Industry and Competitive Landscape
- Excel Dataset
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- Compaq Manufacturing Co., Ltd.
- DAEDUCK ELECTRONICS CO., LTD.
- Ibiden Co, Ltd.
- Kinsus Interconnect Technology
- SAMSUNG ELECTRO-MECHANICS CO, Ltd
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Zhen Ding Tech. Group Technology Holding Limited
- Technologies Inc.
- Korea Circuit
- Unimicron Technology Corp.
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