Consumer Electronics Segment to Dominate APAC Embedded Die Packaging Technology Market during 2020–2028
According to The Insight Partners market research study on “APAC Embedded Die Packaging Technology Market to 2028 – COVID-19 Impact and Regional Analysis and Forecast by Platform, Application, and Industry,” is expected to reach US$ 1,21,957.05 thousand by 2028 from US$ 32,019.28 thousand in 2020. The market is estimated to grow at a CAGR of 18.5 % from 2021 to 2028. The report provides trends prevailing in the APAC embedded die packaging technology market along with the drivers and restraints pertaining to the market growth. Surging demand to enhance smartphone and automotive device performance and mounting adoption of wearable devices and internet of things are the major factor driving the growth of the APAC embedded die packaging technology market. However, technical issues and availability of alternative solutions hinders the growth of APAC embedded die packaging technology market.
In case of COVID-19, APAC is highly affected specially India. Countries such as China, India, South Korea, and Japan are moving toward new networking solutions such as 5G, 4G, and VoLTE. China and India are the most prominent manufacturing hub in the region and have an enhanced focus on industrialization. The growth of the manufacturing industry has been hampered due to lockdown but soon recovered the development by enhancing the production capabilities in the second half of the year. The demand for advanced electronics such as a smartwatch, smart wearables, and healthcare machines has risen significantly. Also, companies in the Asian region have restructured their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea
The APAC embedded die packaging technology market is divided in four segments: platform, application, industry, and country. Based on platform, the market is sub-segmented into IC package substrate, rigid board, and flexible board. The IC package substrate segment dominated the market in 2020 and is also expected to be fastest growing during forecast period. Based on application, the market is segmented into smartphones and tablets, medical and wearable devices, industrial devices, security devices, and other applications. The smartphones and tablets segment dominated the market in 2020, and medical and wearable devices segment is expected to fastest be growing during forecast period. Based on industry, the market is segmented as automotive, healthcare, consumer electronics, IT and telecommunication, and other industries. The consumer electronics segment dominated the market in 2020 and automotive segment is expected to be fastest growing during forecast period.
Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited are among the leading companies in the APAC embedded die packaging technology market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market. For instance, in 2019, Schweizer Electronic AG and Neutronics Solutions Inc. formed ales representative agreement for the USA and Canada to promote high-tech printed circuit boards and embedding solutions.
The report segments the APAC Embedded Die Packaging Technology Market as follows:
APAC Embedded Die Packaging Technology Market – By Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
APAC Embedded Die Packaging Technology Market – By Application
- Smartphone and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
APAC Embedded Die Packaging Technology Market – By Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
APAC Embedded Die Packaging Technology Market – By Country
- Australia
- China
- India
- Japan
- South Korea
- Rest of APAC
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