Thin Wafer Processing and Dicing Equipment Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Equipment Type (Dicing Equipment, Blade Dicing, Laser Ablation, Stealth Dicing, Plasma Dicing); Application (Memory and Logic, LED, MEMS Devices, Power Devices, CMOS Image Sensors, RFID, Others) and Geography
Report Code: TIPRE00026913
| No. of Pages: 150
| Category: Electronics and Semiconductor
| Status: Upcoming
The equipment utilized for manufacturing thin wafers are the thin wafer processing & dicing equipment. An integration of different microelectronics in various consumer electronics & smart cards which requires thinner wafers are growing exponentially. Technologies such as MEMS Devices, power devices, and RFID are considered as a prime source for thin wafers. The demand for mentioned semi-electronics are increasingly generating demand for a improved manufacturing process, majorly processing & dicing.
The factors attributing toward the growth of the market includes exponentially growing demand of consumer electronic devices and convergence of electronics & automotive industry are driving the quest for semiconductor manufacturing and thus promoting the scope of wafer processing. The factor mentioned are positively impacting the production of thin wafer processing & dicing equipment and thereby influencing the market growth. In addition to this, with industrialization in economies of Asia, urbanization globally, and proliferation of Artificial Intelligence, IoT and connected devices in diversified industries is projected to provide ample of growth opportunities to the players operating in the thin wafer processing and dicing equipment market.
The "Global Thin Wafer Processing and Dicing Equipment Market Analysis to 2028" is a specialized and in-depth study of the electronics & semiconductor industry with a special focus on the global market trend analysis. The report aims to provide an overview of the thin wafer processing and dicing equipment market with detailed market segmentation - equipment type, application, and geography. The global thin wafer processing and dicing equipment market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading thin wafer processing and dicing equipment market players and offers key trends and opportunities in the market.
Based on equipment type, the thin wafer processing and dicing equipment market is segmented into dicing equipment, blade dicing, laser ablation, stealth dicing, plasma dicing.
Based on application, the thin wafer processing and dicing equipment market is segmented into memory and logic, LED, MEMS devices, power devices, CMOS image sensors, RFID, others.
IMPACT OF COVID-19 ON THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET
The outbreak of the COVID-19 has negatively impacted the growth of thin wafer processing and dicing equipment market. With temporary shutdown of manufacturing and consumer electronics sector worldwide, the penetration of related products such as thin wafer processing and dicing equipment wintessed reduction. As China, South Korea, Taiwan, Japan, the US are amongst the top countries known for having a strong base of manufacturing of semiconductor components and wafers. The pandemic situation hevaily diruppted the semiconductor production acitivities.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global thin wafer processing and dicing equipment market based on various segments. It also provides market size and forecast estimates from the year 2019 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South & Central America (SAM). The thin wafer processing and dicing equipment market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the thin wafer processing and dicing equipment market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South & Central America after evaluating political, economic, social and technological factors affecting the thin wafer processing and dicing equipment in these regions.
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The reports cover key developments in the thin wafer processing and dicing equipment market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market payers from thin wafer processing and dicing equipment market are anticipated to lucrative growth opportunities in the future with the rising demand for thin wafer processing and dicing equipment in the global market. Below mentioned is the list of few companies engaged in the thin wafer processing and dicing equipment market.
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the thin wafer processing and dicing equipment market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
Suzhou Delphi Laser Co. Ltd
SPTS Technologies Limited
Han's Laser Technology Industry Group Co. Ltd.
ASM Laser Separation International (ALSI) B.V.
Tokyo Seimitsu Co, Ltd. (Accretech)
Neon Tech Co. Ltd.
Nippon Pulse Motor Taiwan (NPMT)
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