The embedded die packaging technology market was valued at US$ 63.40 million in 2020 and is projected to reach US$ 242.80 million by 2028. The embedded die packaging technology market is expected to grow at a CAGR of 18.6% during the forecast period of 2021 to 2028.
Electronics devices are evolving at a rapid rate with the integration of more electronic components in circuit boards for advanced features. The devices are getting more compact in size with advanced packaging technology to offer enhanced control and space saving for customers. Miniaturization of electronic devices to optimize space in final devices is augmenting the market growth. Advent of Internet of things (IoT)-connected devices has increased the demand for embedded die packaging technology to integrate more IoT components in the same space. In addition, the growing adoption of smartphones and smart wearables is further supplementing the market growth. Smartphones and smart wearables are being designed using the embedded die packaging technology to optimize the available space for integrating more components.
Increasing adoption of compact electronics gadgets having internet connectivity is supporting the embedded die packaging technology to integrate maximum parts in a single package. The global embedded die packaging technology market is segmented based on platform, application, industry vertical, and geography. Based on platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board. In terms of application, the embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, and security devices. Based on industry, the embedded die packaging technology market is segmented as automotive, healthcare, consumer electronics, IT & telecommunication, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific (APAC), and Rest of the World.
Impact of COVID-19 Pandemic on Embedded Die Packaging Technology Market
The COVID-19 pandemic has hampered the semiconductor industry and economic growth of almost every country. The pandemic has severely impacted the manufacturing sector due to shutdown of facilities for a certain period. Sales of various industrial products, such as automotive cars and electronics, was declined. Office premises, public places, schools, transportation, and other spaces also remained closed which declined market growth owing to low sale. The semiconductor industry took a major hit as the demand for electronics components from every industrial sector and end consumers was reduced. The revenue model for microelectronics has declined as there was no mass production during the lockdown period. Post-lockdown, the semiconductor industry started to regain the market share as production facilities restarted their operations, with preventive measures.
Lucrative Regions in Embedded Die Packaging Technology Market
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Embedded Die Packaging Technology Market Insights
Growing Demand for Miniaturization of Electronic Devices
Electronics gadgets are being developed using small form factor electronic components to enhance the space and improve the final product design. Customers are preferring compact, small-sized handheld electronic devices offering maximum features. To enhance user experience, companies are developing miniaturized electronics to integrate maximum components on a single die. Integrating maximum number of components, such as sensors and processor, in a single die offers enhanced features for customers. Rising techno savvy population is one the major factors for the miniaturization of electronics as it has created stiff competition in market players to offer maximum number of features in a single device.
Platform-Based Market Insights
Packaging technology has evolved rapidly to enhance the packaging of small electronic components in a single die to optimize the space in the final device. In IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefits, such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. In terms of platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board.
Embedded Die Packaging Technology Market, by Platform – 2020 and 2028
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Source: The Insight Partners Analysis
Note: Inner circle represents market size for 2020 and outer circle represents 2028.
Application-Based Market Insights
In terms of application, the global embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, security devices, and others. The emerging need of microelectronics from various industry verticals, including automotive, healthcare, and consumer electronics, for small-form factor-based applications are supporting the market growth. Growing trend of size reduction and improving functionality of electronic devices are boosting the adoption of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in a smartphone design, as manufacturers are urging for a new solution to take the minimum space possible.
Industry-Based Market Insights
Based on industry, the global embedded die packaging technology is segmented into consumer electronics, it and telecommunication, automotive, healthcare, and others. Rise in adoption of smart devices and connected vehicles has increased the need for IoT devices developed by advanced packaging technology. In addition, smart wearables are playing a major role in human health monitors. Increasing demand for small electronics devices in the healthcare industry is supporting the market growth.
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Embedded Die Packaging Technology Market: Strategic Insights
Market Size Value in US$ 63.40 Million in 2020 Market Size Value by US$ 242.80 Million by 2028 Growth rate CAGR of 18.6% from 2021-2028 Forecast Period 2021-2028 Base Year 2021
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Embedded Die Packaging Technology Market: Strategic Insights
| Market Size Value in | US$ 63.40 Million in 2020 |
| Market Size Value by | US$ 242.80 Million by 2028 |
| Growth rate | CAGR of 18.6% from 2021-2028 |
| Forecast Period | 2021-2028 |
| Base Year | 2021 |
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Players operating in the embedded die packaging technology market focus on strategies such as market initiatives, acquisitions, and product launches to maintain their positions in the market. A few developments by key players of the embedded die packaging technology market are:
- In August 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea.
- In August 2020, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) launched new 3D silicon tacking and advanced packaging technology.
The embedded die packaging technology market has been segmented as follows:
Embedded Die Packaging Technology Market – by Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
Embedded Die Packaging Technology Market – by Application
- Smartphones and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
Embedded Die Packaging Technology Market – by Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
Embedded Die Packaging Technology Market – by Region
- North America
- US
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Italy
- Russia
- Rest of Europe
- Asia Pacific (APAC)
- China
- Japan
- India
- Australia
- South Korea
- Rest of APAC
- Rest of the World
- MEA
- SAM
Embedded Die Packaging Technology Market – Company Profiles
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Platform , Application , and Industry , Geography
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Australia, Canada, China, France, Germany, India, Italy, Japan, MEA, Mexico, Russian Federation, SAM, South Korea, United Kingdom, United States
Frequently Asked Questions
The growth of the embedded die packaging technology market is primarily attributed to growing demand for miniaturization of electronic devices. Moreover, the rising developments in embedded die packaging technology, thereby substantially driving the embedded die packaging technology market.
The embedded die packaging technology has a huge opportunity in the smartphone and tablet market to offer advanced processors, transmitters, and other components. Embedded die packaging technology enhances the device performance and provides better space utilization solutions. A few market players are developing ICs and other components using the embedded die packaging technology, while for others, it is an excellent opportunity to innovate new solutions for smartphones and tablets. For instance, market players such as AT&S, SHINKO, and ASE Group offer the embedded die packaging technology for smartphones. The rising consumption of smartphones is a major supporting factor for the market growth in coming years. To grab a leading position, companies need to develop new processors with compact size and high-performance level. According to Ericsson, in 2016, almost 4 billion mobile connections were present in Asia Pacific, and are expected to reach 4.6 billion by 2021. Increasing demand in Asia Pacific alone shows the potential for embedded die packaging technology in the smartphone industry.
The embedded die packaging technology market is led by IC package substrate segment with highest share and is expected to dominate in the forecast period. In the semiconductor industry, ICs (integrated circuit) are using embedded die packaging technology to reduce the size and enhance the performance. In the IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefit—such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. The IC package substrate platform in embedded die packaging technology is used for a wide range of applications, such as MOSFET, regulator, DCDC, audio, sensor, optical, connectivity, memory, and image module.
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 Embedded Die Packaging Technology Market – By Platform
1.3.2 Embedded Die Packaging Technology Market – By Application
1.3.3 Embedded Die Packaging Technology Market – By Industry
1.3.4 Embedded Die Packaging Technology Market- By Region
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 PEST Analysis
4.2.1 North America – PEST Analysis
4.2.2 Europe – PEST Analysis
4.2.3 Asia-Pacific – PEST Analysis
4.2.4 Rest of World – PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Growing Demand for Miniaturization of Electronic Devices
5.1.2 Rising Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Issues and Availability of Alternative Solutions
5.3 Market Opportunities
5.3.1 Increasing Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Rapid Growth in Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market – Global Analysis
6.1 Embedded Die Packaging Technology Market Global Overview
6.2 Embedded Die Packaging Technology Market – Global Revenue and Forecast to 2028 (US$ Million)
6.3 Market Positioning – Five Key Players
7. Embedded Die Packaging Technology Market Analysis – By Platform
7.1 Overview
7.2 Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
8. Embedded Die Packaging Technology Market – By Application
8.1 Overview
8.2 Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
9. Embedded Die Packaging Technology Market – By Industry
9.1 Overview
9.2 Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
10. Embedded Die Packaging Technology Market – Geographic Analysis
10.1 Overview
10.2 North America: Embedded Die Packaging Technology Market
10.2.1 North America: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
10.2.2 North America: Embedded Die Packaging Technology Market- By Platform
10.2.3 North America: Embedded Die Packaging Technology Market- By Application
10.2.4 North America: Embedded Die Packaging Technology Market- By Industry
10.2.5 North America: Embedded Die Packaging Technology Market- by Key Country
10.2.5.1 US: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.2.5.1.1 US: Embedded Die Packaging Technology Market- By Platform
10.2.5.1.2 US: Embedded Die Packaging Technology Market- By Application
10.2.5.1.3 US: Embedded Die Packaging Technology Market- By Industry
10.2.5.2 Canada: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.2.5.2.1 Canada: Embedded Die Packaging Technology Market- By Platform
10.2.5.2.2 Canada: Embedded Die Packaging Technology Market- By Application
10.2.5.2.3 Canada: Embedded Die Packaging Technology Market- By Industry
10.2.5.3 Mexico: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.2.5.3.1 Mexico: Embedded Die Packaging Technology Market- By Platform
10.2.5.3.2 Mexico: Embedded Die Packaging Technology Market- By Application
10.2.5.3.3 Mexico: Embedded Die Packaging Technology Market- By Industry
10.3 Europe: Embedded Die Packaging Technology Market
10.3.1 Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
10.3.2 Europe: Embedded Die Packaging Technology Market- By Platform
10.3.3 Europe: Embedded Die Packaging Technology Market- By Application
10.3.4 Europe: Embedded Die Packaging Technology Market- By Industry
10.3.5 Europe: Embedded Die Packaging Technology Market- by Key Country
10.3.5.1 Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.3.5.1.1 Germany: Embedded Die Packaging Technology Market- By Platform
10.3.5.1.2 Germany: Embedded Die Packaging Technology Market- By Application
10.3.5.1.3 Germany: Embedded Die Packaging Technology Market- By Industry
10.3.5.2 France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.3.5.2.1 France: Embedded Die Packaging Technology Market- By Platform
10.3.5.2.2 France: Embedded Die Packaging Technology Market- By Application
10.3.5.2.3 France: Embedded Die Packaging Technology Market- By Industry
10.3.5.3 Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.3.5.3.1 Italy: Embedded Die Packaging Technology Market- By Platform
10.3.5.3.2 Italy: Embedded Die Packaging Technology Market- By Application
10.3.5.3.3 Italy: Embedded Die Packaging Technology Market- By Industry
10.3.5.4 UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.3.5.4.1 UK: Embedded Die Packaging Technology Market- By Platform
10.3.5.4.2 UK: Embedded Die Packaging Technology Market- By Application
10.3.5.4.3 UK: Embedded Die Packaging Technology Market- By Industry
10.3.5.5 Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.3.5.5.1 Russia: Embedded Die Packaging Technology Market- By Platform
10.3.5.5.2 Russia: Embedded Die Packaging Technology Market- By Application
10.3.5.5.3 Russia: Embedded Die Packaging Technology Market- By Industry
10.3.5.6 Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.3.5.6.1 Rest of Europe: Embedded Die Packaging Technology Market- By Platform
10.3.5.6.2 Rest of Europe: Embedded Die Packaging Technology Market- By Application
10.3.5.6.3 Rest of Europe: Embedded Die Packaging Technology Market- By Industry
10.4 APAC: Embedded Die Packaging Technology Market
10.4.1 APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
10.4.2 APAC: Embedded Die Packaging Technology Market- By Platform
10.4.3 APAC: Embedded Die Packaging Technology Market- By Application
10.4.4 APAC: Embedded Die Packaging Technology Market- By Industry
10.4.5 APAC: Embedded Die Packaging Technology Market- by Key Country
10.4.5.1 Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.4.5.1.1 Australia: Embedded Die Packaging Technology Market- By Platform
10.4.5.1.2 Australia: Embedded Die Packaging Technology Market- By Application
10.4.5.1.3 Australia: Embedded Die Packaging Technology Market- By Industry
10.4.5.2 China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.4.5.2.1 China: Embedded Die Packaging Technology Market- By Platform
10.4.5.2.2 China: Embedded Die Packaging Technology Market- By Application
10.4.5.2.3 China: Embedded Die Packaging Technology Market- By Industry
10.4.5.3 India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.4.5.3.1 India: Embedded Die Packaging Technology Market- By Platform
10.4.5.3.2 India: Embedded Die Packaging Technology Market- By Application
10.4.5.3.3 India: Embedded Die Packaging Technology Market- By Industry
10.4.5.4 Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.4.5.4.1 Japan: Embedded Die Packaging Technology Market- By Platform
10.4.5.4.2 Japan: Embedded Die Packaging Technology Market- By Application
10.4.5.4.3 Japan: Embedded Die Packaging Technology Market- By Industry
10.4.5.5 South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.4.5.5.1 South Korea: Embedded Die Packaging Technology Market- By Platform
10.4.5.5.2 South Korea: Embedded Die Packaging Technology Market- By Application
10.4.5.5.3 South Korea: Embedded Die Packaging Technology Market- By Industry
10.4.5.6 Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.4.5.6.1 Rest of APAC: Embedded Die Packaging Technology Market- By Platform
10.4.5.6.2 Rest of APAC: Embedded Die Packaging Technology Market- By Application
10.4.5.6.3 Rest of APAC: Embedded Die Packaging Technology Market- By Industry
10.5 Rest of World: Embedded Die Packaging Technology Market
10.5.1 Rest of World: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
10.5.2 Rest of World: Embedded Die Packaging Technology Market- By Platform
10.5.3 Rest of World: Embedded Die Packaging Technology Market- By Application
10.5.4 Rest of World: Embedded Die Packaging Technology Market- By Industry
10.5.5 Rest of World: Embedded Die Packaging Technology Market- by Key Region
10.5.5.1 MEA: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.5.5.1.1 MEA: Embedded Die Packaging Technology Market- By Platform
10.5.5.1.2 MEA: Embedded Die Packaging Technology Market- By Application
10.5.5.1.3 MEA: Embedded Die Packaging Technology Market- By Industry
10.5.5.2 SAM: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.5.5.2.1 SAM: Embedded Die Packaging Technology Market- By Platform
10.5.5.2.2 SAM: Embedded Die Packaging Technology Market- By Application
10.5.5.2.3 SAM: Embedded Die Packaging Technology Market- By Industry
11. Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 Overview
11.2 North America
11.3 Europe
11.4 Asia Pacific
11.5 Rest of World
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shinko Electric Industries Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Schweizer Electronic AG
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 Taiwan Semiconductor Manufacturing Company, Limited
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. Appendix
14.1 About The Insight Partners
14.2 Word Index
LIST OF TABLES
Table 1. Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Million)
Table 2. North America: Embedded Die Packaging Technology Market- By Platform – Revenue and Forecast to 2028 (US$ Thousand)
Table 3. North America: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)
Table 4. North America: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)
Table 5. US: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 6. US: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 7. US: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 8. Canada: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 9. Canada: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 10. Canada: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 11. Mexico: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 12. Mexico: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 13. Mexico: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 14. Europe: Embedded Die Packaging Technology Market- By Platform – Revenue and Forecast to 2028 (US$ Thousand)
Table 15. Europe: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)
Table 16. Europe: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Germany: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Germany: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Germany: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 20. France: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 21. France: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 22. France: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 23. Italy: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 24. Italy: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 25. Italy: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 26. UK: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 27. UK: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 28. UK: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 29. Russia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 30. Russia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 31. Russia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 32. Rest of Europe: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 33. Rest of Europe: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 34. Rest of Europe: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 35. APAC: Embedded Die Packaging Technology Market- By Platform – Revenue and Forecast to 2028 (US$ Thousand)
Table 36. APAC: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)
Table 37. APAC: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)
Table 38. Australia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 39. Australia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 40. Australia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 41. China: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 42. China: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 43. China: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 44. India: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 45. India: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 46. India: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 47. Japan: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 48. Japan: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 49. Japan: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 50. South Korea: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 51. South Korea: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 52. South Korea: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 53. Rest of APAC: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 54. Rest of APAC: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 55. Rest of APAC: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 56. Rest of World: Embedded Die Packaging Technology Market- By Platform– Revenue and Forecast to 2028 (US$ Thousand)
Table 57. Rest of World: Embedded Die Packaging Technology Market- By Application – Revenue and Forecast to 2028 (US$ Thousand)
Table 58. Rest of World: Embedded Die Packaging Technology Market- By Industry – Revenue and Forecast to 2028 (US$ Thousand)
Table 59. MEA: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 60. MEA: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 61. MEA: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 62. SAM: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 63. SAM: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 64. SAM: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 65. List of Abbreviation
LIST OF FIGURES
Figure 1. Embedded Die Packaging Technology Market Segmentation
Figure 2. Embedded Die Packaging Technology Market Segmentation – By Geography
Figure 3. Global Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. Asia Pacific was the Largest Revenue Contributor in 2020
Figure 8. North America – PEST Analysis
Figure 9. Europe – PEST Analysis
Figure 10. Asia-Pacific – PEST Analysis
Figure 11. Rest of World – PEST Analysis
Figure 12. Embedded Die Packaging Technology Market– Ecosystem Analysis
Figure 13. Expert Opinion
Figure 14. Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 15. Geographic Overview of Embedded Die Packaging Technology Market
Figure 16. Global Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 17. Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 18. IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 19. Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 20. Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 21. Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 22. Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 23. Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 24. Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 25. Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 26. Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 27. Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 28. Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 29. IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 30. Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 31. Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 32. Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 33. Embedded Die Packaging Technology Market Revenue Share, By Region (2020 and 2028)
Figure 34. North America: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 35. North America: Embedded Die Packaging Technology Market Revenue Share, By Platform (2020 and 2028)
Figure 36. North America: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)
Figure 37. North America: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)
Figure 38. North America: Embedded Die Packaging Technology Market Revenue Share, by Key Country (2020 and 2028)
Figure 39. US: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 40. Canada: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 41. Mexico: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 42. Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 43. Europe: Embedded Die Packaging Technology Market Revenue Share, By Technology (2020 and 2028)
Figure 44. Europe: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)
Figure 45. Europe: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)
Figure 46. Europe: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 47. Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 48. France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 49. Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 50. UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 51. Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 52. Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 53. APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 54. APAC: Embedded Die Packaging Technology Market Revenue Share, By Technology (2020 and 2028)
Figure 55. APAC: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)
Figure 56. APAC: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)
Figure 57. APAC: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 58. Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 59. China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 60. India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 61. Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 62. South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 63. Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 64. Rest of World: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Million)
Figure 65. Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Technology (2020 and 2028)
Figure 66. Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Application (2020 and 2028)
Figure 67. Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Industry (2020 and 2028)
Figure 68. Rest of World: Embedded Die Packaging Technology Market Revenue Share, By Key Region (2020 and 2028)
Figure 69. MEA: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 70. SAM: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 71. Impact of COVID-19 Pandemic in North American Country Markets
Figure 72. Impact of COVID-19 Pandemic in Europe Country Markets
Figure 73. Impact of COVID-19 Pandemic in APAC Country Markets
Figure 74. Impact of COVID-19 Pandemic in Rest of World Markets
The List of Companies - Embedded Die Packaging Technology Market
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- INFINEON TECHNOLOGIES AG
- Microsemi
- SCHWEIZER ELECTRONIC AG
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Taiwan Semiconductor Manufacturing Company, Limited
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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