The Europe embedded die packaging technology market is expected to grow from US$ 9,686.92 thousand in 2020 to US$ 35,043.61 thousand by 2028; it is estimated to grow at a CAGR of 17.8 % from 2021 to 2028.
The UK, Germany, France, Italy, and Russia are major economies in Europe. Mounting developments in embedded die packaging technology is expected to escalate the Europe embedded die packaging technology market. The embedded die packaging technology bridges the gap between traditional multichip modules (MCM) and advanced 2.5 package solutions with an increased integration level and small form factor. The technology is not new for the packaging industry but it is adopted by niche applications due to technical challenges. However, rising development from leading manufacturers, such as AT&S, GE, and ASE Group, drives its adoption for various applications. For instance, ASE Group offers the embedded die packaging technology for a wide range of applications such as smart homes, smart factories, smart automobiles, smart bikes, and smart city devices. Wireless module, lighting module, sensor module, digital and processor module, and power management module are among the application areas driving the Europe market growth. The key factors that are augmenting the Europe market growth compared to other packaging technology include small form factor, thermal management, design flexibility, higher components integration, shorter interconnections, and protection against the harsh environment. The embedded chip enables more space optimization through miniaturization and design flexibility. Shorter interconnections formed in embedded die packaging technology minimize the distortion and power loss, while lower thermal and electrical resistivity of packaging type improves power performance. Embedded die packaging technology has enormous potential in the consumer electronics market as the technology is getting used for a wide range of products, such as smartphones, smart speakers, smart cameras, and other IoT-connected devices. Rise in the adoption of 5G network in developed and developing countries improves internet services and boosts the demand for supporting devices. Moreover, the significant growth of IoT-based devices is increasing the demand for embedded die packaging technology across Europe region.
In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the U.S. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the Europe embedded die packaging technology market. The Europe embedded die packaging technology market is expected to grow at a good CAGR during the forecast period.
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Europe Embedded Die Packaging Technology Market Segmentation
Europe Embedded Die Packaging Technology Market – By Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
Europe Embedded Die Packaging Technology Market – By Application
- Smartphone and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
Europe Embedded Die Packaging Technology Market – By Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
Europe Embedded Die Packaging Technology Market, by Country
- Germany
- France
- Italy
- UK
- Russia
- Rest of Europe
Europe Embedded Die Packaging Technology Market -Companies Mentioned
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Taiwan Semiconductor Manufacturing Company, Limited
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Platform, Application, and Industry
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
UK, Germany, France, Italy, Russia
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 Europe Embedded Die Packaging Technology Market – By Platform
1.3.2 Europe Embedded Die Packaging Technology Market – By Application
1.3.3 Europe Embedded Die Packaging Technology Market – By Industry
1.3.4 Europe Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Europe Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 Europe PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. Europe Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Escalating Demand for Miniaturization of Electronic Devices
5.1.2 Mounting Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Complexities and Alternative Solutions Availability
5.3 Market Opportunities
5.3.1 Growing Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Rising Adoption of Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market – Europe Analysis
6.1 Europe Embedded Die Packaging Technology Market Overview
6.2 Europe Embedded Die Packaging Technology Market –Revenue and Forecast to 2028 (US$ Thousand)
7. Europe Embedded Die Packaging Technology Market Analysis – By Platform
7.1 Overview
7.2 Europe Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8. Europe Embedded Die Packaging Technology Market – By Application
8.1 Overview
8.2 Europe Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. Europe Embedded Die Packaging Technology Market – By Industry
9.1 Overview
9.2 Europe Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. Europe Embedded Die Packaging Technology Market – Country Analysis
10.1 Overview
10.1.1 Europe: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 Germany: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 Germany: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 Germany: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 France: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 France: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 France: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 Italy: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 Italy: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 Italy: Embedded Die Packaging Technology Market- By Industry
10.1.1.4 UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.4.1 UK: Embedded Die Packaging Technology Market- By Platform
10.1.1.4.2 UK: Embedded Die Packaging Technology Market- By Application
10.1.1.4.3 UK: Embedded Die Packaging Technology Market- By Industry
10.1.1.5 Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.5.1 Russia: Embedded Die Packaging Technology Market- By Platform
10.1.1.5.2 Russia: Embedded Die Packaging Technology Market- By Application
10.1.1.5.3 Russia: Embedded Die Packaging Technology Market- By Industry
10.1.1.6 Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.6.1 Rest of Europe: Embedded Die Packaging Technology Market- By Platform
10.1.1.6.2 Rest of Europe: Embedded Die Packaging Technology Market- By Application
10.1.1.6.3 Rest of Europe: Embedded Die Packaging Technology Market- By Industry
11. Europe Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 Europe
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Schweizer Electronic AG
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Taiwan Semiconductor Manufacturing Company, Limited
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
14. Appendix
14.1 About The Insight Partners
14.2 Word Index
LIST OF TABLES
Table 1. Europe Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. Germany: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 3. Germany: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 4. Germany: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 5. France: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 6. France: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 7. France: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 8. Italy: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 9. Italy: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 10. Italy: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 11. UK: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 12. UK: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 13. UK: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 14. Russia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 15. Russia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 16. Russia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Rest of Europe: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Rest of Europe: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Rest of Europe: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 20. List of Abbreviation
LIST OF FIGURES
Figure 1. Europe Embedded Die Packaging Technology Market Segmentation
Figure 2. Europe Embedded Die Packaging Technology Market Segmentation – By Country
Figure 3. Europe Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. Germany was the Largest Revenue Contributor in 2020
Figure 8. Europe – PEST Analysis
Figure 9. Europe Embedded Die Packaging Technology Market– Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. Europe Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. Europe Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. Europe IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. Europe Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. Europe Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. Europe Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. Europe Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. Europe Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. Europe Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. Europe Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. Europe Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. Europe Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. Europe Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. Europe IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. Europe Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. Europe Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. Europe Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. Europe: Embedded Die Packaging Technology Market, by Key Country – Revenue (2020) (USD Thousand)
Figure 30. Europe: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 31. Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 35. Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 36. Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 37. Impact of COVID-19 Pandemic in Europe Country Markets
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Taiwan Semiconductor Manufacturing Company, Limited
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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