Wafer Level Packaging Market 2027 By Integration Type, Technology, Application and Geography | The Insight Partners

Wafer Level Packaging Market Forecast to 2027 - COVID-19 Impact and Global Analysis By Integration Type (Fan-in Wafer Level Packaging, Fan-out Wafer Level Packaging); Technology (3D Wafer Level Packaging, Nano Wafer Level Packaging, Wafer Level Chip Scale Package, Others); Application (Electronics, Aerospace and Defense, Automotive, Others) and Geography

Report Code: TIPRE00015725 | No. of Pages: 150 | Category: Electronics and Semiconductor | Status: Upcoming
Covid
MARKET INTRODUCTION

Wafer level packaging (WLP) is a chip-scale package (CSP) technology, and it enables integration of wafer fab, test, packaging, and burn-in at wafer level to simplify the manufacturing procedure. With the growing demand for smaller and faster consumer electronics, the market is expected to experience a positive impact. The broad use of WLP in radar technology has empowered it to become a crucial part of self-driving cars. Further, the healthcare industry and wearable devices market would hugely utilize wafer level packaging technology. The boost in these industries would positively impact the wafer level packaging market during the forecast period.

MARKET DYNAMICS

The growing requirement for circuit miniaturization in microelectronic devices is driving the growth of the wafer level packaging market. However, the manufacturing cost is the major factor that may restrain the growth of the wafer level packaging market. Furthermore, demand for low cost, small sizes, and high performance of packaging solutions are anticipated to witness massive demand during the forecast period.

MARKET SCOPE

The "Global Wafer Level Packaging Market Analysis to 2027 is a specialized and in-depth study of the wafer level packaging market with a special focus on the global market trend analysis. The report aims to provide an overview of wafer level packaging market with detailed market segmentation by integration type, technology, application. The global wafer level packaging market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading wafer level packaging market players and offers key trends and opportunities in the wafer level packaging market.

MARKET SEGMENTATION

The global wafer level packaging market is segmented on the basis of integration type, technology, application. On the basis of integration type, the market is segmented as fan-in wafer level packaging, fan-out wafer level packaging. On the basis of technology, the market is segmented as 3D wafer level packaging, nano wafer level packaging, wafer level chip scale package, others. On the basis of application, the market is segmented as electronics, aerospace and defense, automotive, others

REGIONAL FRAMEWORK

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global wafer level packaging market based on various segments. It also provides market size and forecast estimates from year 2018 to 2027 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The wafer level packaging market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.

The report analyzes factors affecting wafer level packaging market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the wafer level packaging market in these regions.



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MARKET PLAYERS


The reports cover key developments in the wafer level packaging market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from wafer level packaging market are anticipated to lucrative growth opportunities in the future with the rising demand for wafer level packaging market. Below mentioned is the list of few companies engaged in the wafer level packaging market.

The report also includes the profiles of key wafer level packaging market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.

  •   Amkor Technology
  •   Applied Materials, Inc.
  •   Brewer Science, Inc.
  •   Deca Technologies
  •   Fujitsu
  •   Infineon Technologies AG
  •   LAM RESEARCH CORPORATION
  •   Siliconware Precision Industries Co., Ltd.
  •   STATS ChipPAC Ltd
  •   Tokyo Electron Limited

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TABLE OF CONTENTS

1.INTRODUCTION
1.1.SCOPE OF THE STUDY
1.2.THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3.MARKET SEGMENTATION
1.3.1Wafer Level Packaging Market - By Integration Type
1.3.2Wafer Level Packaging Market - By Technology
1.3.3Wafer Level Packaging Market - By Application
1.3.4Wafer Level Packaging Market - By Region
1.3.4.1By Country

2.KEY TAKEAWAYS

3.RESEARCH METHODOLOGY

4.WAFER LEVEL PACKAGING MARKET LANDSCAPE
4.1.OVERVIEW
4.2.PEST ANALYSIS
4.2.1North America - Pest Analysis
4.2.2Europe - Pest Analysis
4.2.3Asia-Pacific - Pest Analysis
4.2.4Middle East and Africa - Pest Analysis
4.2.5South and Central America - Pest Analysis
4.3.ECOSYSTEM ANALYSIS
4.4.EXPERT OPINIONS

5.WAFER LEVEL PACKAGING MARKET - KEY MARKET DYNAMICS
5.1.KEY MARKET DRIVERS
5.2.KEY MARKET RESTRAINTS
5.3.KEY MARKET OPPORTUNITIES
5.4.FUTURE TRENDS
5.5.IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS

6.WAFER LEVEL PACKAGING MARKET - GLOBAL MARKET ANALYSIS
6.1.WAFER LEVEL PACKAGING - GLOBAL MARKET OVERVIEW
6.2.WAFER LEVEL PACKAGING - GLOBAL MARKET AND FORECAST TO 2027
6.3.MARKET POSITIONING/MARKET SHARE

7.WAFER LEVEL PACKAGING MARKET - REVENUE AND FORECASTS TO 2027 " INTEGRATION TYPE
7.1.OVERVIEW
7.2.INTEGRATION TYPE MARKET FORECASTS AND ANALYSIS
7.3.FAN-IN WAFER LEVEL PACKAGING
7.3.1.Overview
7.3.2.Fan-in Wafer Level Packaging Market Forecast and Analysis
7.4.FAN-OUT WAFER LEVEL PACKAGING
7.4.1.Overview
7.4.2.Fan-out Wafer Level Packaging Market Forecast and Analysis
8.WAFER LEVEL PACKAGING MARKET - REVENUE AND FORECASTS TO 2027 " TECHNOLOGY
8.1.OVERVIEW
8.2.TECHNOLOGY MARKET FORECASTS AND ANALYSIS
8.3.3D WAFER LEVEL PACKAGING
8.3.1.Overview
8.3.2.3D Wafer Level Packaging Market Forecast and Analysis
8.4.NANO WAFER LEVEL PACKAGING
8.4.1.Overview
8.4.2.Nano Wafer Level Packaging Market Forecast and Analysis
8.5.WAFER LEVEL CHIP SCALE PACKAGE
8.5.1.Overview
8.5.2.Wafer Level Chip Scale Package Market Forecast and Analysis
8.6.OTHERS
8.6.1.Overview
8.6.2.Others Market Forecast and Analysis
9.WAFER LEVEL PACKAGING MARKET - REVENUE AND FORECASTS TO 2027 " APPLICATION
9.1.OVERVIEW
9.2.APPLICATION MARKET FORECASTS AND ANALYSIS
9.3.ELECTRONICS
9.3.1.Overview
9.3.2.Electronics Market Forecast and Analysis
9.4.AEROSPACE AND DEFENSE
9.4.1.Overview
9.4.2.Aerospace and Defense Market Forecast and Analysis
9.5.AUTOMOTIVE
9.5.1.Overview
9.5.2.Automotive Market Forecast and Analysis
9.6.OTHERS
9.6.1.Overview
9.6.2.Others Market Forecast and Analysis

10.WAFER LEVEL PACKAGING MARKET REVENUE AND FORECASTS TO 2027 " GEOGRAPHICAL ANALYSIS
10.1.NORTH AMERICA
10.1.1North America Wafer Level Packaging Market Overview
10.1.2North America Wafer Level Packaging Market Forecasts and Analysis
10.1.3North America Wafer Level Packaging Market Forecasts and Analysis - By Integration Type
10.1.4North America Wafer Level Packaging Market Forecasts and Analysis - By Technology
10.1.5North America Wafer Level Packaging Market Forecasts and Analysis - By Application
10.1.6North America Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.1.6.1United States Wafer Level Packaging Market
10.1.6.1.1United States Wafer Level Packaging Market by Integration Type
10.1.6.1.2United States Wafer Level Packaging Market by Technology
10.1.6.1.3United States Wafer Level Packaging Market by Application
10.1.6.2Canada Wafer Level Packaging Market
10.1.6.2.1Canada Wafer Level Packaging Market by Integration Type
10.1.6.2.2Canada Wafer Level Packaging Market by Technology
10.1.6.2.3Canada Wafer Level Packaging Market by Application
10.1.6.3Mexico Wafer Level Packaging Market
10.1.6.3.1Mexico Wafer Level Packaging Market by Integration Type
10.1.6.3.2Mexico Wafer Level Packaging Market by Technology
10.1.6.3.3Mexico Wafer Level Packaging Market by Application
10.2.EUROPE
10.2.1Europe Wafer Level Packaging Market Overview
10.2.2Europe Wafer Level Packaging Market Forecasts and Analysis
10.2.3Europe Wafer Level Packaging Market Forecasts and Analysis - By Integration Type
10.2.4Europe Wafer Level Packaging Market Forecasts and Analysis - By Technology
10.2.5Europe Wafer Level Packaging Market Forecasts and Analysis - By Application
10.2.6Europe Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.2.6.1Germany Wafer Level Packaging Market
10.2.6.1.1Germany Wafer Level Packaging Market by Integration Type
10.2.6.1.2Germany Wafer Level Packaging Market by Technology
10.2.6.1.3Germany Wafer Level Packaging Market by Application
10.2.6.2France Wafer Level Packaging Market
10.2.6.2.1France Wafer Level Packaging Market by Integration Type
10.2.6.2.2France Wafer Level Packaging Market by Technology
10.2.6.2.3France Wafer Level Packaging Market by Application
10.2.6.3Italy Wafer Level Packaging Market
10.2.6.3.1Italy Wafer Level Packaging Market by Integration Type
10.2.6.3.2Italy Wafer Level Packaging Market by Technology
10.2.6.3.3Italy Wafer Level Packaging Market by Application
10.2.6.4United Kingdom Wafer Level Packaging Market
10.2.6.4.1United Kingdom Wafer Level Packaging Market by Integration Type
10.2.6.4.2United Kingdom Wafer Level Packaging Market by Technology
10.2.6.4.3United Kingdom Wafer Level Packaging Market by Application
10.2.6.5Russia Wafer Level Packaging Market
10.2.6.5.1Russia Wafer Level Packaging Market by Integration Type
10.2.6.5.2Russia Wafer Level Packaging Market by Technology
10.2.6.5.3Russia Wafer Level Packaging Market by Application
10.2.6.6Rest of Europe Wafer Level Packaging Market
10.2.6.6.1Rest of Europe Wafer Level Packaging Market by Integration Type
10.2.6.6.2Rest of Europe Wafer Level Packaging Market by Technology
10.2.6.6.3Rest of Europe Wafer Level Packaging Market by Application
10.3.ASIA-PACIFIC
10.3.1Asia-Pacific Wafer Level Packaging Market Overview
10.3.2Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis
10.3.3Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Integration Type
10.3.4Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Technology
10.3.5Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Application
10.3.6Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.3.6.1Australia Wafer Level Packaging Market
10.3.6.1.1Australia Wafer Level Packaging Market by Integration Type
10.3.6.1.2Australia Wafer Level Packaging Market by Technology
10.3.6.1.3Australia Wafer Level Packaging Market by Application
10.3.6.2China Wafer Level Packaging Market
10.3.6.2.1China Wafer Level Packaging Market by Integration Type
10.3.6.2.2China Wafer Level Packaging Market by Technology
10.3.6.2.3China Wafer Level Packaging Market by Application
10.3.6.3India Wafer Level Packaging Market
10.3.6.3.1India Wafer Level Packaging Market by Integration Type
10.3.6.3.2India Wafer Level Packaging Market by Technology
10.3.6.3.3India Wafer Level Packaging Market by Application
10.3.6.4Japan Wafer Level Packaging Market
10.3.6.4.1Japan Wafer Level Packaging Market by Integration Type
10.3.6.4.2Japan Wafer Level Packaging Market by Technology
10.3.6.4.3Japan Wafer Level Packaging Market by Application
10.3.6.5South Korea Wafer Level Packaging Market
10.3.6.5.1South Korea Wafer Level Packaging Market by Integration Type
10.3.6.5.2South Korea Wafer Level Packaging Market by Technology
10.3.6.5.3South Korea Wafer Level Packaging Market by Application
10.3.6.6Rest of Asia-Pacific Wafer Level Packaging Market
10.3.6.6.1Rest of Asia-Pacific Wafer Level Packaging Market by Integration Type
10.3.6.6.2Rest of Asia-Pacific Wafer Level Packaging Market by Technology
10.3.6.6.3Rest of Asia-Pacific Wafer Level Packaging Market by Application
10.4.MIDDLE EAST AND AFRICA
10.4.1Middle East and Africa Wafer Level Packaging Market Overview
10.4.2Middle East and Africa Wafer Level Packaging Market Forecasts and Analysis
10.4.3Middle East and Africa Wafer Level Packaging Market Forecasts and Analysis - By Integration Type
10.4.4Middle East and Africa Wafer Level Packaging Market Forecasts and Analysis - By Technology
10.4.5Middle East and Africa Wafer Level Packaging Market Forecasts and Analysis - By Application
10.4.6Middle East and Africa Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.4.6.1South Africa Wafer Level Packaging Market
10.4.6.1.1South Africa Wafer Level Packaging Market by Integration Type
10.4.6.1.2South Africa Wafer Level Packaging Market by Technology
10.4.6.1.3South Africa Wafer Level Packaging Market by Application
10.4.6.2Saudi Arabia Wafer Level Packaging Market
10.4.6.2.1Saudi Arabia Wafer Level Packaging Market by Integration Type
10.4.6.2.2Saudi Arabia Wafer Level Packaging Market by Technology
10.4.6.2.3Saudi Arabia Wafer Level Packaging Market by Application
10.4.6.3U.A.E Wafer Level Packaging Market
10.4.6.3.1U.A.E Wafer Level Packaging Market by Integration Type
10.4.6.3.2U.A.E Wafer Level Packaging Market by Technology
10.4.6.3.3U.A.E Wafer Level Packaging Market by Application
10.4.6.4Rest of Middle East and Africa Wafer Level Packaging Market
10.4.6.4.1Rest of Middle East and Africa Wafer Level Packaging Market by Integration Type
10.4.6.4.2Rest of Middle East and Africa Wafer Level Packaging Market by Technology
10.4.6.4.3Rest of Middle East and Africa Wafer Level Packaging Market by Application
10.5.SOUTH AND CENTRAL AMERICA
10.5.1South and Central America Wafer Level Packaging Market Overview
10.5.2South and Central America Wafer Level Packaging Market Forecasts and Analysis
10.5.3South and Central America Wafer Level Packaging Market Forecasts and Analysis - By Integration Type
10.5.4South and Central America Wafer Level Packaging Market Forecasts and Analysis - By Technology
10.5.5South and Central America Wafer Level Packaging Market Forecasts and Analysis - By Application
10.5.6South and Central America Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.5.6.1Brazil Wafer Level Packaging Market
10.5.6.1.1Brazil Wafer Level Packaging Market by Integration Type
10.5.6.1.2Brazil Wafer Level Packaging Market by Technology
10.5.6.1.3Brazil Wafer Level Packaging Market by Application
10.5.6.2Argentina Wafer Level Packaging Market
10.5.6.2.1Argentina Wafer Level Packaging Market by Integration Type
10.5.6.2.2Argentina Wafer Level Packaging Market by Technology
10.5.6.2.3Argentina Wafer Level Packaging Market by Application
10.5.6.3Rest of South and Central America Wafer Level Packaging Market
10.5.6.3.1Rest of South and Central America Wafer Level Packaging Market by Integration Type
10.5.6.3.2Rest of South and Central America Wafer Level Packaging Market by Technology
10.5.6.3.3Rest of South and Central America Wafer Level Packaging Market by Application

11.INDUSTRY LANDSCAPE
11.1.MERGERS AND ACQUISITIONS
11.2.AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
11.3.NEW PRODUCT LAUNCHES
11.4.EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS

12.WAFER LEVEL PACKAGING MARKET, KEY COMPANY PROFILES
12.1.AMKOR TECHNOLOGY
12.1.1.Key Facts
12.1.2.Business Description
12.1.3.Products and Services
12.1.4.Financial Overview
12.1.5.SWOT Analysis
12.1.6.Key Developments
12.2.APPLIED MATERIALS, INC.
12.2.1.Key Facts
12.2.2.Business Description
12.2.3.Products and Services
12.2.4.Financial Overview
12.2.5.SWOT Analysis
12.2.6.Key Developments
12.3.BREWER SCIENCE, INC.
12.3.1.Key Facts
12.3.2.Business Description
12.3.3.Products and Services
12.3.4.Financial Overview
12.3.5.SWOT Analysis
12.3.6.Key Developments
12.4.DECA TECHNOLOGIES
12.4.1.Key Facts
12.4.2.Business Description
12.4.3.Products and Services
12.4.4.Financial Overview
12.4.5.SWOT Analysis
12.4.6.Key Developments
12.5.FUJITSU
12.5.1.Key Facts
12.5.2.Business Description
12.5.3.Products and Services
12.5.4.Financial Overview
12.5.5.SWOT Analysis
12.5.6.Key Developments
12.6.INFINEON TECHNOLOGIES AG
12.6.1.Key Facts
12.6.2.Business Description
12.6.3.Products and Services
12.6.4.Financial Overview
12.6.5.SWOT Analysis
12.6.6.Key Developments
12.7.LAM RESEARCH CORPORATION
12.7.1.Key Facts
12.7.2.Business Description
12.7.3.Products and Services
12.7.4.Financial Overview
12.7.5.SWOT Analysis
12.7.6.Key Developments
12.8.SILICONWARE PRECISION INDUSTRIES CO., LTD. 
12.8.1.Key Facts
12.8.2.Business Description
12.8.3.Products and Services
12.8.4.Financial Overview
12.8.5.SWOT Analysis
12.8.6.Key Developments
12.9.STATS CHIPPAC LTD
12.9.1.Key Facts
12.9.2.Business Description
12.9.3.Products and Services
12.9.4.Financial Overview
12.9.5.SWOT Analysis
12.9.6.Key Developments
12.10.TOKYO ELECTRON LIMITED
12.10.1.Key Facts
12.10.2.Business Description
12.10.3.Products and Services
12.10.4.Financial Overview
12.10.5.SWOT Analysis
12.10.6.Key Developments

13.APPENDIX
13.1.ABOUT THE INSIGHT PARTNERS
13.2.GLOSSARY OF TERMS
The List of Companies

1.Amkor Technology
2.Applied Materials, Inc.
3.Brewer Science, Inc.
4.Deca Technologies
5.Fujitsu
6.Infineon Technologies AG
7.LAM RESEARCH CORPORATION
8.Siliconware Precision Industries Co., Ltd.
9.STATS ChipPAC Ltd
10.Tokyo Electron Limited
TIPRE00015725
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