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North America Sip Technology Market Scope And Analysis

  • Report Code : TIPRE00018173
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 135
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North America SiP Technology Market Analysis, Trends, and Scope 2020 to 2027

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North America SiP Technology Market Report North America SiP Technology Market Size and Share North America SiP Technology Market Scope and Analysis

North America SiP Technology Market Report Scope

Report Attribute Details
Market size in 2019 US$ 4553.9 Million
Market Size by 2027 US$ 7676.1 Million
Global CAGR (2020 - 2027) 9.1%
Historical Data 2017-2018
Forecast period 2020-2027
Segments Covered By Packaging Technology
  • 2D IC
  • 2.5D IC
  • 3D IC
By Packaging Type
  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP
By Interconnection technique
  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
By End-User Industry
  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Market leaders and key company profiles
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • ChipMOS TECHNOLOGIES INC
  • JCET Group Co Ltd
  • Qualcomm Technologies Inc
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
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