North America SiP Technology Market Trends and Analysis by 2027

Historic Data: 2017-2018   |   Base Year: 2019   |   Forecast Period: 2020-2027

North America SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

  • Report Date : Jan 2021
  • Report Code : TIPRE00018173
  • Category : Electronics and Semiconductor
  • Status : Published
  • Available Report Formats : pdf-format excel-format
  • No. of Pages : 135

The SiP technology market in North America is expected to grow from US$ 4553.9 million in 2019 to US$ 7676.1 million by 2027; it is estimated to grow at a CAGR of 9.1% from 2020 to 2027.

The US, Canada, and Mexico are major economies in North America. Electronic miniaturization is at high demand and this is the major factor driving the North America SiP technology market. Growing trend of the small form factor based handheld electronic devices is one of the major factors, which accelerates market growth. The technological advancement in electronics forming such as miniaturization has influenced various markets such as military, aerospace, medical, media, retail and consumer electronics. The devices with small form factor-based packages embed more functionality and becoming alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphone, compact PCs and others devices are occupied with system in package technology-based components such as processor, sensors, RF modules and others. Continuous development in advanced packaging technology such as 3D IC, 2.5D IC and others are further supplementing the North America SiP technology market by resolving the technical challenges. The innovation is solutions is enhancing device performance as smaller space increase connectivity and control. Market players are also taking effort to further optimize the system in package technology for better solution formation. Apple Company is announced to use system in package technology for upcoming devices to reduce the size through miniaturization. Hence the Such rising development and demand for miniaturized electronics devices is expected to create a significant demand for SiP technology in the coming years, which would ultimately drive the market in North America.

Further, the ongoing COVID-19 is having a very devastating impact over the North America region. Presently, the US is the worst-affected country due to the COVID-19 outbreak. North America is one of the most important regions for the adoption and growth of new technologies owing to favorable government policies to boost innovation, the presence of a high-tech companies, and high purchasing power, especially in developed countries such as the US and Canada. North American market suffered huge loss in the first half of 2020 owing to high number of COVID-19 patient’s cases, specifically in the US. Post lockdown a market witnessed increasing demand for the digital devices. North America is among the eminent regions in the adoption of advanced network connection devices owing to favorable infrastructure support for high speed internet services. The adoption of the 5G network is supposed to drive the market growth post lockdown. The effect has major impact on manufacturing facilities as production capacities was lowered. Although, the demand for electronics remained still which helped the market to resume the growth. For instance, in December, 2020, Qualcomm Inc a leading manufacturer of microprocessors has predicted that shipments of 5G smartphones will double in year 2022, driven by increasing 5G network deployment. Such increasing adoption of 5G network is lowering the COVID-19 impact for the post lockdown period, while in lockdown it certainly hampered the market growth.
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North America SiP Technology Market Segmentation

North America SiP Technology Market – By Packaging Technology

  • 2D IC
  • 2.5D IC
  • 3D IC

North America SiP Technology Market – By Packaging Type

  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP

North America SiP Technology Market – By Interconnection Technique

  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Others

North America SiP Technology Market – By End-User Industry

  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
  • Others

North America SiP Technology Market, by Country

  • US
  • Canada
  • Mexico

North America SiP Technology Market - Companies Mentioned

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated

North America SiP Technology Report Scope

Report Attribute Details
Market size in 2019 US$ 4553.9 Million
Market Size by 2027 US$ 7676.1 Million
Global CAGR (2020 - 2027) 9.1%
Historical Data 2017-2018
Forecast period 2020-2027
Segments Covered By Packaging Technology
  • 2D IC
  • 2.5D IC
  • 3D IC
By Packaging Type
  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP
By Interconnection technique
  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
By End-User Industry
  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Market leaders and key company profiles
  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated
  • Naveen Chittaragi
    Naveen Chittaragi
    Associate Vice President,
    Market Research & Consulting

    Naveen is an experienced market research and consulting professional with over 9 years of expertise across custom, syndicated, and consulting projects. Currently serving as Associate Vice President, he has successfully managed stakeholders across the project value chain and has authored over 100 research reports and 30+ consulting assignments. His work spans across industrial and government projects, contributing significantly to client success and data-driven decision-making.

    Naveen holds an Engineering degree in Electronics & Communication from VTU, Karnataka, and an MBA in Marketing & Operations from Manipal University. He has been an active IEEE member for 9 years, participating in conferences, technical symposiums, and volunteering at both section and regional levels. Prior to his current role, he worked as an Associate Strategic Consultant at IndustryARC and as an Industrial Server Consultant at Hewlett Packard (HP Global).

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    Our Clients

    Some of the leading companies are:

    1. Amkor Technology, Inc.
    2. ASE Technology Holding Co., Ltd.
    3. ChipMOS TECHNOLOGIES INC.
    4. JCET Group Co., Ltd.
    5. Qualcomm Technologies, Inc.
    6. Renesas Electronics Corporation
    7. Samsung
    8. Taiwan Semiconductor Manufacturing Company, Limited
    9. Texas Instruments Incorporated
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