The SiP technology market in North America is expected to grow from US$ 4553.9 million in 2019 to US$ 7676.1 million by 2027; it is estimated to grow at a CAGR of 9.1% from 2020 to 2027.
The US, Canada, and Mexico are major economies in North America. Electronic miniaturization is at high demand and this is the major factor driving the North America SiP technology market. Growing trend of the small form factor based handheld electronic devices is one of the major factors, which accelerates market growth. The technological advancement in electronics forming such as miniaturization has influenced various markets such as military, aerospace, medical, media, retail and consumer electronics. The devices with small form factor-based packages embed more functionality and becoming alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphone, compact PCs and others devices are occupied with system in package technology-based components such as processor, sensors, RF modules and others. Continuous development in advanced packaging technology such as 3D IC, 2.5D IC and others are further supplementing the North America SiP technology market by resolving the technical challenges. The innovation is solutions is enhancing device performance as smaller space increase connectivity and control. Market players are also taking effort to further optimize the system in package technology for better solution formation. Apple Company is announced to use system in package technology for upcoming devices to reduce the size through miniaturization. Hence the Such rising development and demand for miniaturized electronics devices is expected to create a significant demand for SiP technology in the coming years, which would ultimately drive the market in North America.Further, the ongoing COVID-19 is having a very devastating impact over the North America region. Presently, the US is the worst-affected country due to the COVID-19 outbreak. North America is one of the most important regions for the adoption and growth of new technologies owing to favorable government policies to boost innovation, the presence of a high-tech companies, and high purchasing power, especially in developed countries such as the US and Canada. North American market suffered huge loss in the first half of 2020 owing to high number of COVID-19 patient’s cases, specifically in the US. Post lockdown a market witnessed increasing demand for the digital devices. North America is among the eminent regions in the adoption of advanced network connection devices owing to favorable infrastructure support for high speed internet services. The adoption of the 5G network is supposed to drive the market growth post lockdown. The effect has major impact on manufacturing facilities as production capacities was lowered. Although, the demand for electronics remained still which helped the market to resume the growth. For instance, in December, 2020, Qualcomm Inc a leading manufacturer of microprocessors has predicted that shipments of 5G smartphones will double in year 2022, driven by increasing 5G network deployment. Such increasing adoption of 5G network is lowering the COVID-19 impact for the post lockdown period, while in lockdown it certainly hampered the market growth.
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North America SiP Technology Market Segmentation
North America SiP Technology Market – By Packaging Technology
- 2D IC
- 2.5D IC
- 3D IC
North America SiP Technology Market – By Packaging Type
- Flip-Chip/Wire-Bond SiP
- Fan-Out SiP
- Embedded SiP
North America SiP Technology Market – By Interconnection Technique
- Small Outline
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Others
North America SiP Technology Market – By End-User Industry
- Automotive
- Aerospace and Defense
- Consumer Electronics
- Telecommunication
- Others
North America SiP Technology Market, by Country
- US
- Canada
- Mexico
North America SiP Technology Market - Companies Mentioned
- Amkor Technology, Inc.
- ASE Technology Holding Co., Ltd.
- ChipMOS TECHNOLOGIES INC.
- JCET Group Co., Ltd.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments Incorporated
North America SiP Technology Report Scope
Report Attribute | Details |
---|---|
Market size in 2019 | US$ 4553.9 Million |
Market Size by 2027 | US$ 7676.1 Million |
Global CAGR (2020 - 2027) | 9.1% |
Historical Data | 2017-2018 |
Forecast period | 2020-2027 |
Segments Covered |
By Packaging Technology
|
Regions and Countries Covered | North America
|
Market leaders and key company profiles |
- Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
- PEST and SWOT Analysis
- Market Size Value / Volume - Global, Regional, Country
- Industry and Competitive Landscape
- Excel Dataset
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Some of the leading companies are:
- Amkor Technology, Inc.
- ASE Technology Holding Co., Ltd.
- ChipMOS TECHNOLOGIES INC.
- JCET Group Co., Ltd.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments Incorporated


