2031 年无线芯片组市场规模报告、分享、分析和预测

  • Report Code : TIPTE00002200
  • Category : Electronics and Semiconductor
  • Status : Upcoming
  • No. of Pages : 150
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[研究报告] 无线芯片组市场规模预计将从2022年的219亿美元增长到2030年的327亿美元;预计 2022 年至 2030 年复合年增长率为 5.2%。

分析师观点:

无线芯片组市场是技术行业中一个充满活力且快速发展的领域。市场增长的一些关键驱动因素包括公共 Wi-Fi 热点数量的不断增加以及物联网 (IoT) 在各个行业和地区的采用、企业和企业不断扩大使用 Wi-Fi 来吸引客户以及关系管理、对高速数据传输和带宽日益增长的需求以及连接设备更广泛的覆盖范围,以及新 Wi-Fi 技术和标准的出现,例如 IEEE 802.11be、802.11ax、802.11ac 和 802.11ad(威吉格)。市场增长面临的一些关键挑战包括过去几年平板电脑和个人电脑出货量的下降,这减少了对Wi-Fi芯片组的需求,新Wi-Fi技术和标准的标准化和认证时间较长,由于使用 5 GHz 频段,LTE-U 中与 LTE 的共存问题增加,这影响了 Wi-Fi 芯片组的性能和可靠性。

市场概况:

无线芯片组是集成在电子设备中的基本组件,可促进与其他无线设备的无缝通信。这一关键硬件在各种产品中得到广泛应用,包括计算机、路由器和传输或接收无线信号的无线设备。在计算机系统中,无线芯片组使设备能够与兼容的无线设备建立连接。如果没有无线芯片组,仅配备以太网卡的计算机将无法验证与无线网络的连接。计算机中最常用的无线芯片组类型之一是 WLAN 卡,它采用 802.11b 或 802.11g 无线技术。

各种因素影响着无线局域网卡的发展和采用。无线芯片组市场。这些因素之一是各种设备(包括计算机、路由器和其他支持无线功能的设备)对无线连接的需求不断增长。这种需求的增加主要是由智能设备的广泛使用和不断发展的物联网 (IoT) 生态系统推动的,这需要无缝的无线通信。另一个重要驱动因素是无线技术的不断进步,例如 802.11ac 和 802.11ax(Wi-Fi 6 和 Wi-Fi 6E)等更快、更高效的无线标准的开发。这些技术进步提高了数据传输速率、提高了网络容量并提高了整体性能,从而推动了对升级无线芯片组的需求。

此外,无线连接在各行业中的采用越来越多汽车、医疗保健和智能家居等领域促进了无线芯片组市场的扩张。无线芯片组现在通常集成到车辆中,以促进车内连接和高级驾驶员辅助系统 (ADAS)。在医疗保健领域,这些芯片组支持医疗设备和远程医疗应用的利用,从而实现远程患者监控和无缝数据传输。此外,对高速互联网接入的需求不断增长以及5G网络的部署为无线芯片制造商创造了机会。 5G技术的实施需要能够支持网络更高数据速率和低延迟的先进芯片组,从而推动对5G兼容芯片组的需求。

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市场驱动因素:

高速需求不断增长互联网接入和 5G 网络

对高速互联网接入日益增长的需求深刻影响了无线芯片组市场。随着联网设备的增长以及人们越来越依赖在线服务,对快速、可靠的连接有强烈的需求。这种需求促使无线芯片组制造商开发更先进的芯片组,能够提供更高的数据传输速率和改进的网络性能,满足从事高清视频流、在线游戏和使用基于云的应用程序等活动的用户的期望。 5G网络的部署开创了连接的新时代,具有更快的速度、更低的延迟和更大的网络容量。 5G 技术的功能可实现广泛的应用,包括智能城市、自动驾驶汽车和工业自动化,这些应用严重依赖于无缝和高带宽无线通信。先进的无线芯片组对于充分利用 5G 网络的潜力至关重要。这些芯片组专门设计用于支持 5G 提供的更高数据速率和低延迟,使设备能够充分利用网络的功能。无线芯片组制造商努力开发适合 5G 网络的芯片组来满足这些需求。这些芯片组集成了大规模 MIMO(多输入多输出)、波束成形和更高频段等尖端技术。通过整合这些进步,芯片组可实现更快、更可靠的无线通信。它们经过优化,可满足与 5G 相关的更高的数据吞吐量和低延迟要求,最终确保无缝的用户体验。

细分和范围:

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“无线芯片组市场”根据连接性、应用程序和地理位置进行细分。在连接方面,无线芯片组市场分为 Wi-Fi、蓝牙、ZigBee、Z-Wave 等。根据应用,无线芯片组市场分为消费电子、工业自动化等。根据地理位置,它分为北美、欧洲、亚太地区、中东和中东地区。非洲和南美洲。

细分分析:

根据应用,无线芯片组市场分为消费电子、工业自动化等。消费电子领域在无线芯片组市场中占有重要地位。消费电子产品指广泛的个人和娱乐设备,包括智能手机、平板电脑、笔记本电脑、智能电视、游戏机和可穿戴设备。无线芯片组可在这些消费电子设备中实现无线连接和通信功能。它们促进 Wi-Fi、蓝牙和其他无线技术等功能的发展,从而实现设备之间的无缝连接、数据传输和通信。智能设备的日益普及推动了消费电子产品对高性能无线芯片组的需求、对更快数据传输速率的需求以及消费者对无缝连接和用户体验不断增长的期望。无线芯片组支持工业自动化系统中的无线通信和连接。它们用于机器对机器通信、远程监控、资产跟踪和传感器网络。这些芯片组提供可靠、安全的无线连接,实现工业过程的实时数据传输、控制和监控。提高效率、减少停机时间、提高安全性以及采用工业 4.0 原则的需求推动了工业自动化领域对无线芯片组的需求。无线芯片组市场的另一个部分涵盖消费电子和工业自动化以外的各种行业和应用。该细分市场包括医疗保健、交通和智慧城市等行业。

区域分析:

亚太地区在无线芯片组市场中发挥着重要作用。高速互联网接入需求的不断扩大、5G 网络的部署以及物联网技术的日益采用等因素促进了该地区的增长,并为无线芯片组市场带来了众多机遇。亚太地区拥有许多互联网用户,其中中国是一个重要的贡献者。 2021年,该地区成为全球互联网用户数量最多的地区,表明对高速互联网接入的强劲需求。这种需求推动了对先进无线芯片组的需求,以提供更快的数据传输速率和改进的网络性能。中国在亚太无线芯片市场至关重要,占据了相当大的市场份额。该国无线技术的广泛使用,特别是在银行业,扩大了无线芯片组市场。智能设备日益占据主导地位,以及各行业对无线连接不断增长的需求,进一步推动了无线芯片组市场的增长。

主要参与者分析:

Atmel Corporation、Broadcom Inc.、Intel Corporation、MediaTek Inc.、NXP Semiconductors NV、Qorvo, Inc.、Qualcomm Technologies Inc.、Silicon Laboratories, Inc.、Sony Corporation ,德州仪器公司是报告中介绍的主要市场参与者之一。

最新动态:

市场上的公司高度采用并购等无机和有机策略。以下列出了近期的一些关键进展:

  • 2023 年 11 月,采用 Wi-Fi 7 技术的先驱联发科进一步巩固了其作为 Wi-Fi 7 技术领先者的地位。通过推出最新产品 Filogic 860 和 Filogic 360 解决方案,成为行业领导者。这些第二代产品进一步增强了联发科技业已广泛的 Wi-Fi 7 解决方案组合,使其成为业界最全面的解决方案。借助这些新解决方案,联发科旨在扩展其先进产品平台,利用连接技术的最新进展。
  • 2023 年 9 月,英特尔公司和博通公司最近合作在 Wi-Fi 7 领域展示了前所未有的跨供应商兼容性演示。该展示展示了英特尔®核心™基于处理器的笔记本电脑,配备先进的 Wi-Fi 7 解决方案,无缝连接到 Broadcom Wi-Fi 7 接入点。这项开创性的试验实现了超过每秒 5 吉比特的无线速度,超越了之前的行业基准。这两个行业领导者之间的成功合作凸显了他们对推进无线技术的承诺,并展示了未来跨各种设备和网络实施 Wi-Fi 7 的潜力。
  • 2023 年 6 月,Broadcom Inc.最近宣布推出专为 Wi-Fi 7 生态系统设计的第二代无线连接芯片组解决方案的样品产品。这些解决方案可满足各种应用的需求,包括 Wi-Fi 路由器、住宅网关、企业接入点和客户端设备。这些新芯片的推出进一步增强了 Broadcom 现有的产品生态系统,包括其第一代 Wi-Fi 7 芯片。第二代芯片不仅提供了额外的功能,而且还扩大了博通产品的市场范围。此公告标志着博通致力于推进无线连接技术并满足各行业和消费者不断变化的需求。
Report Coverage
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Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
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Regional Scope
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North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

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The List of Companies

1. Atmel Corporation
2. Broadcom Inc.
3. Intel Corporation
4. MediaTek Inc.
5. NXP Semiconductors N.V.
6. Qorvo, Inc.
7. Qualcomm Technologies Inc.
8. Silicon Laboratories, Inc.
9. Sony Corporation
10. Texas Instruments Inc.

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

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