3D IC Market 2027 by Packaging Technology, Application, End-User and Geography | The Insight Partners

3D IC Market Forecast to 2027 - Covid-19 Impact and Global Analysis - by Packaging Technology (3D Wafer-Level Chip-Scale Packaging (WLCSP), 3D TSV); Application (LED, Memories, Sensor, MEMS, Others); End-User (IT and Telecom, Consumer Electronics, Automotive, Military and Aerospace, Others) and Geography

Report Code: TIPRE00009538 | No. of Pages: 150 | Category: Electronics and Semiconductor | Status: Upcoming
Covid
MARKET INTRODUCTION

A 3D IC (three-dimensional integrated circuit) is a package through multiple layers of silicon wafers stalked together, along with various electronic components utilizing through-silicon vias (TSVs). This emerging technology is getting propelled by the requirement of improving performance as well as the objective to reduce timing delays. As the functional integration requirement grows, assembly and wafer fabrication companies are increasingly seeking for 3D IC technology. 3D ICs are widely utilized in applications such as LED, sensors, memory, and others.

MARKET DYNAMICS

The major factor that is boosting the growth of the 3D IC market is the rising need for advanced architecture in the electronic products and growing trend of miniaturization of the electronics devices. In addition, the increasing adoption of high-end computing, data centers, and servers is anticipated to provide significant growth opportunities for the 3D IC market in the coming years.

MARKET SCOPE

The "Global 3D IC Market Analysis to 2027" is a specialized and in-depth study of the 3D IC industry with a special focus on the global market trend analysis. The report aims to provide an overview of 3D IC market with detailed market segmentation by packaging technology, application, end-user, and geography. The global 3D IC market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading 3D IC market players and offers key trends and opportunities in the market.

MARKET SEGMENTATION

The global 3D IC market is segmented on the basis of packaging technology, application, and end-user. Based on packaging technology, the market is segmented as 3D Wafer-Level Chip-Scale Packaging (WLCSP) and 3D TSV. Based on application, the 3D IC market is divided into LED, memories, sensor, MEMS, others. Further, based on end-users, the 3D IC market is segments into IT and telecom, consumer electronics, automotive, military and aerospace, others.

REGIONAL FRAMEWORK

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global 3D IC market based on various segments. it also provides market size and forecast estimates from the year 2017 to 2027 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), and Rest of World (RoW). The 3D IC market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 15 countries globally along with the current trend and opportunities prevailing in the region.

The report analyzes factors affecting 3D IC market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period, i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for the 3D IC market for each region.



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MARKET PLAYERS


The reports cover key developments in the 3D IC market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved the way for the expansion of business and customer base of market players. The market payers from 3D IC market are anticipated to lucrative growth opportunities in the future with the rising demand for 3D IC in the global market. Below mentioned is the list of few companies engaged in the 3D IC market.

The report also includes the profiles of key companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last three years, key development in the past five years.

  •  Advanced Semiconductor Engineering, Inc.
  •  Amkor Technology
  •  IBM Corporation
  •  Intel Corporation
  •  Micron Technology, Inc.
  •  Samsung Electronics Co., Ltd.
  •  STMicroelectronics N.V.
  •  Taiwan Semiconductor Manufacturing Company Limited
  •  Toshiba Corporation
  •  Xilinx Inc.

The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.


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TABLE OF CONTENTS

1. INTRODUCTION
1.1. SCOPE OF THE STUDY
1.2. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3. MARKET SEGMENTATION
1.3.1 3D IC Market - By Packaging Technology
1.3.2 3D IC Market - By Application
1.3.3 3D IC Market - By End-User
1.3.4 3D IC Market - By Region
1.3.4.1 By Country

2. KEY TAKEAWAYS

3. RESEARCH METHODOLOGY

4. 3D IC MARKET LANDSCAPE
4.1. OVERVIEW
4.2. PEST ANALYSIS
4.2.1 North America - Pest Analysis
4.2.2 Europe - Pest Analysis
4.2.3 Asia-Pacific - Pest Analysis
4.2.4 Rest of the World - Pest Analysis
4.3. ECOSYSTEM ANALYSIS
4.4. EXPERT OPINIONS

5. 3D IC MARKET - KEY MARKET DYNAMICS
5.1. KEY MARKET DRIVERS
5.2. KEY MARKET RESTRAINTS
5.3. KEY MARKET OPPORTUNITIES
5.4. FUTURE TRENDS
5.5. IMPACT ANALYSIS OF DRIVERS, RESTRAINTS & EXPECTED INFLUENCE OF COVID-19 PANDEMIC

6. 3D IC MARKET - GLOBAL MARKET ANALYSIS
6.1. 3D IC - GLOBAL MARKET OVERVIEW
6.2. 3D IC - GLOBAL MARKET AND FORECAST TO 2027
6.3. MARKET POSITIONING/MARKET SHARE

7. 3D IC MARKET - REVENUE AND FORECASTS TO 2027 - PACKAGING TECHNOLOGY
7.1. OVERVIEW
7.2. PACKAGING TECHNOLOGY MARKET FORECASTS AND ANALYSIS
7.3. 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)
7.3.1. Overview
7.3.2. 3D Wafer-Level Chip-Scale Packaging (WLCSP) Market Forecast and Analysis
7.4. 3D TSV
7.4.1. Overview
7.4.2. 3D TSV Market Forecast and Analysis
8. 3D IC MARKET - REVENUE AND FORECASTS TO 2027 - APPLICATION
8.1. OVERVIEW
8.2. APPLICATION MARKET FORECASTS AND ANALYSIS
8.3. LED
8.3.1. Overview
8.3.2. LED Market Forecast and Analysis
8.4. MEMORIES
8.4.1. Overview
8.4.2. Memories Market Forecast and Analysis
8.5. SENSOR
8.5.1. Overview
8.5.2. Sensor Market Forecast and Analysis
8.6. MEMS
8.6.1. Overview
8.6.2. MEMS Market Forecast and Analysis
8.7. OTHERS
8.7.1. Overview
8.7.2. Others Market Forecast and Analysis
9. 3D IC MARKET - REVENUE AND FORECASTS TO 2027 - END-USER
9.1. OVERVIEW
9.2. END-USER MARKET FORECASTS AND ANALYSIS
9.3. IT AND TELECOM
9.3.1. Overview
9.3.2. IT and Telecom Market Forecast and Analysis
9.4. CONSUMER ELECTRONICS
9.4.1. Overview
9.4.2. Consumer Electronics Market Forecast and Analysis
9.5. AUTOMOTIVE
9.5.1. Overview
9.5.2. Automotive Market Forecast and Analysis
9.6. MILITARY AND AEROSPACE
9.6.1. Overview
9.6.2. Military and Aerospace Market Forecast and Analysis
9.7. OTHERS
9.7.1. Overview
9.7.2. Others Market Forecast and Analysis

10. 3D IC MARKET REVENUE AND FORECASTS TO 2027 - GEOGRAPHICAL ANALYSIS
10.1. NORTH AMERICA
10.1.1 North America 3D IC Market Overview
10.1.2 North America 3D IC Market Forecasts and Analysis
10.1.3 North America 3D IC Market Forecasts and Analysis - By Packaging Technology
10.1.4 North America 3D IC Market Forecasts and Analysis - By Application
10.1.5 North America 3D IC Market Forecasts and Analysis - By End-User
10.1.6 North America 3D IC Market Forecasts and Analysis - By Countries
10.1.6.1 United States 3D IC Market
10.1.6.1.1 United States 3D IC Market by Packaging Technology
10.1.6.1.2 United States 3D IC Market by Application
10.1.6.1.3 United States 3D IC Market by End-User
10.1.6.2 Canada 3D IC Market
10.1.6.2.1 Canada 3D IC Market by Packaging Technology
10.1.6.2.2 Canada 3D IC Market by Application
10.1.6.2.3 Canada 3D IC Market by End-User
10.1.6.3 Mexico 3D IC Market
10.1.6.3.1 Mexico 3D IC Market by Packaging Technology
10.1.6.3.2 Mexico 3D IC Market by Application
10.1.6.3.3 Mexico 3D IC Market by End-User
10.2. EUROPE
10.2.1 Europe 3D IC Market Overview
10.2.2 Europe 3D IC Market Forecasts and Analysis
10.2.3 Europe 3D IC Market Forecasts and Analysis - By Packaging Technology
10.2.4 Europe 3D IC Market Forecasts and Analysis - By Application
10.2.5 Europe 3D IC Market Forecasts and Analysis - By End-User
10.2.6 Europe 3D IC Market Forecasts and Analysis - By Countries
10.2.6.1 Germany 3D IC Market
10.2.6.1.1 Germany 3D IC Market by Packaging Technology
10.2.6.1.2 Germany 3D IC Market by Application
10.2.6.1.3 Germany 3D IC Market by End-User
10.2.6.2 France 3D IC Market
10.2.6.2.1 France 3D IC Market by Packaging Technology
10.2.6.2.2 France 3D IC Market by Application
10.2.6.2.3 France 3D IC Market by End-User
10.2.6.3 Italy 3D IC Market
10.2.6.3.1 Italy 3D IC Market by Packaging Technology
10.2.6.3.2 Italy 3D IC Market by Application
10.2.6.3.3 Italy 3D IC Market by End-User
10.2.6.4 United Kingdom 3D IC Market
10.2.6.4.1 United Kingdom 3D IC Market by Packaging Technology
10.2.6.4.2 United Kingdom 3D IC Market by Application
10.2.6.4.3 United Kingdom 3D IC Market by End-User
10.2.6.5 Russia 3D IC Market
10.2.6.5.1 Russia 3D IC Market by Packaging Technology
10.2.6.5.2 Russia 3D IC Market by Application
10.2.6.5.3 Russia 3D IC Market by End-User
10.2.6.6 Rest of Europe 3D IC Market
10.2.6.6.1 Rest of Europe 3D IC Market by Packaging Technology
10.2.6.6.2 Rest of Europe 3D IC Market by Application
10.2.6.6.3 Rest of Europe 3D IC Market by End-User
10.3. ASIA-PACIFIC
10.3.1 Asia-Pacific 3D IC Market Overview
10.3.2 Asia-Pacific 3D IC Market Forecasts and Analysis
10.3.3 Asia-Pacific 3D IC Market Forecasts and Analysis - By Packaging Technology
10.3.4 Asia-Pacific 3D IC Market Forecasts and Analysis - By Application
10.3.5 Asia-Pacific 3D IC Market Forecasts and Analysis - By End-User
10.3.6 Asia-Pacific 3D IC Market Forecasts and Analysis - By Countries
10.3.6.1 Australia 3D IC Market
10.3.6.1.1 Australia 3D IC Market by Packaging Technology
10.3.6.1.2 Australia 3D IC Market by Application
10.3.6.1.3 Australia 3D IC Market by End-User
10.3.6.2 China 3D IC Market
10.3.6.2.1 China 3D IC Market by Packaging Technology
10.3.6.2.2 China 3D IC Market by Application
10.3.6.2.3 China 3D IC Market by End-User
10.3.6.3 India 3D IC Market
10.3.6.3.1 India 3D IC Market by Packaging Technology
10.3.6.3.2 India 3D IC Market by Application
10.3.6.3.3 India 3D IC Market by End-User
10.3.6.4 Japan 3D IC Market
10.3.6.4.1 Japan 3D IC Market by Packaging Technology
10.3.6.4.2 Japan 3D IC Market by Application
10.3.6.4.3 Japan 3D IC Market by End-User
10.3.6.5 South Korea 3D IC Market
10.3.6.5.1 South Korea 3D IC Market by Packaging Technology
10.3.6.5.2 South Korea 3D IC Market by Application
10.3.6.5.3 South Korea 3D IC Market by End-User
10.3.6.6 Rest of Asia-Pacific 3D IC Market
10.3.6.6.1 Rest of Asia-Pacific 3D IC Market by Packaging Technology
10.3.6.6.2 Rest of Asia-Pacific 3D IC Market by Application
10.3.6.6.3 Rest of Asia-Pacific 3D IC Market by End-User
10.4. REST OF THE WORLD
10.4.1 Rest of the World 3D IC Market Overview
10.4.2 Rest of the World 3D IC Market Forecasts and Analysis
10.4.3 Rest of the World 3D IC Market Forecasts and Analysis - By Packaging Technology
10.4.4 Rest of the World 3D IC Market Forecasts and Analysis - By Application
10.4.5 Rest of the World 3D IC Market Forecasts and Analysis - By End-User
10.4.6 Rest of the World 3D IC Market Forecasts and Analysis - By Countries
10.4.6.1 MEA 3D IC Market
10.4.6.1.1 MEA 3D IC Market by Packaging Technology
10.4.6.1.2 MEA 3D IC Market by Application
10.4.6.1.3 MEA 3D IC Market by End-User
10.4.6.2 SAM 3D IC Market
10.4.6.2.1 SAM 3D IC Market by Packaging Technology
10.4.6.2.2 SAM 3D IC Market by Application
10.4.6.2.3 SAM 3D IC Market by End-User

11. INDUSTRY LANDSCAPE
11.1. MERGERS AND ACQUISITIONS
11.2. AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
11.3. NEW PRODUCT LAUNCHES
11.4. EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS

12. 3D IC MARKET, KEY COMPANY PROFILES
12.1. ADVANCED SEMICONDUCTOR ENGINEERING, INC.
12.1.1. Key Facts
12.1.2. Business Description
12.1.3. Products and Services
12.1.4. Financial Overview
12.1.5. SWOT Analysis
12.1.6. Key Developments
12.2. AMKOR TECHNOLOGY
12.2.1. Key Facts
12.2.2. Business Description
12.2.3. Products and Services
12.2.4. Financial Overview
12.2.5. SWOT Analysis
12.2.6. Key Developments
12.3. IBM CORPORATION
12.3.1. Key Facts
12.3.2. Business Description
12.3.3. Products and Services
12.3.4. Financial Overview
12.3.5. SWOT Analysis
12.3.6. Key Developments
12.4. INTEL CORPORATION
12.4.1. Key Facts
12.4.2. Business Description
12.4.3. Products and Services
12.4.4. Financial Overview
12.4.5. SWOT Analysis
12.4.6. Key Developments
12.5. MICRON TECHNOLOGY, INC.
12.5.1. Key Facts
12.5.2. Business Description
12.5.3. Products and Services
12.5.4. Financial Overview
12.5.5. SWOT Analysis
12.5.6. Key Developments
12.6. SAMSUNG ELECTRONICS CO., LTD.
12.6.1. Key Facts
12.6.2. Business Description
12.6.3. Products and Services
12.6.4. Financial Overview
12.6.5. SWOT Analysis
12.6.6. Key Developments
12.7. STMICROELECTRONICS N.V.
12.7.1. Key Facts
12.7.2. Business Description
12.7.3. Products and Services
12.7.4. Financial Overview
12.7.5. SWOT Analysis
12.7.6. Key Developments
12.8. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
12.8.1. Key Facts
12.8.2. Business Description
12.8.3. Products and Services
12.8.4. Financial Overview
12.8.5. SWOT Analysis
12.8.6. Key Developments
12.9. TOSHIBA CORPORATION
12.9.1. Key Facts
12.9.2. Business Description
12.9.3. Products and Services
12.9.4. Financial Overview
12.9.5. SWOT Analysis
12.9.6. Key Developments
12.10. XILINX INC.
12.10.1. Key Facts
12.10.2. Business Description
12.10.3. Products and Services
12.10.4. Financial Overview
12.10.5. SWOT Analysis
12.10.6. Key Developments

13. APPENDIX
13.1. ABOUT THE INSIGHT PARTNERS
13.2. GLOSSARY OF TERMS
The List of Companies

1.Advanced Semiconductor Engineering, Inc.
2.Amkor Technology
3.IBM Corporation
4.Intel Corporation
5.Micron Technology, Inc.
6.Samsung Electronics Co., Ltd.
7.STMicroelectronics N.V.
8.Taiwan Semiconductor Manufacturing Company Limited
9.Toshiba Corporation
10.Xilinx Inc.
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