Europe SiP Technology Market Dynamics and Trends by 2027

Historic Data: 2017-2018 | Base Year: 2019 | Forecast Period: 2020-2027

Europe SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

Report Date : Jan 2021
Report Code : TIPRE00018161

Category : Electronics and Semiconductor
Status : Published

Available Report Formats :
No. of Pages : 149

Page Updated: Feb 2021

Analysis Strategic Insights Market Drivers Regional Insights Report Scope Recent Developments FAQs

The SiP technology market in Europe is expected to grow from US$ 2187.5 million in 2019 to US$ 4164.9 million by 2027; it is estimated to grow at a CAGR of 10.8% from 2020 to 2027.

The Germany, France, Italy, UK and Russia are major economies in Europe. 5G networks are developing at fast pace and this is the major factor driving the Europe SiP technology market. System in package technology is acquiring huge potential available in 5G computing and networking market as the technology is getting used for wide range of products such as 5G Computing and networking modems, 5G NR Antenna-in-Package (AiP) and others. Advent of the 5G in developed nations such as UK, Rusia is boosting the internet services and demand for supporting devices. 5G based devices market is enhancing with significant growth rate, which ultimately increasing the demand for system in package technology. According to the Cisco, 5G speed will offer 13 times higher speed than average mobile connection and will help the internet service market. The SiP technology is also getting adopted in the 5G supporting smartphones, high speed RF and wireless devices, and others. Technology offers various benefits for the consumers such as enhanced performance, smaller size and assured reliability with low cost. Market players are offering advanced solution for the customers for improved result and performance. For instance, in Mercury Systems Inc., company introduced new RFS1080 trusted system-in-package (SiP) processing technology for 5G communication application. Hence rising demand for 5G devices are driving as well as creating opportunities for the companies to innovate and develop new devices using system in package technology, which is expected to create a significant demand for SiP technology in the coming years, which would ultimately drive the market in Europe.

Europe is adversely affected by the ongoing COVID-19 outbreak. Spain, Italy, Germany, the UK, and France are a few of the worst affected countries in the region. Businesses in Europe are facing severe economic difficulties as they are either suspending their operations or reducing their activities in a substantial manner

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The growth of the SiP technology market in Europe was hindered in the first half of 2020 as COVID-19 infected cases were rising with the significant rate. Countries such as Russia, France, Spain, the UK, and others had the major count of COVID-19 cases on daily basis owing to which lockdown was imposed across various countries, which hampered the SiP technology market growth. The semiconductor industry in Europe is resuming at slower growth rate than other regions. The demand from the industrial and automotive electronics has witnessed stronger hit than consumer electronics and communication electronics due to the COVID-19 pandemic. Post lockdown, the market is growing with the support from advanced electronics devices. For instance, Maggy (a Belgium-based company) is using Silicon Labs Bluetooth SiP module to develop new compact wearable for distancing application.

This FREE sample will include data analysis, ranging from market trends to estimates and forecasts.

Europe SiP Technology Market Segmentation

Europe SiP Technology Market – By Packaging Technology

2D IC
2.5D IC
3D IC

Europe SiP Technology Market – By Packaging Type

Flip-Chip/Wire-Bond SiP
Fan-Out SiP
Embedded SiP

Europe SiP Technology Market – By Interconnection Technique

Small Outline
Flat Packages
Pin Grid Arrays
Surface Mount
Others

Europe SiP Technology Market – By End-User Industry

Automotive
Aerospace and Defense
Consumer Electronics
Telecommunication
Others

Europe SiP Technology Market, by Country

Germany
France
Italy
UK
Russia
Rest of Europe

Europe SiP Technology Market - Companies Mentioned

Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
GS Nanotech
JCET Group Co., Ltd.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments Incorporated

Europe SiP Technology Report Scope

Report Attribute	Details
Market size in 2019	US$ 2187.5 Million
Market Size by 2027	US$ 4164.9 Million
Global CAGR (2020 - 2027)	10.8%
Historical Data	2017-2018
Forecast period	2020-2027
Segments Covered	By Packaging Technology 2D IC 2.5D IC 3D IC By Packaging Type Flip-Chip/Wire-Bond SiP Fan-Out SiP Embedded SiP By Interconnection technique Small Outline Flat Packages Pin Grid Arrays Surface Mount By End-User Industry Automotive Aerospace and Defense Consumer Electronics Telecommunication
Regions and Countries Covered	Europe UK Germany France Russia Italy Rest of Europe
Market leaders and key company profiles	Amkor Technology, Inc. ASE Technology Holding Co., Ltd. GS Nanotech JCET Group Co., Ltd. Qualcomm Technologies, Inc. Renesas Electronics Corporation Samsung Taiwan Semiconductor Manufacturing Company, Limited Texas Instruments Incorporated

Research Manager

Naveen Chittaragi

Associate Vice President,
Market Research & Consulting

Naveen is an experienced market research and consulting professional with over 9 years of expertise across custom, syndicated, and consulting projects. Currently serving as Associate Vice President, he has successfully managed stakeholders across the project value chain and has authored over 100 research reports and 30+ consulting assignments. His work spans across industrial and government projects, contributing significantly to client success and data-driven decision-making.

Naveen holds an Engineering degree in Electronics & Communication from VTU, Karnataka, and an MBA in Marketing & Operations from Manipal University. He has been an active IEEE member for 9 years, participating in conferences, technical symposiums, and volunteering at both section and regional levels. Prior to his current role, he worked as an Associate Strategic Consultant at IndustryARC and as an Industrial Server Consultant at Hewlett Packard (HP Global).

What are the Europe SiP Technology Market report deliverables?

Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
PEST and SWOT Analysis
Market Size Value / Volume - Global, Regional, Country
Industry and Competitive Landscape
Excel Dataset

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