Europe SiP Technology Market to Grow at a CAGR of 10.8% to reach US$ 4,164.9 Million from 2020 to 2027

Europe SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

  • Report Code : TIPRE00018161
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 149
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The SiP technology market in Europe is expected to grow from US$ 2187.5 million in 2019 to US$ 4164.9 million by 2027; it is estimated to grow at a CAGR of 10.8% from 2020 to 2027.

The Germany, France, Italy, UK and Russia are major economies in Europe. 5G networks are developing at fast pace and this is the major factor driving the Europe SiP technology market. System in package technology is acquiring huge potential available in 5G computing and networking market as the technology is getting used for wide range of products such as 5G Computing and networking modems, 5G NR Antenna-in-Package (AiP) and others. Advent of the 5G in developed nations such as UK, Rusia is boosting the internet services and demand for supporting devices. 5G based devices market is enhancing with significant growth rate, which ultimately increasing the demand for system in package technology. According to the Cisco, 5G speed will offer 13 times higher speed than average mobile connection and will help the internet service market. The SiP technology is also getting adopted in the 5G supporting smartphones, high speed RF and wireless devices, and others. Technology offers various benefits for the consumers such as enhanced performance, smaller size and assured reliability with low cost. Market players are offering advanced solution for the customers for improved result and performance. For instance, in Mercury Systems Inc., company introduced new RFS1080 trusted system-in-package (SiP) processing technology for 5G communication application. Hence rising demand for 5G devices are driving as well as creating opportunities for the companies to innovate and develop new devices using system in package technology, which is expected to create a significant demand for SiP technology in the coming years, which would ultimately drive the market in Europe.

Europe is adversely affected by the ongoing COVID-19 outbreak. Spain, Italy, Germany, the UK, and France are a few of the worst affected countries in the region. Businesses in Europe are facing severe economic difficulties as they are either suspending their operations or reducing their activities in a substantial manner

.

The growth of the SiP technology market in Europe was hindered in the first half of 2020 as COVID-19 infected cases were rising with the significant rate. Countries such as Russia, France, Spain, the UK, and others had the major count of COVID-19 cases on daily basis owing to which lockdown was imposed across various countries, which hampered the SiP technology market growth. The semiconductor industry in Europe is resuming at slower growth rate than other regions. The demand from the industrial and automotive electronics has witnessed stronger hit than consumer electronics and communication electronics due to the COVID-19 pandemic. Post lockdown, the market is growing with the support from advanced electronics devices. For instance, Maggy (a Belgium-based company) is using Silicon Labs Bluetooth SiP module to develop new compact wearable for distancing application.

SiP technology market
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Europe SiP Technology Market Segmentation  

Europe SiP Technology Market – By Packaging Technology

  • 2D IC
  • 2.5D IC
  • 3D IC

Europe SiP Technology Market – By Packaging Type

  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP

Europe SiP Technology Market – By Interconnection Technique

  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Others

Europe SiP Technology Market – By End-User Industry

  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
  • Others

Europe SiP Technology Market, by Country

  • Germany
  • France
  • Italy
  • UK
  • Russia
  • Rest of Europe

Europe SiP Technology Market - Companies Mentioned

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • GS Nanotech
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

Packaging Technology, Packaging Type, Interconnection technique, and End-User Industry

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

UK, Germany, France, Italy, Russia

TABLE OF CONTENTS

1. Introduction

1.1 Scope of the Study

1.2 The Insight Partners Research Report Guidance

1.3 Market Segmentation

1.3.1 Europe System in Package (SiP) Technology Market – By Packaging Technology

1.3.2 Europe System in Package (SiP) Technology Market – By Packaging Type

1.3.3 Europe System in Package (SiP) Technology Market – By Interconnection Technology

1.3.4 Europe System in Package (SiP) Technology Market – By End-User Industry

1.3.5 Europe System in Package (SiP) Technology Market – By Country

2. Key Takeaways

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Europe SiP Technology – Market Landscape

4.1 Market Overview

4.2 Europe PEST Analysis

4.3 Ecosystem Analysis

5. Europe SiP Technology –Market Dynamics

5.1 Key Market Drivers

5.1.1 Rapid Rise in Demand for Miniaturization of Electronic Devices

5.1.2 5G Network Developing at Fast Pace

5.2 Key Market Restraints

5.2.1 Availability of Substitutes and Technological Problems

5.3 Key Market Opportunities

5.3.1 Smartphone and PC Market to Become Advanced

5.4 Future Trends

5.4.1 Introduction of Wearable technology and the IoT in Market

5.5 Impact Analysis of Drivers and Restraints

6. SiP Technology Market – Europe Analysis

6.1 Europe System in Package (SiP) Technology Market Overview

6.2 Europe System in Package (SiP) Technology Market Revenue Forecast and Analysis

6.3 Market Positioning – Five Key Players

7. Europe SiP Technology Market Analysis – by Packaging Technology

7.1 Overview

7.2 Europe SiP Technology Market Breakdown, by packaging technology, 2019 & 2027

7.3 2D IC

7.3.1 Overview

7.3.2 2D IC Market Forecast and Analysis

7.4 2.5D IC

7.4.1 Overview

7.4.2 2.5D IC Market Forecast and Analysis

7.5 3D IC

7.5.1 Overview

7.5.2 3D IC Market Forecast and Analysis

8. Europe SiP Technology Market Analysis – Packaging Type

8.1 Overview

8.2 Europe SiP Technology Market Breakdown, By Packaging Type, 2019 &2027

8.3 Flip-Chip/Wire-Bond SiP Market

8.3.1 Overview

8.3.2 Flip-Chip/Wire-Bond SiP Market Forecast and Analysis

8.4 Fan-Out SiP Market

8.4.1 Overview

8.4.2 Fan-Out SiP Market Forecast and Analysis

8.5 Embedded SiP Market

8.5.1 Overview

8.5.2 Embedded SiP Market Forecast and Analysis

9. Europe SiP Technology Market Analysis – By Interconnection Technique

9.1 Overview

9.2 Europe SiP technology Market Breakdown, By Interconnection Technique, 2019 &2027

9.3 Small Outline

9.3.1 Overview

9.3.2 Small Outline Market Forecast and Analysis

9.4 Flat Packages

9.4.1 Overview

9.4.2 Flat Packages Market Forecast and Analysis

9.5 Pin Grid Arrays

9.5.1 Overview

9.5.2 Pin Grid Arrays Market Forecast and Analysis

9.6 Surface Mount

9.6.1 Overview

9.6.2 Surface Mount Market Forecast and Analysis

9.7 Others

9.7.1 Overview

9.7.2 Others Market Forecast and Analysis

10. Europe SiP Technology Market Analysis – By End-User Industry

10.1 Overview

10.2 Europe SiP technology Market Breakdown, By END-USER INDUSTRY, 2019 &2027

10.3 Automotive

10.3.1 Overview

10.3.2 Automotive Market Forecast and Analysis

10.4 Aerospace & Defense

10.4.1 Overview

10.4.2 Aerospace and Defense Market Forecast and Analysis

10.5 Consumer Electronics

10.5.1 Overview

10.5.2 Consumer Electronics

10.6 Telecommunications

10.6.1 Overview

10.6.2 Telecommunication Market Forecast and Analysis

10.7 Others

10.7.1 Overview

10.7.2 Others Market Forecast and Analysis

11. Europe SiP Technology Market – Country Analysis

11.1 Overview

11.1.1 Europe: SiP technology Market, By Country

11.1.2 France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

11.1.2.1 France System in Package (SiP) Technology Market, by Packaging Technology

11.1.2.2 France System in Package (SiP) Technology Market, by Packaging Type

11.1.2.3 France System in Package (SiP) Technology Market, by Interconnection Technology

11.1.2.4 France System in Package (SiP) Technology Market, by End-user Industry

11.1.3 Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)

11.1.3.1 Germany System in Package (SiP) Technology Market, by Packaging Technology

11.1.3.2 Germany System in Package (SiP) Technology Market, by Packaging

11.1.3.3 Germany System in Package (SiP) Technology Market, by Interconnection Technology

11.1.3.4 Germany System in Package (SiP) Technology Market, by End-user Industry

11.1.4 Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

11.1.4.1 Italy System in Package (SiP) Technology Market, by Packaging Technology

11.1.4.2 Italy System in Package (SiP) Technology Market, by Packaging Type

11.1.4.3 Italy System in Package (SiP) Technology Market, by Interconnection

11.1.4.4 Italy System in Package (SiP) Technology Market, by End-user Industry

11.1.5 United Kingdom: SiP technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.5.1 United Kingdom System in Package (SiP) Technology Market, by Packaging Technology

11.1.5.2 United Kingdom System in Package (SiP) Technology Market, by Packaging Type

11.1.5.3 United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology

11.1.5.4 United Kingdom System in Package (SiP) Technology Market, by End-User Industry

11.1.6 Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.6.1 Russia System in Package (SiP) Technology Market, by Packaging Technology

11.1.6.2 Russia System in Package (SiP) Technology Market, by Packaging Type

11.1.6.3 Russia System in Package (SiP) Technology Market, by Interconnection Technology

11.1.6.4 Russia System in Package (SiP) Technology Market, by End-User

11.1.7 Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.7.1 Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology

11.1.7.2 Rest of Europe System in Package (SiP) Technology Market, by Packaging Type

11.1.7.3 Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology

11.1.7.4 Rest of Europe System in Package (SiP) Technology Market, by End-user Industry

12. Europe SiP Technology Market - COVID-19 Impact Analysis

12.1 Europe: Impact Assessment of COVID-19 Pandemic

13. Industry Landscape

13.1 Overview

13.2 Market Initiative

14. Company Profiles

14.1 Amkor Technology, Inc.

14.1.1 Key Facts

14.1.2 Business Description

14.1.3 Products and Services

14.1.4 Financial Overview

14.1.5 SWOT Analysis

14.1.6 Key Developments

14.2 ASE Technology Holding Co. Ltd

14.2.1 Key Facts

14.2.2 Business Description

14.2.3 Products and Services

14.2.4 Financial Overview

14.2.5 SWOT Analysis

14.2.6 Key Developments

14.3 GS Nanotech

14.3.1 Key Facts

14.3.2 Business Description

14.3.3 Products and Services

14.3.4 Financial Overview

14.3.5 SWOT Analysis

14.3.6 Key Developments

14.4 JCET Group Co., Ltd.

14.4.1 Key Facts

14.4.2 Business Description

14.4.3 Products and Services

14.4.4 SWOT Analysis

14.4.5 Key Developments

14.5 QUALCOMM INCORPORATED

14.5.1 Key Facts

14.5.2 Business Description

14.5.3 Products and Services

14.5.4 Financial Overview

14.5.5 SWOT Analysis

14.5.6 Key Developments

14.6 Samsung

14.6.1 Key Facts

14.6.2 Business Description

14.6.3 Products and Services

14.6.4 Financial Overview

14.6.5 SWOT Analysis

14.6.6 Key Developments

14.7 Renesas Electronics Corporation

14.7.1 Key Facts

14.7.2 Business Description

14.7.3 Products and Services

14.7.4 Financial Overview

14.7.5 SWOT Analysis

14.7.6 Key Developments

14.8 Texas Instruments Incorporated

14.8.1 Key Facts

14.8.2 Business Description

14.8.3 Products and Services

14.8.4 Financial Overview

14.8.5 SWOT Analysis

14.8.6 Key Developments

14.9 Taiwan Semiconductor Manufacturing Company, Limited

14.9.1 Key Facts

14.9.2 Business Description

14.9.3 Products and Services

14.9.4 Financial Overview

14.9.5 SWOT Analysis

14.9.6 Key Developments

15. Appendix

15.1 About The Insight Partners

15.2 Glossary of Terms

LIST OF TABLES

Table 1. Europe System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)

Table 2. France System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 3. France System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 4. France System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 5. France System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 6. Germany System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 7. Germany System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 8. Germany System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 9. Germany System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 10. Italy System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 11. Italy System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 12. Italy System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 13. Italy System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 14. United Kingdom System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 15. United Kingdom System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 16. United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 17. United Kingdom System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)

Table 18. Russia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 19. Russia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 20. Russia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 21. Russia System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)

Table 22. Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 23. Rest of Europe System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 24. Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 25. Rest of Europe System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 26. Glossary of Terms

LIST OF FIGURES

Figure 1. Europe System in Package (SiP) Technology Market Segmentation

Figure 2. Europe System in Package (SiP) Technology Market Segmentation – By Country

Figure 3. Europe System in Package (SiP) Technology Market Overview

Figure 4. Germany Held the Largest Share in Europe System in Package (SiP) Technology Market in 2019

Figure 5. Europe System in Package (SiP) Technology Market, By Packaging Technology

Figure 6. Europe System in Package (SiP) Technology Market, By Packaging Type

Figure 7. Europe System in Package (SiP) Technology Market, By Interconnection Technology

Figure 8. Europe System in Package (SiP) Technology Market, By End-User Industry

Figure 9. Europe: PEST Analysis

Figure 10. Europe System in package (SiP) technology Market- Ecosystem Analysis

Figure 11. Europe System in package (SiP) technology Market Impact Analysis of Drivers and Restraints

Figure 12. Europe System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)

Figure 13. Europe SiP technology Market Breakdown, by packaging technology, 2019 & 2027 (%)

Figure 14. Europe 2D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 15. Europe 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 16. Europe 3D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 17. Europe SiP Technology Market Breakdown, By Packaging Type, 2019 & 2027 (%)

Figure 18. Europe Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)

Figure 19. Europe Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 20. Europe Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 21. Europe SiP Technology Market Breakdown, By Interconnection Technique, 2019 &2027 (%)

Figure 22. Europe Small Outline Market Revenue and Forecast to 2027 (US$ Mn)

Figure 23. Europe Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)

Figure 24. Europe Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)

Figure 25. Europe Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)

Figure 26. Europe Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 27. Europe SiP Technology Market Breakdown, By END-USER INDUSTRY, 2019 &2027 (%)

Figure 28. Europe Automotive Market Revenue and Forecast to 2027 (US$ Mn)

Figure 29. Europe Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)

Figure 30. Europe Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)

Figure 31. Europe Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)

Figure 32. Europe Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 33. Europe SiP Technology Market Revenue Share, By Country (2019 and 2027)

Figure 34. France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

Figure 35. Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)

Figure 36. Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

Figure 37. United Kingdom SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 38. Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 39. Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 40. Impact of COVID-19 Pandemic in Europe Country Markets

Some of the leading companies are:

  1. Amkor Technology, Inc.
  2. ASE Technology Holding Co., Ltd.
  3. GS Nanotech
  4. JCET Group Co., Ltd.
  5. Qualcomm Technologies, Inc.
  6. Renesas Electronics Corporation
  7. Samsung
  8. Taiwan Semiconductor Manufacturing Company, Limited
  9. Texas Instruments Incorporated

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • 3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • 3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • 3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • 3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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