System in Package Technology Market 2027 by Types, Application, Technology, Opportunities, End Users and Regions | The Insight Partners

System in Package (SiP) Technology Market to 2027 - Global Analysis and Forecasts by Packaging Technology (2D, 2.5D, 3D); Packaging Type (Flip-Chip, Wire-Bond); Interconnection Technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, Others); End-use Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, Others) and Geography

Report Code: TIPRE00005443 | No. of Pages: 150 | Category: Electronics and Semiconductor | Status: Upcoming
MARKET INTRODUCTION
A system in package or SiP is an electronic system which resembles a single integrated circuit and yet incorporates many different integrated circuits in a single package. This technology can integrate an entire electronic subsystem or complete system into a single chip carrier package. SiP technology helps in shortening the design time and significantly reduces the number of components required in a design. Besides, it ensures the performance of all the functions of the system. SiP technology is widely applied in many compact devices such as smartphones, digital music systems, and other electronic systems.

MARKET DYNAMICS
The system in package technology market is anticipated to grow in the forecast period owing to driving factors such as increasing adoption of the SiP technology in processors for graphic cards and real-world gaming. Moreover, demand for durable, compact, and high-speed electronic products in consumer electronics, automotive, and telecommunication further contribute towards the growth of the system in package technology market. However, less customization and high cost hinder the growth of the system in package technology market. Nonetheless, high-frequency gadgets open significant opportunities for the players operating in the system in package technology market during the forecast period.

MARKET SCOPE
The "Global System In Package (SiP) Technology Market Analysis to 2027" is a specialized and in-depth study of the electronics and semiconductor industry with a special focus on the global market trend analysis. The report aims to provide an overview of system in package technology market with detailed market segmentation by packaging technology, packaging type, interconnection technique, end-use industry, and geography. The global system in package technology market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading system in package technology market players and offers key trends and opportunities in the market.

MARKET SEGMENTATION
The global system in package technology market is segmented on the basis of packaging technology, packaging type, interconnection technique, and end-use industry. Based on packaging technology, the market is segmented as 2D, 2.5D, and 3D. By packaging type, the market is segmented as small outline, flat packages, pin grid arrays, surface mount, and others. On the basis of the interconnection technique, the market is segmented as flip-chip and wire-bond. The market on the basis of the end-use industry is classified as automotive, aerospace & defense, consumer electronics, telecommunication, and others.
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global system in package technology market based on various segments. It also provides market size and forecast estimates from the year 2017 to 2027 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South & Central America. The system in package technology market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.

The report analyzes factors affecting system in package technology market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period, i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South & Central America after evaluating political, economic, social and technological factors affecting the system in package technology market in these regions.

MARKET PLAYERS
The reports cover key developments in the system in package technology market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved the way for the expansion of business and customer base of market players. The market payers from system in package technology market are anticipated to lucrative growth opportunities in the future with the rising demand for system in package technology in the global market. Below mentioned is the list of few companies engaged in the system in package technology market.

The report also includes the profiles of key system in package technology companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of the last three years, key developments in the past five years.
  • Amkor Technology
  • ASE Group
  • ChipMOS TECHNOLOGIES INC.
  • Fujitsu Ltd.
  • GS Nanotech
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • SAMSUNG
  • Toshiba Corporation
The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.

TABLE OF CONTENTS

1.   INTRODUCTION
1.1.   SCOPE OF THE STUDY
1.2.   THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3.   MARKET SEGMENTATION
1.3.1   System In Package (SiP) Technology Market - By Packaging Technology
1.3.2   System In Package (SiP) Technology Market - By Packaging Type
1.3.3   System In Package (SiP) Technology Market - By Interconnection Technique
1.3.4   System In Package (SiP) Technology Market - By End-use Industry
1.3.5   System In Package (SiP) Technology Market - By Region
1.3.5.1   By Country

2.   KEY TAKEAWAYS

3.   RESEARCH METHODOLOGY

4.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET LANDSCAPE
4.1.   OVERVIEW
4.2.   PEST ANALYSIS
4.2.1   North America - Pest Analysis
4.2.2   Europe - Pest Analysis
4.2.3   Asia-Pacific - Pest Analysis
4.2.4   Middle East and Africa - Pest Analysis
4.2.5   South and Central America - Pest Analysis
4.3.   ECOSYSTEM ANALYSIS
4.4.   EXPERT OPINIONS

5.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET - KEY MARKET DYNAMICS
5.1.   KEY MARKET DRIVERS
5.2.   KEY MARKET RESTRAINTS
5.3.   KEY MARKET OPPORTUNITIES
5.4.   FUTURE TRENDS
5.5.   IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS

6.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET - GLOBAL MARKET ANALYSIS
6.1.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY - GLOBAL MARKET OVERVIEW
6.2.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY - GLOBAL MARKET AND FORECAST TO 2027
6.3.   MARKET POSITIONING/MARKET SHARE

7.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET - REVENUE AND FORECASTS TO 2027 - PACKAGING TECHNOLOGY
7.1.   OVERVIEW
7.2.   PACKAGING TECHNOLOGY MARKET FORECASTS AND ANALYSIS
7.3.   2D
7.3.1.   Overview
7.3.2.   2D Market Forecast and Analysis
7.4.   2.5D
7.4.1.   Overview
7.4.2.   2.5D Market Forecast and Analysis
7.5.   3D
7.5.1.   Overview
7.5.2.   3D Market Forecast and Analysis
8.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET - REVENUE AND FORECASTS TO 2027 - PACKAGING TYPE
8.1.   OVERVIEW
8.2.   PACKAGING TYPE MARKET FORECASTS AND ANALYSIS
8.3.   FLIP-CHIP
8.3.1.   Overview
8.3.2.   Flip-Chip Market Forecast and Analysis
8.4.   WIRE-BOND
8.4.1.   Overview
8.4.2.   Wire-Bond Market Forecast and Analysis
9.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET - REVENUE AND FORECASTS TO 2027 - INTERCONNECTION TECHNIQUE
9.1.   OVERVIEW
9.2.   INTERCONNECTION TECHNIQUE MARKET FORECASTS AND ANALYSIS
9.3.   SMALL OUTLINE
9.3.1.   Overview
9.3.2.   Small Outline Market Forecast and Analysis
9.4.   FLAT PACKAGES
9.4.1.   Overview
9.4.2.   Flat Packages Market Forecast and Analysis
9.5.   PIN GRID ARRAYS
9.5.1.   Overview
9.5.2.   Pin Grid Arrays Market Forecast and Analysis
9.6.   SURFACE MOUNT
9.6.1.   Overview
9.6.2.   Surface Mount Market Forecast and Analysis
9.7.   OTHERS
9.7.1.   Overview
9.7.2.   Others Market Forecast and Analysis
10.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET - REVENUE AND FORECASTS TO 2027 - END-USE INDUSTRY
10.1.   OVERVIEW
10.2.   END-USE INDUSTRY MARKET FORECASTS AND ANALYSIS
10.3.   AUTOMOTIVE
10.3.1.   Overview
10.3.2.   Automotive Market Forecast and Analysis
10.4.   AEROSPACE AND DEFENSE
10.4.1.   Overview
10.4.2.   Aerospace and Defense Market Forecast and Analysis
10.5.   CONSUMER ELECTRONICS
10.5.1.   Overview
10.5.2.   Consumer Electronics Market Forecast and Analysis
10.6.   TELECOMMUNICATION
10.6.1.   Overview
10.6.2.   Telecommunication Market Forecast and Analysis
10.7.   OTHERS
10.7.1.   Overview
10.7.2.   Others Market Forecast and Analysis

11.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET REVENUE AND FORECASTS TO 2027 - GEOGRAPHICAL ANALYSIS
11.1.   NORTH AMERICA
11.1.1   North America System In Package (SiP) Technology Market Overview
11.1.2   North America System In Package (SiP) Technology Market Forecasts and Analysis
11.1.3   North America System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Technology
11.1.4   North America System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Type
11.1.5   North America System In Package (SiP) Technology Market Forecasts and Analysis - By Interconnection Technique
11.1.6   North America System In Package (SiP) Technology Market Forecasts and Analysis - By End-use Industry
11.1.7   North America System In Package (SiP) Technology Market Forecasts and Analysis - By Countries
11.1.7.1   United States System In Package (SiP) Technology Market
11.1.7.1.1   United States System In Package (SiP) Technology Market by Packaging Technology
11.1.7.1.2   United States System In Package (SiP) Technology Market by Packaging Type
11.1.7.1.3   United States System In Package (SiP) Technology Market by Interconnection Technique
11.1.7.1.4   United States System In Package (SiP) Technology Market by End-use Industry
11.1.7.2   Canada System In Package (SiP) Technology Market
11.1.7.2.1   Canada System In Package (SiP) Technology Market by Packaging Technology
11.1.7.2.2   Canada System In Package (SiP) Technology Market by Packaging Type
11.1.7.2.3   Canada System In Package (SiP) Technology Market by Interconnection Technique
11.1.7.2.4   Canada System In Package (SiP) Technology Market by End-use Industry
11.1.7.3   Mexico System In Package (SiP) Technology Market
11.1.7.3.1   Mexico System In Package (SiP) Technology Market by Packaging Technology
11.1.7.3.2   Mexico System In Package (SiP) Technology Market by Packaging Type
11.1.7.3.3   Mexico System In Package (SiP) Technology Market by Interconnection Technique
11.1.7.3.4   Mexico System In Package (SiP) Technology Market by End-use Industry
11.2.   EUROPE
11.2.1   Europe System In Package (SiP) Technology Market Overview
11.2.2   Europe System In Package (SiP) Technology Market Forecasts and Analysis
11.2.3   Europe System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Technology
11.2.4   Europe System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Type
11.2.5   Europe System In Package (SiP) Technology Market Forecasts and Analysis - By Interconnection Technique
11.2.6   Europe System In Package (SiP) Technology Market Forecasts and Analysis - By End-use Industry
11.2.7   Europe System In Package (SiP) Technology Market Forecasts and Analysis - By Countries
11.2.7.1   Germany System In Package (SiP) Technology Market
11.2.7.1.1   Germany System In Package (SiP) Technology Market by Packaging Technology
11.2.7.1.2   Germany System In Package (SiP) Technology Market by Packaging Type
11.2.7.1.3   Germany System In Package (SiP) Technology Market by Interconnection Technique
11.2.7.1.4   Germany System In Package (SiP) Technology Market by End-use Industry
11.2.7.2   France System In Package (SiP) Technology Market
11.2.7.2.1   France System In Package (SiP) Technology Market by Packaging Technology
11.2.7.2.2   France System In Package (SiP) Technology Market by Packaging Type
11.2.7.2.3   France System In Package (SiP) Technology Market by Interconnection Technique
11.2.7.2.4   France System In Package (SiP) Technology Market by End-use Industry
11.2.7.3   Italy System In Package (SiP) Technology Market
11.2.7.3.1   Italy System In Package (SiP) Technology Market by Packaging Technology
11.2.7.3.2   Italy System In Package (SiP) Technology Market by Packaging Type
11.2.7.3.3   Italy System In Package (SiP) Technology Market by Interconnection Technique
11.2.7.3.4   Italy System In Package (SiP) Technology Market by End-use Industry
11.2.7.4   United Kingdom System In Package (SiP) Technology Market
11.2.7.4.1   United Kingdom System In Package (SiP) Technology Market by Packaging Technology
11.2.7.4.2   United Kingdom System In Package (SiP) Technology Market by Packaging Type
11.2.7.4.3   United Kingdom System In Package (SiP) Technology Market by Interconnection Technique
11.2.7.4.4   United Kingdom System In Package (SiP) Technology Market by End-use Industry
11.2.7.5   Russia System In Package (SiP) Technology Market
11.2.7.5.1   Russia System In Package (SiP) Technology Market by Packaging Technology
11.2.7.5.2   Russia System In Package (SiP) Technology Market by Packaging Type
11.2.7.5.3   Russia System In Package (SiP) Technology Market by Interconnection Technique
11.2.7.5.4   Russia System In Package (SiP) Technology Market by End-use Industry
11.2.7.6   Rest of Europe System In Package (SiP) Technology Market
11.2.7.6.1   Rest of Europe System In Package (SiP) Technology Market by Packaging Technology
11.2.7.6.2   Rest of Europe System In Package (SiP) Technology Market by Packaging Type
11.2.7.6.3   Rest of Europe System In Package (SiP) Technology Market by Interconnection Technique
11.2.7.6.4   Rest of Europe System In Package (SiP) Technology Market by End-use Industry
11.3.   ASIA-PACIFIC
11.3.1   Asia-Pacific System In Package (SiP) Technology Market Overview
11.3.2   Asia-Pacific System In Package (SiP) Technology Market Forecasts and Analysis
11.3.3   Asia-Pacific System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Technology
11.3.4   Asia-Pacific System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Type
11.3.5   Asia-Pacific System In Package (SiP) Technology Market Forecasts and Analysis - By Interconnection Technique
11.3.6   Asia-Pacific System In Package (SiP) Technology Market Forecasts and Analysis - By End-use Industry
11.3.7   Asia-Pacific System In Package (SiP) Technology Market Forecasts and Analysis - By Countries
11.3.7.1   Australia System In Package (SiP) Technology Market
11.3.7.1.1   Australia System In Package (SiP) Technology Market by Packaging Technology
11.3.7.1.2   Australia System In Package (SiP) Technology Market by Packaging Type
11.3.7.1.3   Australia System In Package (SiP) Technology Market by Interconnection Technique
11.3.7.1.4   Australia System In Package (SiP) Technology Market by End-use Industry
11.3.7.2   China System In Package (SiP) Technology Market
11.3.7.2.1   China System In Package (SiP) Technology Market by Packaging Technology
11.3.7.2.2   China System In Package (SiP) Technology Market by Packaging Type
11.3.7.2.3   China System In Package (SiP) Technology Market by Interconnection Technique
11.3.7.2.4   China System In Package (SiP) Technology Market by End-use Industry
11.3.7.3   India System In Package (SiP) Technology Market
11.3.7.3.1   India System In Package (SiP) Technology Market by Packaging Technology
11.3.7.3.2   India System In Package (SiP) Technology Market by Packaging Type
11.3.7.3.3   India System In Package (SiP) Technology Market by Interconnection Technique
11.3.7.3.4   India System In Package (SiP) Technology Market by End-use Industry
11.3.7.4   Japan System In Package (SiP) Technology Market
11.3.7.4.1   Japan System In Package (SiP) Technology Market by Packaging Technology
11.3.7.4.2   Japan System In Package (SiP) Technology Market by Packaging Type
11.3.7.4.3   Japan System In Package (SiP) Technology Market by Interconnection Technique
11.3.7.4.4   Japan System In Package (SiP) Technology Market by End-use Industry
11.3.7.5   South Korea System In Package (SiP) Technology Market
11.3.7.5.1   South Korea System In Package (SiP) Technology Market by Packaging Technology
11.3.7.5.2   South Korea System In Package (SiP) Technology Market by Packaging Type
11.3.7.5.3   South Korea System In Package (SiP) Technology Market by Interconnection Technique
11.3.7.5.4   South Korea System In Package (SiP) Technology Market by End-use Industry
11.3.7.6   Rest of Asia-Pacific System In Package (SiP) Technology Market
11.3.7.6.1   Rest of Asia-Pacific System In Package (SiP) Technology Market by Packaging Technology
11.3.7.6.2   Rest of Asia-Pacific System In Package (SiP) Technology Market by Packaging Type
11.3.7.6.3   Rest of Asia-Pacific System In Package (SiP) Technology Market by Interconnection Technique
11.3.7.6.4   Rest of Asia-Pacific System In Package (SiP) Technology Market by End-use Industry
11.4.   MIDDLE EAST AND AFRICA
11.4.1   Middle East and Africa System In Package (SiP) Technology Market Overview
11.4.2   Middle East and Africa System In Package (SiP) Technology Market Forecasts and Analysis
11.4.3   Middle East and Africa System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Technology
11.4.4   Middle East and Africa System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Type
11.4.5   Middle East and Africa System In Package (SiP) Technology Market Forecasts and Analysis - By Interconnection Technique
11.4.6   Middle East and Africa System In Package (SiP) Technology Market Forecasts and Analysis - By End-use Industry
11.4.7   Middle East and Africa System In Package (SiP) Technology Market Forecasts and Analysis - By Countries
11.4.7.1   South Africa System In Package (SiP) Technology Market
11.4.7.1.1   South Africa System In Package (SiP) Technology Market by Packaging Technology
11.4.7.1.2   South Africa System In Package (SiP) Technology Market by Packaging Type
11.4.7.1.3   South Africa System In Package (SiP) Technology Market by Interconnection Technique
11.4.7.1.4   South Africa System In Package (SiP) Technology Market by End-use Industry
11.4.7.2   Saudi Arabia System In Package (SiP) Technology Market
11.4.7.2.1   Saudi Arabia System In Package (SiP) Technology Market by Packaging Technology
11.4.7.2.2   Saudi Arabia System In Package (SiP) Technology Market by Packaging Type
11.4.7.2.3   Saudi Arabia System In Package (SiP) Technology Market by Interconnection Technique
11.4.7.2.4   Saudi Arabia System In Package (SiP) Technology Market by End-use Industry
11.4.7.3   U.A.E System In Package (SiP) Technology Market
11.4.7.3.1   U.A.E System In Package (SiP) Technology Market by Packaging Technology
11.4.7.3.2   U.A.E System In Package (SiP) Technology Market by Packaging Type
11.4.7.3.3   U.A.E System In Package (SiP) Technology Market by Interconnection Technique
11.4.7.3.4   U.A.E System In Package (SiP) Technology Market by End-use Industry
11.4.7.4   Rest of Middle East and Africa System In Package (SiP) Technology Market
11.4.7.4.1   Rest of Middle East and Africa System In Package (SiP) Technology Market by Packaging Technology
11.4.7.4.2   Rest of Middle East and Africa System In Package (SiP) Technology Market by Packaging Type
11.4.7.4.3   Rest of Middle East and Africa System In Package (SiP) Technology Market by Interconnection Technique
11.4.7.4.4   Rest of Middle East and Africa System In Package (SiP) Technology Market by End-use Industry
11.5.   SOUTH AND CENTRAL AMERICA
11.5.1   South and Central America System In Package (SiP) Technology Market Overview
11.5.2   South and Central America System In Package (SiP) Technology Market Forecasts and Analysis
11.5.3   South and Central America System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Technology
11.5.4   South and Central America System In Package (SiP) Technology Market Forecasts and Analysis - By Packaging Type
11.5.5   South and Central America System In Package (SiP) Technology Market Forecasts and Analysis - By Interconnection Technique
11.5.6   South and Central America System In Package (SiP) Technology Market Forecasts and Analysis - By End-use Industry
11.5.7   South and Central America System In Package (SiP) Technology Market Forecasts and Analysis - By Countries
11.5.7.1   Brazil System In Package (SiP) Technology Market
11.5.7.1.1   Brazil System In Package (SiP) Technology Market by Packaging Technology
11.5.7.1.2   Brazil System In Package (SiP) Technology Market by Packaging Type
11.5.7.1.3   Brazil System In Package (SiP) Technology Market by Interconnection Technique
11.5.7.1.4   Brazil System In Package (SiP) Technology Market by End-use Industry
11.5.7.2   Argentina System In Package (SiP) Technology Market
11.5.7.2.1   Argentina System In Package (SiP) Technology Market by Packaging Technology
11.5.7.2.2   Argentina System In Package (SiP) Technology Market by Packaging Type
11.5.7.2.3   Argentina System In Package (SiP) Technology Market by Interconnection Technique
11.5.7.2.4   Argentina System In Package (SiP) Technology Market by End-use Industry
11.5.7.3   Rest of South and Central America System In Package (SiP) Technology Market
11.5.7.3.1   Rest of South and Central America System In Package (SiP) Technology Market by Packaging Technology
11.5.7.3.2   Rest of South and Central America System In Package (SiP) Technology Market by Packaging Type
11.5.7.3.3   Rest of South and Central America System In Package (SiP) Technology Market by Interconnection Technique
11.5.7.3.4   Rest of South and Central America System In Package (SiP) Technology Market by End-use Industry

12.   INDUSTRY LANDSCAPE
12.1.   MERGERS AND ACQUISITIONS
12.2.   AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
12.3.   NEW PRODUCT LAUNCHES
12.4.   EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS

13.   SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, KEY COMPANY PROFILES
13.1.   AMKOR TECHNOLOGY
13.1.1.   Key Facts
13.1.2.   Business Description
13.1.3.   Products and Services
13.1.4.   Financial Overview
13.1.5.   SWOT Analysis
13.1.6.   Key Developments
13.2.   ASE GROUP
13.2.1.   Key Facts
13.2.2.   Business Description
13.2.3.   Products and Services
13.2.4.   Financial Overview
13.2.5.   SWOT Analysis
13.2.6.   Key Developments
13.3.   CHIPMOS TECHNOLOGIES INC.
13.3.1.   Key Facts
13.3.2.   Business Description
13.3.3.   Products and Services
13.3.4.   Financial Overview
13.3.5.   SWOT Analysis
13.3.6.   Key Developments
13.4.   FUJITSU LTD.
13.4.1.   Key Facts
13.4.2.   Business Description
13.4.3.   Products and Services
13.4.4.   Financial Overview
13.4.5.   SWOT Analysis
13.4.6.   Key Developments
13.5.   GS NANOTECH
13.5.1.   Key Facts
13.5.2.   Business Description
13.5.3.   Products and Services
13.5.4.   Financial Overview
13.5.5.   SWOT Analysis
13.5.6.   Key Developments
13.6.   JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
13.6.1.   Key Facts
13.6.2.   Business Description
13.6.3.   Products and Services
13.6.4.   Financial Overview
13.6.5.   SWOT Analysis
13.6.6.   Key Developments
13.7.   QUALCOMM TECHNOLOGIES, INC.
13.7.1.   Key Facts
13.7.2.   Business Description
13.7.3.   Products and Services
13.7.4.   Financial Overview
13.7.5.   SWOT Analysis
13.7.6.   Key Developments
13.8.   RENESAS ELECTRONICS CORPORATION
13.8.1.   Key Facts
13.8.2.   Business Description
13.8.3.   Products and Services
13.8.4.   Financial Overview
13.8.5.   SWOT Analysis
13.8.6.   Key Developments
13.9.   SAMSUNG
13.9.1.   Key Facts
13.9.2.   Business Description
13.9.3.   Products and Services
13.9.4.   Financial Overview
13.9.5.   SWOT Analysis
13.9.6.   Key Developments
13.10.   TOSHIBA CORPORATION
13.10.1.   Key Facts
13.10.2.   Business Description
13.10.3.   Products and Services
13.10.4.   Financial Overview
13.10.5.   SWOT Analysis
13.10.6.   Key Developments

14.   APPENDIX
14.1.   ABOUT THE INSIGHT PARTNERS
14.2.   GLOSSARY OF TERMS
The List of Companies

1.Amkor Technology
2.ASE Group
3.ChipMOS TECHNOLOGIES INC.
4.Fujitsu Ltd.
5.GS Nanotech
6.Jiangsu Changjiang Electronics Technology Co., Ltd
7.Qualcomm Technologies, Inc.
8.Renesas Electronics Corporation
9.SAMSUNG
10.Toshiba Corporation