The System in Package (SiP) Technology Market size is projected to reach US$ 35.20 billion by 2031 from US$ 15.36 billion in 2023. The market is expected to register a CAGR of 10.9% in 2023–2031. The growing demand for miniaturization of electronics is likely to remain a key System in Package (SiP) technology market trends.

System in Package (SiP) Technology Market Analysis

It is projected that the introduction of 5G network-connected devices, the increased demand for small electronics devices with Internet connectivity, and the proliferation of Internet of Things (IoT) devices will propel the growth of the global system-in-package (SiP) technology business. Furthermore, the industry is developing due to the increasing use of smartphones and smart wearables. Higher levels of integration, however, might cause thermal problems, which is a significant market constraint. Conversely, strong demand from the Asia-Pacific region is anticipated to support market expansion throughout the projected timeframe.

System in Package (SiP) Technology Market Overview

The packaging technique known as "system in package" (SiP) integrates a number of passive and electrical subcomponents on one substrate. One of system in package (SiP) technology's main advantages is that it allows IC packages with many dies to be combined with active systems or subsystems inside the IC package. The market expansion for system in package (SiP) technology is expected to be bolstered by the growing adoption of SiP products in developing nations, particularly in the automotive segment. The market is increasing more quickly due to factors like the growing need for circuit miniaturization in microelectronic devices. Additionally, the newest trend in packaging design is the system.

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System in Package (SiP) Technology Market: Strategic Insights

System in Package (SiP) Technology Market

• 
  CAGR (2023 - 2031)

  10.9%
• Market Size 2023
  US$ 15.36 billion
• Market Size 2031
  US$ 35.20 billion

Market Dynamics

GROWTH DRIVERS

• The growing automotive industry

FUTURE TRENDS

• The growing demand for the miniaturization of electronics

OPPORTUNITIES

• The potential use of RF components in developing advanced 5g infrastructure

Key Players

• ASE Group
• Amkor Technology, Inc
• ChipMOS TECHNOLOGIES INC.
• Fujitsu Ltd.
• GS Nanotech
• JCET Group Co., Ltd.
• Qualcomm Technologies, Inc.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• Texas Instruments Incorporated

Regional Overview

• North America
• Europe
• Asia-Pacific
• South and Central America
• Middle East and Africa

Market Segmentation

Packaging Technology

• 2D IC
• 2.5D IC
• 3D IC

Packaging Type

• Flip-Chip/Wire-Bond SiP
• Fan-Out SiP
• Embedded SiP

Interconnection technique

• Small Outline
• Flat Packages
• Pin Grid Arrays
• Surface Mount
• Others

End-User Industry

• Automotive
• Aerospace and Defense
• Consumer Electronics
• Telecommunication
• Others

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System in Package (SiP) Technology Market Drivers and Opportunities

The Growing Automotive Industry

The automotive sector, especially electric vehicles will experience growth in the forecast period due to the growing sensitivity of fossil fuel and increasing government measures towards a cleaner environment. For instance, in the automotive sector, giants like General Motors plan to release autonomous (driverless car) cars in 2021, while AUDI collaborated with Nvidia to develop a capability for non-human supervised car models. The prototype of this highly automated car is based on AUDI’s Q7 car model. SIP technology is used in smart and electric vehicles in its electric components such as power modules (ADI µModules), sensors (MEMS), transmission control units, vehicle central infotainment units, single-chip modules, etc. Thus, the growing automotive industry is propelling the System in Package (SiP) technology market growth.

Potential Use Of RF Components In Developing Advanced 5G Infrastructure

Over the next five years, there will be significant congestion on wireless networks due to the availability of equipment that supports high bandwidth. This would accelerate the transition to 5G from the current 3G and 4G LTE technology. It is anticipated that the 5G technology will enable aggregate data rates that are substantially quicker than the current 4G and 3G data rates, respectively.

A number of significant nations, including the US, Japan, South Korea, the UK, Germany, and China, are anticipated to implement 5G technology by 2021. It is anticipated that this would result in a large rise in the number of mobile subscribers, necessitating the development of infrastructure capable of processing user demands for data. Consequently, there would be a rise in SiP-based RF components needed in order to deliver more data. Thus, the potential use of RF components in developing advanced 5G infrastructure is anticipated to present new opportunities for the System in Package (SiP) technology market players during the forecast period.

System in Package (SiP) Technology Market Report Segmentation Analysis

Key segments that contributed to the derivation of the System in Package (SiP) technology market analysis are packaging technology, packaging type, interconnection technique, and end-use industry.

• Based on packaging technology, the System in Package (SiP) technology market is segmented into 2D IC, 2.5D IC, and 3D IC.
• By packaging type, the market is segmented into flip-chip, wire-bond, and fan-out wafer-level packaging.
• By interconnection technique, the market is segmented into small outlines, flat packages, pin grid arrays, surface mount, and others.
• Based on the end-use industry, the system-in-package (SiP) technology market is bifurcated into automotive, aerospace and defense, consumer electronics, telecommunication, and others.

System in Package (SiP) Technology Market Share Analysis by Geography

The geographic scope of the System in Package (SiP) technology market report is mainly divided into five regions: North America, Asia Pacific, Europe, Middle East & Africa, and South America/South & Central America. In terms of revenue, APAC accounted for the largest System in Package (SiP) technology market share. This is attributed to the surge in demand from emerging economic countries such as China, India, and South Korea. 

System in Package (SiP) Technology Market Report Scope

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System in Package (SiP) Technology Market News and Recent Developments

The system-in-package (SiP) technology market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. The following is a list of developments in the market for speech and language disorders and strategies:

• In March 2023, the OSD62x series of system-in-a-chip (Sip) products, which Octavo Systems introduced, aids in enhancing the performance of edge and small form factor embedded processing for use in next-generation applications. The processors Texas Instruments (Tl) AM623 and AM625 serve as the foundation for the OSD62x family.

(Source: Octavo Systems, Press Release)

System in Package (SiP) Technology Market Report Coverage and Deliverables

The “System in Package (SiP) Technology Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:

• Market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
• Market dynamics such as drivers, restraints, and key opportunities
• Key future trends
• Detailed PEST/Porter’s Five Forces and SWOT analysis
• Global and regional market analysis covering key market trends, major players, regulations, and recent market developments
• Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments
• Detailed company profiles