Electronics and Semiconductor Europe SiP Technology Market Foreca...

Europe SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

Publication Month: Jan 2021 | Report Code: TIPRE00018161 | No. of Pages: 149 | Category: Electronics and Semiconductor | Status: Published
Covid

The SiP technology market in Europe is expected to grow from US$ 2187.5 million in 2019 to US$ 4164.9 million by 2027; it is estimated to grow at a CAGR of 10.8% from 2020 to 2027.

The Germany, France, Italy, UK and Russia are major economies in Europe. 5G networks are developing at fast pace and this is the major factor driving the Europe SiP technology market. System in package technology is acquiring huge potential available in 5G computing and networking market as the technology is getting used for wide range of products such as 5G Computing and networking modems, 5G NR Antenna-in-Package (AiP) and others. Advent of the 5G in developed nations such as UK, Rusia is boosting the internet services and demand for supporting devices. 5G based devices market is enhancing with significant growth rate, which ultimately increasing the demand for system in package technology. According to the Cisco, 5G speed will offer 13 times higher speed than average mobile connection and will help the internet service market. The SiP technology is also getting adopted in the 5G supporting smartphones, high speed RF and wireless devices, and others. Technology offers various benefits for the consumers such as enhanced performance, smaller size and assured reliability with low cost. Market players are offering advanced solution for the customers for improved result and performance. For instance, in Mercury Systems Inc., company introduced new RFS1080 trusted system-in-package (SiP) processing technology for 5G communication application. Hence rising demand for 5G devices are driving as well as creating opportunities for the companies to innovate and develop new devices using system in package technology, which is expected to create a significant demand for SiP technology in the coming years, which would ultimately drive the market in Europe.

 

Europe is adversely affected by the ongoing COVID-19 outbreak. Spain, Italy, Germany, the UK, and France are a few of the worst affected countries in the region. Businesses in Europe are facing severe economic difficulties as they are either suspending their operations or reducing their activities in a substantial manner. The growth of the SiP technology market in Europe was hindered in the first half of 2020 as COVID-19 infected cases were rising with the significant rate. Countries such as Russia, France, Spain, the UK, and others had the major count of COVID-19 cases on daily basis owing to which lockdown was imposed across various countries, which hampered the SiP technology market growth. The semiconductor industry in Europe is resuming at slower growth rate than other regions. The demand from the industrial and automotive electronics has witnessed stronger hit than consumer electronics and communication electronics due to the COVID-19 pandemic. Post lockdown, the market is growing with the support from advanced electronics devices. For instance, Maggy (a Belgium-based company) is using Silicon Labs Bluetooth SiP module to develop new compact wearable for distancing application.

SiP technology market

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Europe SiP Technology Market Segmentation  

 

Europe SiP Technology Market – By Packaging Technology

  • 2D IC
  • 2.5D IC
  • 3D IC

Europe SiP Technology Market – By Packaging Type

  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP

Europe SiP Technology Market – By Interconnection Technique

  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Others

Europe SiP Technology Market – By End-User Industry

  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
  • Others

Europe SiP Technology Market, by Country

  • Germany
  • France
  • Italy
  • UK
  • Russia
  • Rest of Europe

Europe SiP Technology Market - Companies Mentioned

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • GS Nanotech
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated

 

TABLE OF CONTENTS

1.           Introduction

1.1         Scope of the Study

1.2         The Insight Partners Research Report Guidance

1.3         Market Segmentation

1.3.1        Europe System in Package (SiP) Technology Market – By Packaging Technology

1.3.2        Europe System in Package (SiP) Technology Market – By Packaging Type

1.3.3        Europe System in Package (SiP) Technology Market – By Interconnection Technology

1.3.4        Europe System in Package (SiP) Technology Market – By End-User Industry

1.3.5        Europe System in Package (SiP) Technology Market – By Country

2.           Key Takeaways

3.           Research Methodology

3.1         Coverage

3.2         Secondary Research

3.3         Primary Research

4.           Europe SiP Technology – Market Landscape

4.1         Market Overview

4.2         Europe PEST Analysis

4.3         Ecosystem Analysis

5.           Europe SiP Technology –Market Dynamics

5.1         Key Market Drivers

5.1.1        Rapid Rise in Demand for Miniaturization of Electronic Devices

5.1.2        5G Network Developing at Fast Pace

5.2         Key Market Restraints

5.2.1        Availability of Substitutes and Technological Problems

5.3         Key Market Opportunities

5.3.1        Smartphone and PC Market to Become Advanced

5.4         Future Trends

5.4.1        Introduction of Wearable technology and the IoT in Market

5.5         Impact Analysis of Drivers and Restraints

6.           SiP Technology Market – Europe Analysis

6.1         Europe System in Package (SiP) Technology Market Overview

6.2         Europe System in Package (SiP) Technology Market Revenue Forecast and Analysis

6.3         Market Positioning – Five Key Players

7.           Europe SiP Technology Market Analysis – by Packaging Technology

7.1         Overview

7.2         Europe SiP Technology Market Breakdown, by packaging technology, 2019 & 2027

7.3         2D IC

7.3.1        Overview

7.3.2        2D IC Market Forecast and Analysis

7.4         2.5D IC

7.4.1        Overview

7.4.2        2.5D IC Market Forecast and Analysis

7.5         3D IC

7.5.1        Overview

7.5.2        3D IC Market Forecast and Analysis

8.           Europe SiP Technology Market Analysis – Packaging Type

8.1         Overview

8.2         Europe SiP Technology Market Breakdown, By Packaging Type, 2019 &2027

8.3         Flip-Chip/Wire-Bond SiP Market

8.3.1        Overview

8.3.2        Flip-Chip/Wire-Bond SiP Market Forecast and Analysis

8.4         Fan-Out SiP Market

8.4.1        Overview

8.4.2        Fan-Out SiP Market Forecast and Analysis

8.5         Embedded SiP Market

8.5.1        Overview

8.5.2        Embedded SiP Market Forecast and Analysis

9.           Europe SiP Technology Market Analysis – By Interconnection Technique

9.1         Overview

9.2         Europe SiP technology Market Breakdown, By Interconnection Technique, 2019 &2027

9.3         Small Outline

9.3.1        Overview

9.3.2        Small Outline Market Forecast and Analysis

9.4         Flat Packages

9.4.1        Overview

9.4.2        Flat Packages Market Forecast and Analysis

9.5         Pin Grid Arrays

9.5.1        Overview

9.5.2        Pin Grid Arrays Market Forecast and Analysis

9.6         Surface Mount

9.6.1        Overview

9.6.2        Surface Mount Market Forecast and Analysis

9.7         Others

9.7.1        Overview

9.7.2        Others Market Forecast and Analysis

10.        Europe SiP Technology Market Analysis – By End-User Industry

10.1      Overview

10.2      Europe SiP technology Market Breakdown, By END-USER INDUSTRY, 2019 &2027

10.3      Automotive

10.3.1     Overview

10.3.2     Automotive Market Forecast and Analysis

10.4      Aerospace & Defense

10.4.1     Overview

10.4.2     Aerospace and Defense Market Forecast and Analysis

10.5      Consumer Electronics

10.5.1     Overview

10.5.2     Consumer Electronics

10.6      Telecommunications

10.6.1     Overview

10.6.2     Telecommunication Market Forecast and Analysis

10.7      Others

10.7.1     Overview

10.7.2     Others Market Forecast and Analysis

11.        Europe SiP Technology Market – Country Analysis

11.1      Overview

11.1.1     Europe: SiP technology Market, By Country

11.1.2     France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

11.1.2.1       France System in Package (SiP) Technology Market, by Packaging Technology

11.1.2.2       France System in Package (SiP) Technology Market, by Packaging Type

11.1.2.3       France System in Package (SiP) Technology Market, by Interconnection Technology

11.1.2.4       France System in Package (SiP) Technology Market, by End-user Industry

11.1.3     Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)

11.1.3.1       Germany System in Package (SiP) Technology Market, by Packaging Technology

11.1.3.2       Germany System in Package (SiP) Technology Market, by Packaging

11.1.3.3       Germany System in Package (SiP) Technology Market, by Interconnection Technology

11.1.3.4       Germany System in Package (SiP) Technology Market, by End-user Industry

11.1.4     Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

11.1.4.1       Italy System in Package (SiP) Technology Market, by Packaging Technology

11.1.4.2       Italy System in Package (SiP) Technology Market, by Packaging Type

11.1.4.3       Italy System in Package (SiP) Technology Market, by Interconnection

11.1.4.4       Italy System in Package (SiP) Technology Market, by End-user Industry

11.1.5     United Kingdom: SiP technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.5.1       United Kingdom System in Package (SiP) Technology Market, by Packaging Technology

11.1.5.2       United Kingdom System in Package (SiP) Technology Market, by Packaging Type

11.1.5.3       United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology

11.1.5.4       United Kingdom System in Package (SiP) Technology Market, by End-User Industry

11.1.6     Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.6.1       Russia System in Package (SiP) Technology Market, by Packaging Technology

11.1.6.2       Russia System in Package (SiP) Technology Market, by Packaging Type

11.1.6.3       Russia System in Package (SiP) Technology Market, by Interconnection Technology

11.1.6.4       Russia System in Package (SiP) Technology Market, by End-User

11.1.7     Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.7.1       Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology

11.1.7.2       Rest of Europe System in Package (SiP) Technology Market, by Packaging Type

11.1.7.3       Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology

11.1.7.4       Rest of Europe System in Package (SiP) Technology Market, by End-user Industry

12.        Europe SiP Technology Market - COVID-19 Impact Analysis

12.1      Europe: Impact Assessment of COVID-19 Pandemic

13.        Industry Landscape

13.1      Overview

13.2      Market Initiative

14.        Company Profiles

14.1      Amkor Technology, Inc.

14.1.1     Key Facts

14.1.2     Business Description

14.1.3     Products and Services

14.1.4     Financial Overview

14.1.5     SWOT Analysis

14.1.6     Key Developments

14.2      ASE Technology Holding Co. Ltd

14.2.1     Key Facts

14.2.2     Business Description

14.2.3     Products and Services

14.2.4     Financial Overview

14.2.5     SWOT Analysis

14.2.6     Key Developments

14.3      GS Nanotech

14.3.1     Key Facts

14.3.2     Business Description

14.3.3     Products and Services

14.3.4     Financial Overview

14.3.5     SWOT Analysis

14.3.6     Key Developments

14.4      JCET Group Co., Ltd.

14.4.1     Key Facts

14.4.2     Business Description

14.4.3     Products and Services

14.4.4     SWOT Analysis

14.4.5     Key Developments

14.5      QUALCOMM INCORPORATED

14.5.1     Key Facts

14.5.2     Business Description

14.5.3     Products and Services

14.5.4     Financial Overview

14.5.5     SWOT Analysis

14.5.6     Key Developments

14.6      Samsung

14.6.1     Key Facts

14.6.2     Business Description

14.6.3     Products and Services

14.6.4     Financial Overview

14.6.5     SWOT Analysis

14.6.6     Key Developments

14.7      Renesas Electronics Corporation

14.7.1     Key Facts

14.7.2     Business Description

14.7.3     Products and Services

14.7.4     Financial Overview

14.7.5     SWOT Analysis

14.7.6     Key Developments

14.8      Texas Instruments Incorporated

14.8.1     Key Facts

14.8.2     Business Description

14.8.3     Products and Services

14.8.4     Financial Overview

14.8.5     SWOT Analysis

14.8.6     Key Developments

14.9      Taiwan Semiconductor Manufacturing Company, Limited

14.9.1     Key Facts

14.9.2     Business Description

14.9.3     Products and Services

14.9.4     Financial Overview

14.9.5     SWOT Analysis

14.9.6     Key Developments

15.        Appendix

15.1      About The Insight Partners

             15.2      Glossary of Terms

LIST OF TABLES

Table 1.             Europe System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)

Table 2.             France System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 3.             France System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 4.             France System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 5.             France System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 6.             Germany System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 7.             Germany System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 8.             Germany System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 9.             Germany System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 10.          Italy System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 11.          Italy System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 12.          Italy System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 13.          Italy System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 14.          United Kingdom System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 15.          United Kingdom System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 16.          United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 17.          United Kingdom System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)

Table 18.          Russia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 19.          Russia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027  (USD Million)

Table 20.          Russia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 21.          Russia System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)

Table 22.          Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 23.          Rest of Europe System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 24.          Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 25.          Rest of Europe System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 26.            Glossary of Terms

LIST OF FIGURES

Figure 1.           Europe System in Package (SiP) Technology Market Segmentation

Figure 2.           Europe System in Package (SiP) Technology Market Segmentation – By Country

Figure 3.           Europe System in Package (SiP) Technology Market Overview

Figure 4.           Germany Held the Largest Share in Europe System in Package (SiP) Technology Market in 2019

Figure 5.           Europe System in Package (SiP) Technology Market, By Packaging Technology

Figure 6.           Europe System in Package (SiP) Technology Market, By Packaging Type

Figure 7.           Europe System in Package (SiP) Technology Market, By Interconnection Technology

Figure 8.           Europe System in Package (SiP) Technology Market, By End-User Industry

Figure 9.           Europe: PEST Analysis

Figure 10.        Europe System in package (SiP) technology Market- Ecosystem Analysis

Figure 11.        Europe System in package (SiP) technology Market Impact Analysis of Drivers and Restraints

Figure 12.        Europe System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)

Figure 13.        Europe SiP technology Market Breakdown, by packaging technology, 2019 & 2027 (%)

Figure 14.        Europe 2D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 15.        Europe 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 16.        Europe 3D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 17.        Europe SiP Technology Market Breakdown, By Packaging Type, 2019 & 2027 (%)

Figure 18.        Europe Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)

Figure 19.        Europe Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 20.        Europe Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 21.        Europe SiP Technology Market Breakdown, By Interconnection Technique, 2019 &2027 (%)

Figure 22.        Europe Small Outline Market Revenue and Forecast to 2027 (US$ Mn)

Figure 23.        Europe Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)

Figure 24.        Europe Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)

Figure 25.        Europe Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)

Figure 26.        Europe Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 27.        Europe SiP Technology Market Breakdown, By END-USER INDUSTRY, 2019 &2027 (%)

Figure 28.        Europe Automotive Market Revenue and Forecast to 2027 (US$ Mn)

Figure 29.        Europe Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)

Figure 30.        Europe Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)

Figure 31.        Europe Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)

Figure 32.        Europe Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 33.        Europe SiP Technology Market Revenue Share, By Country (2019 and 2027)

Figure 34.        France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

Figure 35.        Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)

Figure 36.        Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

Figure 37.        United Kingdom SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 38.        Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 39.        Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 40.          Impact of COVID-19 Pandemic in Europe Country Markets

Some of the leading companies are:

  1. Amkor Technology, Inc.
  2. ASE Technology Holding Co., Ltd.
  3. GS Nanotech
  4. JCET Group Co., Ltd.
  5. Qualcomm Technologies, Inc.
  6. Renesas Electronics Corporation
  7. Samsung
  8. Taiwan Semiconductor Manufacturing Company, Limited
  9. Texas Instruments Incorporated
  • Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the Europe SiP technology market
  • Highlights key business priorities in order to assist companies to realign their business strategies
  • The key findings and recommendations highlight crucial progressive industry trends in the Europe SiP technology market, thereby allowing players across the value chain to develop effective long-term strategies
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
  • Scrutinize in-depth Europe market trends and outlook coupled with the factors driving the SiP technology market, as well as those hindering it
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution
TIPRE00018161
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