Hermetic Packaging Market to Reach US$ 6.19 Bn at a CAGR of 6.6% in 2027 | The Insight Partners

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Hermetic Packaging Market to 2027 - Global Analysis and Forecasts by Product (Passivation Glass, Transponder Glass, Reed Glass, Glass-to-Metal Sealing, Ceramic-to-Metal Sealing); Application (Transistors, MEMS, Sensors, Lasers, Photo Diodes, Airbag Ignitors, Others); Industry Vertical (Aerospace, Medical, Telecommunications, Consumer Electronics, Military and Defense, Automotive, Others)

Publication Month: Sep 2019 | Report Code: TIPRE00005583 | No. of Pages: 193 | Category: Electronics and Semiconductor | Status: Published

The global hermetic packaging market accounted to US$ 3.51 Bn in 2018 and is expected to grow at a CAGR of 6.6% during the forecast period 2019 – 2027, to account to US$ 6.19 Bn by 2027.

Hermetic packaging market is led by the Asia Pacific region in 2018. Asia Pacific led the global hermetic packaging market with more than 35% share, followed by North America and Europe. APAC is also expected to be the fastest-growing region in the global hermetic packaging market during the forecast period. The fast growth of hermetic packaging market in APAC is attributed to the large presence of electronics manufactures in China, Japan and South Korea. The presence of fast growing countries such as China and India as well as developed countries such as Japan and South Korea, makes Asia pacific one of the most promising market for the growth of hermetic packaging. The economic growth in developing countries of APAC is quite impressive and these countries are expected to offer ample growth opportunities for the hermetic packaging market players during 2019–2027.

Lucrative Regional Hermetic Packaging Markets

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Market Insights

Aerospace and Defense industry is driving the demand for hermetic packaging worldwide

The global aerospace and defense industry is experiencing a strong growth owing to factors such as growing passenger travel demand and increasing military expenditure in countries such as China and the US. With rising geopolitical tensions in various regions, the aerospace and defense industry is expected to continue its growth trajectory during the forecast period of 2019 to 2027. With the growing demand for application-specific customized solutions and high safety and reliability requirements, aerospace and defense industry provides a positive demand outlook for hermetically packaged electronic components. Various companies such as SCHOTT AG and AMETEK, Inc. offers hermetic packages for safeguarding sensitive electronic components used in the aerospace and defense industry. Hence, factors such as increasing commercial and military aircraft production and rising spending on defense/military equipment are anticipated to drive the demand of hermetically protected electronic components in the global aerospace and defense industry.

Rising trend of component miniaturization to fuel the demand for innovative packaging solutions

The trend of increasing miniaturization of electronic components has become a major concern for packaging solution providers worldwide. The constant technology advancements in various industries are pushing manufacturers to implement miniaturization in order to cope up with rising demands of industries such as aerospace, electronics, automotive, and healthcare. Hence, it has become a necessity for hermetic packaging providers to bring solutions which can support such miniaturized electronic components. Thus, this factor is expected to trigger the growth of the hermetic packaging market in the coming years.

Product Insights

The hermetic packaging market on the basis of product is segmented into passivation glass, transponder glass, reed glass, glass-to-metal sealing (GTMS), and ceramic-to-metal sealing (CerTMS). The glass-to-metal sealing product is the leading segments with the highest market share. Further, ceramic-to-metal sealing is anticipated to witness immense growth in the hermetic packaging market during the forecast period.  

Industry Vertical Insights

The hermetic packaging market on the basis of industry vertical is segmented into aerospace, medical, telecommunications, consumer electronics, military & defense, automotive, and others. The aerospace industry vertical is the major adopter of hermetic packaging solutions owing to the increasing demand for critical applications in aircraft and space applications including spacecraft guidance system, and satellites. Further, military & defense is also witnessing immense growth in the demand for hermetic packaging solutions.

Application Insights

The application segment of hermetic packaging market is bifurcated into lasers, photo diodes, airbag ignitors, MEMS, transistors, sensors, and others. The hermetic packaging market by application was led by transistors segment which held maximum market share and is anticipated to dominate the market in the forecast period. The hermetic packaging of transistors helps in increasing the longevity and reliability of these transistors by making them resistant to harsh external environment conditions. The demand of hermetically packaged transistors is driven by applications in extreme environment industries such as military and defense, where these transistors are used in switching power supplies, inverters, and motor controls among many others.

Rest of APAC Hermetic Packaging Market by Application

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Strategic Insights

Report Coverage - Hermetic Packaging Market
Report CoverageDetails
Market Size Value inUS$ 3.51 Billion in 2018
Market Size Value byUS$ 6.19 Billion by 2027
Growth rateCAGR of 6.6% from 2019-2027
Forecast Period2019-2027
Base Year2019
No. of Pages193
No. of Tables83
No. of Charts & Figures89
Historical data availableYes
Segments coveredProduct ; Application ; Industry Vertical
Regional scopeNorth America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country scopeUS, Canada, Mexico, UK, Germany, Spain, Italy, France, India, China, Japan, South Korea, Australia, UAE, Saudi Arabia, South Africa, Brazil, Argentina
Report coverageRevenue forecast, company ranking, competitive landscape, growth factors, and trends
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Market Initiatives was observed as the most adopted strategy in global hermetic packaging market. Few of the recent market initiatives are listed below:

2019:Micross Components added Strategic Sales Inc. (SSI) as a manufacturer rep organization to serve the Philadelphia market. SSI offers technical sales and management for key electronic component and systems companies in the Mid-Atlantic region. Thus, Micross looks forward to expand its market footprint by working closely with the SSI Team to further develop its business in this region.
2018:Schott AG entered an agreement to acquire Primoceler Oy in order to expand its hermetic packaging portfolio with pioneering glass micro bonding technology. Upon finalization of the acquisition, the company is expected to conduct its business activities under the new name SCHOTT Primoceler Oy. Through this acquisition, SCHOTT will utilize Primoceler’s pioneering micro bonding method that utilizes laser technology for manufacturing vacuum-tight, ultra-miniature electronic and optical devices without any heat or added materials.
2017:AMETEK, Inc. has combined its industry-leading electronic components, interconnect and wire, packaging businesses into an expanded division, Electronic Components & Packaging (ECP), that brings together its market-leading Glasseal, Aegis, Hermetic Seal, Coining, SCP and Sealtron brands into a single global business platform. This new division enables the company to provide its expanding customer base with a increasing range of innovative component and hermetic solutions.


Global Hermetic packaging Market - By Product

  • Passivation glass
  • Transponder glass
  • Reed glass
  • Glass-to-Metal Sealing (GTMS)
  • Ceramic-to-Metal Sealing (CerTMS)


Global Hermetic packaging Market - By Application

  • Lasers
  • Photo Diodes
  • Airbag Ignitors
  • MEMS
  • Transistors
  • Sensors
  • Others

Global Hermetic packaging Market - By Industry Vertical

  • Aerospace
  • Medical
  • Telecommunications
  • Consumer Electronics
  • Military and Defense
  • Automotive
  • Others

Global Hermetic packaging Market - By Geography

  • North America

    • U.S.
    • Canada
    • Mexico
  • Europe

    • France
    • Germany
    • Italy
    • Russia
    • UK
    • Rest of Europe
  • Asia Pacific (APAC)

    • Australia
    • China
    • India
    • Japan
    • South Korea
    • Rest of APAC
  • Middle East & Africa (MEA)

    • South Africa
    • UAE
    • Saudi Arabia
    • Rest of MEA
  • South America (SAM)

    • Brazil
    • Argentina
    • Rest of SAM

Global Hermetic packaging Market - Company Profiles

  • Ametek, Inc.
  • Egide SA
  • Kyocera Corporation
  • Legacy Technologies Inc.
  • Materion Corporation
  • Micross Components
  • Renesas Electronics Corporation
  • Schott AG
  • Teledyne Technologies Incorporated
  • Texas Instruments Inc.

The List of Companies

  1. Ametek, Inc.
  2. Egide SA
  3. Kyocera Corporation
  4. Legacy Technologies Inc.
  5. Materion Corporation
  6. Micross Components
  7. Renesas Electronics Corporation
  8. Schott AG
  9. Teledyne Technologies Incorporated
  10. Texas Instruments Inc.
  • Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the global hermetic packaging market.
  • Highlights key business priorities in order to assist companies to realign their business strategies.
  • The key findings and recommendations highlight crucial progressive industry trends in the global hermetic packaging market, thereby allowing players across the value chain to develop effective long-term strategies.
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
  • Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it.
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution.
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