North America Hermetic Packaging Market Growth and Analysis by 2027

Historic Data: 2016-2017   |   Base Year: 2018   |   Forecast Period: 2019-2027

North America Hermetic Packaging Market to 2027 - Regional Analysis and Forecasts by Product (Passivation Glass, Transponder Glass, Reed Glass, Glass-to-Metal Sealing (GTMS), Ceramic-to-Metal Sealing (CerTMS)); Application (Transistors, MEMS, Sensors, Lasers, Photo Diodes, Airbag Ignitors, Others); Industry Vertical (Aerospace, Medical, Telecommunications, Consumer Electronics, Military and Defense, Automotive, Others)

  • Report Date : Oct 2019
  • Report Code : TIPRE00007126
  • Category : Electronics and Semiconductor
  • Status : Published
  • Available Report Formats : pdf-format excel-format
  • No. of Pages : 150
Page Updated: Nov 2019

The hermetic packaging market in North America is expected to grow from US$ 1.16 Bn in 2018 to US$ 2.02 Bn by the year 2027 with a CAGR of 6.4% from the year 2019 to 2027.

The increasing commercial and military aircraft production and rising spending on defense/military equipment are anticipated to drive the demand of hermetically protected electronic components in the aerospace and defense industry, which in turn is driving the growth of hermetic packaging market. Further, the robust demand for hermetically packaged electronic components from automotive, medical and telecommunications industry is propelling the hermetic packaging market growth. In addition, the increasing demand for consumer electronic devices worldwide is anticipated to drive the demand for hermetic packaging solutions during the forecast period of 2019 to 2027. Consumer electronics are subjected to extensive use by consumers. Environmental conditions such as moisture, impact stress, and heat could damage the sensitive electronic components used in these devices. For instance, quartz crystals used in various consumer electronics products are susceptible to damage due to extreme environmental conditions and hence in order to safeguard such components, manufacturers are adopting hermetic packaging and sealing solutions. Hermetic packaging and sealing helps in increasing the reliability and service life of electronic components.

The hermetic packaging market is segmented on the basis of product into passivation glass, transponder glass, reed glass, glass-to-metal sealing (GTMS), and ceramic-to-metal sealing (CerTMS). Various companies manufacture hermetic housings and other components for the long-term, reliable protection of numerous sensitive electronics by utilizing core technologies such as, glass-to-metal & ceramic-to-metal sealing, thermal sensing components and a range of cutting-edge specialty glass competencies. The glass-to-metal sealing product is the leading segments with the highest market share in 2018. Further, ceramic-to-metal sealing is anticipated to witness immense growth in the hermetic packaging market during the forecast period.

The US dominated the hermetic packaging market in 2018 and is expected to dominate the market with the highest share in the North America region through the forecast period. The country currently accounts for nearly 40% of North America aircraft production, around 14,254 military and commercial aircraft, which is the highest as compared to other countries across the globe. Furthermore, Aerospace and defense is the leading net exporting industry in the nation, which generated a net trade surplus of US$ 86 Bn in 2017. Some of the world’s largest manufacturers of aircrafts namely Boeing and Airbus, have their manufacturing bases established in the US. The presence of aircraft manufacturing plants further boosts the prospects of direct sales of hermetically packaged products to the aircraft OEMs. The figure given below highlights the revenue share of the Mexico in the hermetic packaging market in the forecast period:

Mexico Hermetic Packaging Market Revenue and Forecasts to 2027 (US$ Mn)

TIPRE00007126-img1
  • This FREE sample will include data analysis, ranging from market trends to estimates and forecasts.

NORTH AMERICA HERMETIC PACKAGING MARKET SEGMENTATION

Hermetic Packaging Market - By Product

  • Passivation glass
  • Transponder glass
  • Reed glass
  • Glass-to-Metal Sealing (GTMS)
  • Ceramic-to-Metal Sealing (CerTMS)

Hermetic Packaging Market - By Application

  • Lasers
  • Photo Diodes
  • Airbag Ignitors
  • MEMS
  • Transistors
  • Sensors
  • Others

Hermetic Packaging Market - By Industry Vertical

  • Aerospace
  • Medical
  • Telecommunications
  • Consumer Electronics
  • Military and Defense
  • Automotive
  • Others

Hermetic Packaging Market - By Country

  • US
  • Canada
  • Mexico

Hermetic Packaging Market - Companies Mentioned

  • Ametek, Inc.
  • Egide SA
  • Kyocera Corporation
  • Legacy Technologies Inc.
  • Materion Corporation
  • Micross Components
  • Renesas Electronics Corporation
  • Schott AG
  • Teledyne Technologies Incorporated
  • Texas Instruments Inc.

North America Hermetic Packaging Report Scope

Report Attribute Details
Market size in 2018 US$ 1.16 Billion
Market Size by 2027 US$ 2.02 Billion
Global CAGR (2019 - 2027) 6.4%
Historical Data 2016-2017
Forecast period 2019-2027
Segments Covered By Product
  • Passivation Glass
  • Transponder Glass
  • Reed Glass
  • Glass-to-Metal Sealing
  • Ceramic-to-Metal Sealing
By Application
  • Transistors
  • MEMS
  • Sensors
  • Lasers
  • Photo Diodes
  • Airbag Ignitors
By Industry Vertical
  • Aerospace
  • Medical
  • Telecommunications
  • Consumer Electronics
  • Military and Defense
  • Automotive
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Market leaders and key company profiles
  • Ametek, Inc.
  • Egide SA
  • Kyocera Corporation
  • Legacy Technologies Inc.
  • Materion Corporation
  • Micross Components
  • Renesas Electronics Corporation
  • Schott AG
  • Teledyne Technologies Incorporated
Naveen Chittaragi
Associate Vice President,
Market Research & Consulting

Naveen is an experienced market research and consulting professional with over 9 years of expertise across custom, syndicated, and consulting projects. Currently serving as Associate Vice President, he has successfully managed stakeholders across the project value chain and has authored over 100 research reports and 30+ consulting assignments. His work spans across industrial and government projects, contributing significantly to client success and data-driven decision-making.

Naveen holds an Engineering degree in Electronics & Communication from VTU, Karnataka, and an MBA in Marketing & Operations from Manipal University. He has been an active IEEE member for 9 years, participating in conferences, technical symposiums, and volunteering at both section and regional levels. Prior to his current role, he worked as an Associate Strategic Consultant at IndustryARC and as an Industrial Server Consultant at Hewlett Packard (HP Global).

  • Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
  • PEST and SWOT Analysis
  • Market Size Value / Volume - Global, Regional, Country
  • Industry and Competitive Landscape
  • Excel Dataset

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