The radiation-hardened electronics market size was valued at US$ 1,520.86 million in 2021 and is projected to reach US$ 2,045.04 million by 2028; it is expected to grow at a CAGR of 4.3% from 2021 to 2028.
The defense, aerospace, and energy industries rely heavily on radiation hardening and radiation survivability testing. Electronic components such as circuits, transistors, resistors, diodes, capacitors, single-board computer CPUs, and sensors are designed and manufactured to be less susceptible to damage from radiation and extreme temperatures (from -55°C to 125°C); these are known as radiation-hardened electronics or rad-hard electronics. The electronics industry is creating high-reliability integrated circuits for various space applications. Different levels of reliability are being tailored for specific missions where SWaP, cost, and performance are critical priorities. Radiation is one of the most harmful forces for deployed aerospace & defense electronics systems. This force exists naturally in space and at high altitudes or is unleashed in large amounts when nuclear bombs are detonated. Thus, radiation-hardened electronic components should be deployed to reduce the damage from the harsh environment.
The biggest threat to satellites is radiation generated from solar flares, resulting in system failures. Due to the lack of air protection, these satellites are vulnerable to solar flares. As a result, radiation hardening is required to withstand space radiation while protecting electronic components. Furthermore, electrical components used in space activities are manufactured with a life expectancy of at least 15 years without failure. High-energy particles in space destroy the electronics. These reasons influence the global space industry to adopt rad-hard electronics, further boosting its share in the radiation-hardened electronics market share.
Based on the radiation-hardened electronics market report, the radiation-hardened electronics market is segmented into component, manufacturing technique, application, and geography. Based on component, the radiation-hardened electronics market is segmented into power management components, analog and digital mixed signal devices, memory, and controllers & processors. Based on manufacturing techniques, the market is segmented into Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP). Based on application, the radiation-hardened electronics market is segmented into aerospace & defense, nuclear power plant, space, and others. Based on geography, the radiation-hardened electronics market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and South America.
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Radiation-Hardened Electronics Market: Strategic Insights
Market Size Value in US$ 1,520.86 million in 2021 Market Size Value by US$ 2,045.04 million by 2028 Growth rate CAGR of 4.3% from 2021 to 2028. Forecast Period 2021- 2028 Base Year 2021
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Radiation-Hardened Electronics Market: Strategic Insights
| Market Size Value in | US$ 1,520.86 million in 2021 |
| Market Size Value by | US$ 2,045.04 million by 2028 |
| Growth rate | CAGR of 4.3% from 2021 to 2028. |
| Forecast Period | 2021- 2028 |
| Base Year | 2021 |
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Impact of COVID-19 Pandemic on Radiation-Hardened Electronics Market
In North America, the coronavirus (COVID-19) spread caused enormous concern and economic damage. Due to the COVID-19 epidemic, the US was one of the worst-affected countries in the world, leading governments to put a number of restrictions on industrial, commercial, and public activities in the nation in order to prevent the virus spread. As a result of the suspension of operations in a variety of industries, the closure of various manufacturing units, and people's refusal to enter the workforce, demand for radiation-hardened electronics progressively decreased, influencing the radiation-hardened electronics market negatively.
Moreover, the business conditions were quite robust in the second half of fiscal 2021 as organizations and individuals adjusted to the new environment. However, supply systems were strained since many suppliers had not anticipated the amount of economic vigor that happened. Nonetheless, with the recovery in economic circumstances, many businesses were able to get back on track. For instance, in fiscal 2021, Microchip Technologies, a US-based semiconductor firm, set new records for net sales, non-GAAP gross margins, operating income, net income, and EPS.
Lucrative Regions for Radiation-Hardened Electronics Market
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Market Insights– Radiation-Hardened Electronics Market
Rising Adoption of Radiation-Hardened Electronics Market
Over the years, satellites have experienced high adoption across various industries such as communication, networking, television broadcast, and space-based surveillance. The satellites are prone to solar flares, which leads to system failures. This influences the adoption of radiation-hardened electronics across the end-use industries such as aerospace & defense, nuclear power plants, and space. A few of the major procurement of radiation-hardened electronics across the globe are mentioned below:
- The European Space Agency (ESA) granted CAES, a leader in advanced mission-critical electronics, a contract to create a fault- and radiation-tolerant system-on-chip in December 2021. The project, which the Swedish National Space Agency funds, will develop a 16-core, space-hardened microprocessor based on the open RISC-V instruction set architecture to improve performance and power efficiency in satellite and spacecraft applications (ISA).
- Alphacore Inc. was awarded a Phase I contract by NASA in April 2021 to develop single-chip DC-DC converters for harsh environments. It plans to build a digitally regulated, high switching rate, digital hysteresis-based DC-DC converter for use in space and extreme environments. The company is currently developing the product, which will contain features, including support for up to 4.5V input supply and 4A load current, a 10MHz switching rate, a digital slow-start (SS) option, and digitally controlled regulation loop parameters.
- The US government awarded Silicon Technologies Inc. (STI) a 2-year contract in July 2019 to create Radiation Hardened by Design (RHBD), Process Portable, and Mixed Signal Design IP. The primary goal of this arrangement was to increase the US government's access to radiation-hardened equipment. This arrangement is for radiation-hardened electronic prototype demonstrations for new electronic component solutions to support strategic and space missions by the US government.
Thus, the rise in procuring radiation-hardened electronics by various organizations is fueling the global radiation-hardened electronics market growth.
Component-Based Radiation-Hardened Electronics
Market Insights
Based on component, the global radiation-hardened electronics market is segmented into power management components, analog & digital mixed signal devices, memory, and controllers & processors. The power management component is the largest and the fastest growing segment during the forecast period. The rising demand for MOSFETs and diodes for high-end applications in the space & military industries is principally responsible for the rise of the power management component segment.
Manufacturing Technique-Based Radiation-Hardened Electronics
Market Insights
Based on manufacturing technique, the global radiation-hardened electronics market is bifurcated into radiation hardening by design (RHBD) and radiation hardening by process (RHBP). Due to lesser cost per chip, a large production volume, and customization simplicity, the radiation hardening by design (RHBD) manufacturing approach is predicted to grow at a faster rate in the radiation-hardened electronics industry. RHBD memory, microcontrollers, and ASICs are largely employed in nuclear power facilities and the defense & space industries.
Application-Based Radiation-Hardened Electronics
Market Insights
Based on application, the global radiation-hardened electronics market is segmented into aerospace & defense, nuclear power plant, space, and others. In the radiation-hardened electronics market, the space application segment is expected to grow at the fastest rate. Due to the growing use of rad-hard components in TV broadcasting, telephone satellites, nanosatellites & microsatellites, and the high demand for earth observation satellites, the space application sector accounted for the largest share of the radiation-hardened electronics market.
Players operating in the radiation-hardened electronics market are mainly focused on the development of advanced and efficient products.
- In March 2022, Honeywell partnered with SAPA Placencia, a leading producer of electric power solutions and a global leader in heavy vehicle gearboxes. The partnership was founded to work on improving electric power production for military ground vehicles.
- In February 2022, BAE Systems was awarded a US$60 million contract from the Army Contracting Command. The program's principal purpose is to provide the US government and aerospace sector with onshore access to cutting-edge microelectronics technology. Cadence Design Systems, Carnegie Mellon University, Novellus, Reliable MicroSystems, and Sandia National Laboratories will be part of a team that will carry out this work.
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Component, Manufacturing Technique, and Application
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Australia, Brazil, Canada, China, France, Germany, India, Italy, Japan, Mexico, Russian Federation, Saudi Arabia, South Africa, South Korea, United Arab Emirates, United Kingdom, United States
Frequently Asked Questions
The rise in procurement of radiation-hardened electronics by various organizations is driving the growth of the global radiation-hardened electronics market. Over the years, satellites have experienced high adoption across various industries such as communication, networking, television broadcast, and space-based surveillance. The satellites are prone to solar flares, which leads to system failures. This influences the adoption of radiation-hardened electronics across the end-use industries such as aerospace and defense, nuclear power plants, and space. Some of the major procurement of radiation-hardened electronics across the globe are mentioned below:
The European Space Agency (ESA) granted CAES, a leader in advanced mission-critical electronics, a contract to create a fault- and radiation-tolerant system-on-chip in December 2021. The project, which the Swedish National Space Agency funds, will develop a 16-core, space-hardened microprocessor based on the open RISC-V instruction set architecture to improve performance and power efficiency in satellite and spacecraft applications (ISA).
Alphacore Inc. was awarded a Phase I contract by NASA in April 2021 to develop single-chip DC-DC converters for harsh environments. It plans to build a digitally regulated, high switching rate, digital hysteresis-based DC-DC converter for use in space and extreme environments. Support for up to 4.5V input supply and 4A load current, a 10MHz switching rate, a digital slow-start (SS) option, and digitally controlled regulation loop parameters will be some other features of the product which the company is currently developing.
The US held the largest market share in the radiation-hardened electronics market. The US military is on the path to develop integrated technologies in order to generate futuristic weaponry. These weapons employ radiation-hardened electronics, such as an EMP explosion or an electromagnetic discharge, to wipe out all electronics within a radius and increase collateral damage. However, in the country, device availability has been a source of concern. RHBD (radiation-hardened by design) chips, for instance, are not generally accessible in the United States, causing supply-chain delays that stall programs that require them. As a result, enterprises in the region are partnering to expand the Radiation Hardened Semiconductor Platform in order to monitor this gap. For instance, CAES and SkyWater Technology announced a deal in June 2021 to enhance the design and manufacturing of SkyWater's strategic radiation-protected integrated circuits and systems-in-package. SkyWater's DOD-accredited Trusted, on-shore semiconductor supply chain will be strengthened by the expansion of this critical RadHard microelectronic design and manufacturing ecosystem
Based on the component type, the market is segmented into power management components, analog and digital mixed-signal devices, memory, controllers, and processors. The power management component is the largest and fastest-growing segment during the forecasted period. The rising demand for MOSFETs and diodes for high-end applications in the space and military industries is principally responsible for the rise of the power management component segment. Linear voltage regulators with adjustable or fixed output voltages (positive and negative voltage options), highly efficient point-of-load (switching) regulators, and solid-state relays (SSR), including radiation-hardened single-pole, double-throw (SPDT) SSR are among the power components of radiation-hardened electronics power products.
BAE Systems; Honeywell International Inc.; Infineon Technologies AG; Texas Instruments Incorporated; Cobham Limited are the five key players in the radiation-hardened electronics market. These companies have shown consistent growth in revenue and larger volumes of sales. Additionally, the well-established top five players are offering a comprehensive product portfolio and have a prominent presence in terms of share in the radiation-hardened electronics market.
The increase in demand for radiation-hardened electronics by the end-use industries has influenced manufacturers to invest in product development. Some of the major players operating in the market include BAE Systems; Microchip Technology Inc.; Texas Instruments Incorporated; Renesas Electronics Corporation; and Xilinx, Inc. Some of the recent product developments across the global radiation-hardened electronics market such as:- In October 2021, VORAGO Technologies announced the Arm Cortex-M4 VA41628 and VA41629, 2 new radiation-hardened microcontrollers designed to give flexibility in space-based missions for the aerospace and defense sector. Consumers of the product will be able to upgrade from previous generations of rad-hard arm microcontrollers with functional compatibility and a more powerful entry-level M4 core and scale up to more highly integrated M4 core options with code compatibility owing to the new product additions to VORAGO's M4 family. In September 2021, Honeywell and Synopsys, Inc. agreed to collaborate on developing a design infrastructure to facilitate the development of cutting-edge radiation-hardened and radiation-tolerant Application-Specific Integrated Circuits (ASICs). Honeywell's military and aerospace customers will be able to build and install ASICs for next-generation systems more quickly, including satellites and space vehicles. The partnership brings together.
Based on manufacturing techniques, the market is segmented into radiation hardening by design (RHBD), and radiation hardening by process (RHBP). The radiation hardening by design (RHBD) segment led the radiation-hardened electronics market with a larger share in 2021. RHBD approaches can benefit from advances in power, performance, and area reduction made possible by today's commercially accessible CMOS technology. Edgeless transistors, also known as Enclosed Designing Transistors (ELT), are a well-known RHBD layout approach for reducing leakage current caused by total ionizing dose effects. Because of its cheap cost per chip, large volume of production, and simplicity of customization, the radiation hardening by design (RHBD) manufacturing approach is predicted to grow at the highest rate in the radiation-hardened electronics industry.
- BAE Systems
- Data Device Corporation
- Honeywell International Inc.
- Infineon Technologies AG
- Renesas Electronics Corporation
- Texas Instruments Incorporated
- STMicroelectronics
- Xilinx, Inc. (AMD)
- VORAGO Technologies
- Microchip Technology Inc.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
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Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
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- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
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