Thick-film Hybrid Integrated Circuit Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Type (Al2O3 Ceramic Substrate, BeO Ceramic Substrate, AIN Substrates, Others); Application (Avionics and Defense, Automotive, Telecoms and Computer Industry, Consumer Electronics, Others) and Geography
Report Code: TIPRE00018396
| No. of Pages: 150
| Category: Electronics and Semiconductor
| Status: Upcoming
Thick-film hybrid integrated circuit or hybrid microcircuits are miniaturized electronic circuits made up of individual devices such as semiconductor devices (such as transistors and diodes) and passive components such as (resistors, inductors and capacitors) bonded to a substrate or a printed circuit board (PCB). Thick-film hybrid integrated circuit are often encapsulated in epoxy. It acts as a component, on a PCB in the same way as a monolithic integrated circuit, the key difference between the two devices is how they are produced and installed. The use of screen printed thick film on hybrid integrated circuit has an advantage of flexibility over thin film, although feature sizes may be larger and deposited resistors wider in tolerance. More advancement in thick-film hybrid integrated circuity is expected to drive the market during forecast period.
The advantages of thick-film technology such as selection of desire resistance value and choice of resistance composition and measurements and low cost of thick-film hybrid integrated circuit is driving the growth of the thick-film hybrid integrated circuit market. However, the bigger size and low speed may restrain the growth of the thick-film hybrid integrated circuit market. Furthermore, rising applications of thick-film hybrid integrated circuits in different industries is anticipated to create market opportunities for the thick-film hybrid integrated circuit market during the forecast period.
The "Global Thick-film Hybrid Integrated Circuit Market Analysis to 2028" is a specialized and in-depth study of the thick-film hybrid integrated circuit market with a special focus on the global market trend analysis. The report aims to provide an overview of thick-film hybrid integrated circuit market with detailed market segmentation by type, application, and geography. The global thick-film hybrid integrated circuit market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading thick-film hybrid integrated circuit market players and offers key trends and opportunities in the thick-film hybrid integrated circuit market.
The global thick-film hybrid integrated circuit market is segmented on the basis of type and application. On the basis of type, the market is segmented as Al2O3 ceramic substrate, BeO ceramic substrate, AIN substrates, and others. Similarly, on the basis of application, the market is segmented as avionics and defense, automotive, telecom and computer industry, consumer electronics, and others.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global thick-film hybrid integrated circuit market based on various segments. It also provides market size and forecast estimates from year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The thick-film hybrid integrated circuit market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.
The report analyzes factors affecting thick-film hybrid integrated circuit market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the thick-film hybrid integrated circuit market in these regions.
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The reports cover key developments in the thick-film hybrid integrated circuit market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from thick-film hybrid integrated circuit market are anticipated to lucrative growth opportunities in the future with the rising demand for thick-film hybrid integrated circuit. Below mentioned is the list of few companies engaged in the thick-film hybrid integrated circuit market.
The report also includes the profiles of key thick-film hybrid integrated circuit market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.
- Advance Circuit Technology, Inc.
Cermetek MicroElectronics, Inc.
Emtron Hybrids Inc.
Infineon Technologies AG
Integrated Technology Lab, Inc.
Japan Resistor Mfg. Co., Ltd.
Kolektor Siegert GmbH
Technograph Microcircuits Ltd.
The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.
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The List of Companies
1. Advance Circuit Technology, Inc.
2. Cermetek MicroElectronics, Inc.
3. Emtron Hybrids Inc.
4. Infineon Technologies AG
5. Integrated Technology Lab, Inc.
7. Japan Resistor Mfg. Co., Ltd.
8. Kolektor Siegert GmbH
9. Semtech Corporation
10. Technograph Microcircuits Ltd.