Radiation Hardened Electronics Market Scope And Analysis

  • Report Code : TIPRE00011821
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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Radiation Hardened Electronics Market Report - Analysis 2031

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Radiation Hardened Electronics Market Report Radiation Hardened Electronics Market Size and Share Radiation Hardened Electronics Market Scope and Analysis

Radiation Hardened Electronics Market Report Scope

Report Attribute Details
Market size in 2023 US$ 1.66 Billion
Market Size by 2031 US$ 2.42 Billion
Global CAGR (2023 - 2031) 4.8%
Historical Data 2021-2022
Forecast period 2024-2031
Segments Covered By Component
  • Power Management Components
  • Analog & Digital Mixed Signal Devices
  • Memory
  • Controllers & Processors
By Manufacturing Technique
  • Radiation Hardening Design
  • Radiation Hardening Process
By Application
  • Aerospace & Defense
  • Nuclear Power Plant
  • Space
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • BAE Systems
  • Data Device Corporation
  • Honeywell International Inc
  • Infineon Technologies AG
  • Renesas Electronics Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • Xilinx Inc AMD
  • VORAGO Technologies
  • Microchip Technology Inc