再分布层材料市场基于(关键地区、市场参与者、规模和份额)- 到 2030 年的预测

  • Report Code : TIPRE00002904
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 161
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【研究报告】再分布层材料市场规模预计将从2022年的1.9239亿美元增长到2030年的4.6015亿美元;预计 2022 年至 2030 年复合年增长率为 11.5%。
市场洞察和分析师观点:
先进封装工艺从芯片级开始,其目标始终是在不影响芯片尺寸的情况下减小芯片尺寸。输入输出(I/O)密度。其他几种新兴的封装技术在设备的异构集成中发挥着关键作用。晶圆级扇出封装(WLFO)是作为综合封装工艺而出现的主要封装技术之一。早期的 WLFO 工艺仅采用单芯片设计,即重构晶圆一侧上的单个重分布层 (RDL)。 RDL 是先进晶圆封装的关键一步。 RDL 用作 I/O 布局的重新路由,并允许更高的 I/O 数量。高 I/O 密度通常会带来更好的电气性能,因为更多的输出会导致芯片之间产生更快的电信号,并最大限度地降低电气短路带来的风险。此外,更高的I/O密度使封装能够同时实现更好的性能。此外,亚洲作为全球制造中心的战略位置,加上具有竞争力的生产成本,吸引了寻求优化其供应链的跨国公司。这为再分布层材料市场创建了一个强大的生态系统,各种供应商和制造商在该地区建立了业务。这一因素极大地推动了全球再分布层材料市场的增长。
增长动力和挑战:
再分布层 (RDL) 材料是实现半导体封装小型化的基础,而半导体封装对于适应日益复杂的人工智能至关重要设备。对更先进的人工智能功能的追求需要开发紧凑且密集集成的硬件组件。随着人工智能系统变得越来越复杂,对更小、更高效组件的需求也在增长。因此,对基于人工智能的设备和工具不断增长的需求正在推动重新分配层材料市场。此外,全球再分布层材料市场正在经历显着增长,这主要是由汽车和电信这两个关键行业的需求激增推动的。汽车行业不断扩大的生产需求推动了市场的增长。据尤索夫伊萨东南亚研究院介绍,东南亚是重要的汽车生产基地。东南亚是全球第七大汽车制造中心,2021年生产了350万辆汽车。然而,原材料价格的波动对全球再分布层材料市场的增长构成重大挑战。这些价格变化可能会对行业产生重大影响,影响生产成本、定价策略和整体市场稳定性。关键问题之一是对进口原材料的依赖。再分布层材料的许多重要成分,例如专用聚合物、金属和化学品,通常来自国际供应商。
战略见解
报告细分和范围:
全球再分布层材料市场分为两部分:类型和应用的基础。根据类型,再分布层材料市场分为聚酰亚胺(PI)、聚苯并恶唑(PBO)、苯并环丁烯(BCB)等。根据应用,重分布层材料市场分为扇出晶圆级封装(FOWLP)和2.5D/3D IC封装。从地理上看,市场分为北美(美国、加拿大和墨西哥)、欧洲(德国、法国、意大利、英国、俄罗斯和欧洲其他地区)、亚太地区(澳大利亚、中国、日本、印度、韩国、和亚太地区其他地区)、中东和非洲(阿联酋、沙特阿拉伯、南非以及中东和非洲其他地区)以及南美洲和中美洲(巴西、阿根廷以及南美洲和中美洲其他地区)。
细分分析:
根据类型,重分布层材料市场分为聚酰亚胺(PI)、聚苯并恶唑(PBO)、苯并环丁烯(BCB)等。聚酰亚胺 (PI) 细分市场在 2022 年占据最大的市场份额。聚酰亚胺是聚合物基热塑性塑料,具有高熔体粘度,需要更高的压力来形成模制部件。聚酰亚胺具有良好的耐化学性、高机械强度、更高的热稳定性和卓越的电气性能。对于 IC 封装方法,聚酰亚胺用作高温粘合剂、机械应力缓冲器以及支撑微型电路的薄膜。使用聚酰亚胺的唯一缺点是固化温度较高,而包装则需要较低的固化温度。因此,一些材料供应商专注于提供具有较低固化温度的聚酰亚胺。 PI主要用于所有倒装芯片晶圆凸点和WLP应用。根据应用,重分布层材料市场分为扇出晶圆级封装(FOWLP)和2.5D/3D IC封装[高带宽存储器(HBM)、多芯片集成、层叠封装(FOPOP)等]。 2.5D/3D IC 封装领域的再分布层材料市场份额在 2022 年引人注目。下一代硅节点的光刻步骤和晶圆加工成本普遍增加,正在推动业界寻找替代方案来提高性能和性能。电子设备的功能。此外,以小尺寸集成逻辑、内存、射频和传感器等不同技术的需求正在推动行业转向 3D 集成解决方案。
区域分析:
再分布层材料市场分为五个关键区域:北美、欧洲、亚太地区、南美洲和中美洲以及中东和非洲。亚太地区主导了全球再分布层材料市场,2022 年约占 1.5 亿美元。北美也是主要贡献者,在全球再分布层材料市场中占有重要份额。到 2030 年,北美再分布层材料市场预计将达到 6000 万美元以上。欧洲预计 2022 年至 2030 年复合年增长率将超过 10%。亚太地区再分布层材料市场按国家划分为:澳大利亚、中国、印度、日本、韩国和亚太其他地区。该市场是由汽车和电信行业对重新分布层材料不断增长的需求推动的。台湾在该地区市场占据主导地位,其次是中国、韩国、日本和越南等国家。由于多元化的制造业的存在,该地区被认为是全球制造业中心。随着中国发展成为高技能制造中心,印度、韩国、台湾和越南等发展中国家正在吸引一些企业计划将中低技能制造设施迁往邻国,从而降低劳动力成本.
行业发展和未来机遇:
再分布层材料市场主要参与者采取的各种举措如下:
2022 年 8 月,日月光科技举办了新半导体组件的建设仪式以及位于马来西亚槟城的测试设施。马来西亚日月光 (ASEM) 的新工厂将包括两栋建筑(第 4 号和第 5 号工厂),建筑面积为 982,000 平方英尺,位于峇六拜自由工业区。 2021 年 7 月,杜邦汽车材料宣布了其计划向其位于德国和瑞士的制造工厂投资 500 万美元的资本和运营资源,以提高其高性能汽车粘合剂的产能。COVID-19 大流行的影响:
COVID-19 大流行对德国和瑞士的几乎所有行业都产生了不利影响各国。北美、欧洲、亚太地区 (APAC)、中南美洲 (SAM) 以及中东和非洲 (MEA) 的封锁、企业关闭和旅行限制阻碍了包括化学和材料行业在内的多个行业的增长。制造单位的关闭扰乱了全球供应链、制造活动、交货时间表以及必需品和非必需品的销售。多家企业报告称,2020年产品交付延迟,产品销量大幅下滑。由于疫情引发的经济衰退,消费者在购买决策时变得谨慎和挑剔。由于收入下降和收入前景不确定,消费者显着减少了非必需品的购买,特别是在发展中地区。许多再分布层材料制造商报告称,由于疫情初期消费者需求减少,利润下降。然而,到 2021 年底,许多国家已全面接种疫苗,各国政府宣布放宽某些规定,包括封锁和旅行禁令。人口可支配收入增加,购买新家具和装修的关注度增加,从而增加了对重新分配层材料的需求。所有这些因素都促进了不同地区再分布层材料市场的增长。
竞争格局和主要公司:
SK Hynix Inc、三星电子有限公司、英飞凌科技股份公司、杜邦德内穆尔公司、富士胶片控股公司、 Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和 Shin-Etsu Chemical Co Ltd 是全球再分布层材料市场的知名参与者。这些厂商提供高质量的再分布层材料,并满足世界各地许多消费者的需求。
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

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Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

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Frequently Asked Questions


What are the key drivers for the growth of the global redistribution layer material market?

The growing demand for AI-based equipment and tools is significantly impacting the redistribution layer material market. The quest for more advanced AI capabilities necessitates the development of more compact and densely integrated hardware components. Redistribution layer (RDL) materials are fundamental in enabling the miniaturization of semiconductor packages, which is essential to accommodate the increasing complexity of AI devices. As AI systems become more sophisticated, the demand for smaller and more efficient components grows.

What is the largest region of the global redistribution layer material market?

Asia Pacific accounted for the largest share of the global redistribution layer material market. Asia Pacific is one of the most significant regions for the redistribution layer material market owing to drastic increase in the demand for semiconductors.

Based on the application, which segment is projected to grow at the fastest CAGR over the forecast period?

Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging [high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others]. The redistribution layer material market share of the 2.5D/3D IC packaging segment was notable in 2022. The increased costs of lithography steps and wafer processing in general at the next-generation silicon nodes are driving the industry to find alternatives to improve the performance and functionality of electronic devices.

Based on type, why the polyimide (PI) segment accounted for the largest revenue share in 2022?

Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest market share in 2022. Polyimides are polymer-based thermoplastics with a high melt viscosity and require higher pressures for forming molded parts. Polyimides offer good chemical resistance, high mechanical strength, higher thermal stabilities, and exceptional electrical properties. For the IC packaging methods, polyimides are used as high-temperature adhesives, mechanical stress buffers, and as a film supporting the micro-sized circuitry.

Can you list some of the major players operating in the global redistribution layer material market?

The major players operating in the global redistribution layer material market are SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd., NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd.

What are the opportunities for redistribution layer material in the global market?

The Internet of Things (IoT) market across the globe has gained considerable popularity recently, with businesses acknowledging the significance of connectivity. IoT has enabled each device to be connected to the Internet. According to the International Data Corporation (IDC), 41.6 billion IoT devices will be in 2025, capable of generating 79.4 zettabytes (ZB) of data. This exponential increase in data traffic over the internet is due to the increasing penetration of smartphones and other consumer electronics that can be connected to the internet due to the rising popularity of IoT.

The List of Companies - Redistribution Layer Material Market

  1. SK Hynix Inc
  2. Samsung Electronics Co Ltd
  3. Infineon Technologies AG
  4. Dupont De Nemours Inc
  5. Fujifilm Holdings Corp
  6. Amkor Technology Inc
  7. ASE Technology Holding Co Ltd.
  8. NXP Semiconductors NV
  9. JCET Group Co Ltd
  10. Shin-Etsu Chemical Co Ltd

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

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  • Validates and strengthens in-house secondary research findings
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Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • Country Level Data:

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  • Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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