El mercado de tecnología de embalaje con troqueles integrados se valoró en 63,40 millones de dólares estadounidenses en 2020 y se prevé que alcance los 242,80 millones de dólares estadounidenses en 2028. Se espera que el mercado de tecnología de embalaje con troqueles integrados crezca a una tasa compuesta anual del 18,6% durante el período previsto de 2021 a 2028.
Los dispositivos electrónicos están evolucionando a un ritmo rápido con la integración de más componentes electrónicos en placas de circuitos para funciones avanzadas. Los dispositivos son cada vez más compactos con tecnología de embalaje avanzada para ofrecer un mayor control y ahorro de espacio a los clientes. La miniaturización de dispositivos electrónicos para optimizar el espacio en los dispositivos finales está aumentando el crecimiento del mercado. La llegada de los dispositivos conectados al Internet de las cosas (IoT) ha aumentado la demanda de tecnología de empaquetado integrada para integrar más componentes de IoT en el mismo espacio. Además, la creciente adopción de teléfonos inteligentes y dispositivos portátiles inteligentes está complementando aún más el crecimiento del mercado. Los teléfonos inteligentes y los dispositivos portátiles inteligentes se están diseñando utilizando la tecnología de empaquetado integrado para optimizar el espacio disponible para integrar más componentes.
Adopción creciente de dispositivos electrónicos compactos con conectividad a Internet apoya la tecnología de embalaje de matrices integradas para integrar el máximo de piezas en un solo paquete. El mercado global de tecnología de embalaje de troqueles integrados está segmentado según la plataforma, la aplicación, la industria vertical y la geografía. Según la plataforma, el mercado de tecnología de embalaje con matrices integradas se segmenta en sustrato de paquete de circuitos integrados, tablero rígido y tablero flexible. En términos de aplicación, el mercado de tecnología de embalaje de troqueles integrados se segmenta en teléfonos inteligentes y teléfonos móviles. tabletas, dispositivos médicos y portátiles, dispositivos industriales y dispositivos de seguridad. Basado en la industria, el mercado de tecnología de embalaje de troqueles integrados está segmentado en automoción, atención sanitaria, electrónica de consumo, TI y tecnología. telecomunicaciones, entre otros. Según la región, el mercado está segmentado en América del Norte, Europa, Asia Pacífico (APAC) y el resto del mundo.
Impacto de la pandemia de COVID-19 en los dispositivos integrados Mercado de tecnología de embalaje
La pandemia de COVID-19 ha obstaculizado la industria de semiconductores y el crecimiento económico de casi todos los países. La pandemia ha afectado gravemente al sector manufacturero debido al cierre de instalaciones durante un período determinado. Disminuyeron las ventas de diversos productos industriales, como automóviles y productos electrónicos. También permanecieron cerrados locales de oficinas, lugares públicos, escuelas, transporte y otros espacios, lo que disminuyó el crecimiento del mercado debido a las bajas ventas. La industria de los semiconductores sufrió un gran golpe al reducirse la demanda de componentes electrónicos de todos los sectores industriales y de los consumidores finales. El modelo de ingresos de la microelectrónica ha disminuido porque no hubo producción en masa durante el período de bloqueo. Después del confinamiento, la industria de los semiconductores comenzó a recuperar su cuota de mercado a medida que las instalaciones de producción reiniciaron sus operaciones, con medidas preventivas.
regiones lucrativas en el mercado de tecnología de embalaje de matrices integradas
Perspectivas del mercado de tecnología de embalaje de matrices integradas
Creciente demanda de miniaturización de dispositivos electrónicos< /p>
Los dispositivos electrónicos se están desarrollando utilizando componentes electrónicos de factor de forma pequeño para mejorar el espacio y el diseño del producto final. Los clientes prefieren dispositivos electrónicos portátiles compactos y de tamaño pequeño que ofrezcan las máximas funciones. Para mejorar la experiencia del usuario, las empresas están desarrollando productos electrónicos miniaturizados para integrar el máximo de componentes en un solo troquel. La integración de la máxima cantidad de componentes, como sensores y procesadores, en un solo troquel ofrece características mejoradas para los clientes. El aumento de la población conocedora de la tecnología es uno de los principales factores para la miniaturización de la electrónica, ya que ha creado una dura competencia entre los actores del mercado para ofrecer el máximo número de funciones en un solo dispositivo.
Información de mercado basada en plataformas
La tecnología de embalaje ha evolucionado rápidamente para mejorar el embalaje de pequeños componentes electrónicos en una sola matriz para optimizar el espacio en el dispositivo final. En la plataforma de sustrato de paquete de circuitos integrados, la matriz semiconductora se incrusta dentro de un material de PCB (placa de circuito impreso) estándar, como capas laminadas y marcos de conductores, en el momento de la formación del sustrato. La plataforma ofrece varios beneficios, como miniaturización y visualización. flexibilidad de diseño; confiabilidad y estabilidad mecánica mejoradas; y térmica y térmica mejoradas. rendimiento térmico eléctrico. En términos de plataforma, el mercado de tecnología de embalaje de troqueles integrados se segmenta en sustrato de paquete IC, tablero rígido y tablero flexible.
Mercado de tecnología de embalaje de troqueles integrados, por plataforma: ; 2020 y 2028
Fuente: Análisis de Insight Partners
Nota: El círculo interior representa el tamaño del mercado para 2020 y el círculo exterior representa 2028.
Información del mercado basada en aplicaciones
En términos de aplicación, el mercado global de tecnología de embalaje de matrices integradas es segmentado en teléfonos inteligentes y tabletas, dispositivos médicos y portátiles, dispositivos industriales, dispositivos de seguridad y otros. La creciente necesidad de microelectrónica de diversos sectores verticales, incluidos los de automoción, atención sanitaria y electrónica de consumo, para aplicaciones basadas en factores de forma pequeños está respaldando el crecimiento del mercado. La creciente tendencia a reducir el tamaño y mejorar la funcionalidad de los dispositivos electrónicos está impulsando la adopción de tecnología de empaquetado integrado para teléfonos móviles y tabletas. El tamaño del troquel y del chip desempeñan un papel vital en el diseño de un teléfono inteligente, ya que los fabricantes están instando a una nueva solución que ocupe el mínimo espacio posible.
Perspectivas del mercado basadas en la industria
Basada en la industria, la tecnología global de envasado integrado se segmenta en electrónica de consumo, informática y telecomunicaciones, automoción, atención sanitaria y otros. El aumento de la adopción de dispositivos inteligentes y vehículos conectados ha aumentado la necesidad de dispositivos IoT desarrollados mediante tecnología de embalaje avanzada. Además, los dispositivos portátiles inteligentes están desempeñando un papel importante en los monitores de salud humana. La creciente demanda de pequeños dispositivos electrónicos en la industria de la salud está respaldando el crecimiento del mercado.
Información estratégica
Participantes que operan en el mercado de tecnología de embalaje de troqueles integrados centrarse en estrategias como iniciativas de mercado, adquisiciones y lanzamientos de productos para mantener sus posiciones en el mercado. Algunos avances de los actores clave del mercado de tecnología de embalaje con matrices integradas son:
- En agosto de 2020, Schweizer Electronic AG formó un acuerdo de representación de ventas con Varikorea Co. Ltd promoverá las placas de circuito impreso de alta tecnología y las soluciones de integración de SCHWEIZER en Corea del Sur.
- En agosto de 2020, Taiwan Semiconductor Manufacturing Co. ., Ltd. (TSMC) lanzó una nueva tecnología de embalaje avanzada y pegado de silicio 3D.
El mercado de tecnología de embalaje con troquel integrado se ha segmentado de la siguiente manera:< /p>
Mercado de tecnología de envasado de troqueles integrados: por plataforma
- Sustrato de paquete IC
- Tablero rígido
- Tablero flexible
Mercado de tecnología de embalaje de matriz integrada y ndash ; por aplicación
- Smartphones y tabletas
- Dispositivos médicos y portátiles
- Dispositivos industriales
- Dispositivos de seguridad
- Otras aplicaciones
Mercado de tecnología de embalaje de troqueles integrados: por industria
- Electrónica de consumo
- TI y telecomunicaciones
- Automoción
- Atención sanitaria
- Otras industrias< /li>
Mercado de tecnología de embalaje de troqueles integrados: por Región
- América del Norte
- Estados Unidos
- Canadá
- México
< li>Europa - Reino Unido
- Alemania
- Francia
- Italia
- Rusia
- Resto de Europa
- Asia Pacífico (APAC)
- China
- Japón
- India < li>Australia
- Corea del Sur
- Resto de APAC
- MEA
- SAM
Mercado de tecnología de embalaje de troqueles integrados: ndash; Perfiles de la empresa
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Tecnología & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- INFINEON TECHNOLOGIES AG
- Microsemi
- SCHWEIZER ELECTRONIC AG
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Taiwan Semiconductor Manufacturing Company, Limited
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
This text is related
to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
This text is related
to country scope.
Frequently Asked Questions
The growth of the embedded die packaging technology market is primarily attributed to growing demand for miniaturization of electronic devices. Moreover, the rising developments in embedded die packaging technology, thereby substantially driving the embedded die packaging technology market.
The embedded die packaging technology has a huge opportunity in the smartphone and tablet market to offer advanced processors, transmitters, and other components. Embedded die packaging technology enhances the device performance and provides better space utilization solutions. A few market players are developing ICs and other components using the embedded die packaging technology, while for others, it is an excellent opportunity to innovate new solutions for smartphones and tablets. For instance, market players such as AT&S, SHINKO, and ASE Group offer the embedded die packaging technology for smartphones. The rising consumption of smartphones is a major supporting factor for the market growth in coming years. To grab a leading position, companies need to develop new processors with compact size and high-performance level. According to Ericsson, in 2016, almost 4 billion mobile connections were present in Asia Pacific, and are expected to reach 4.6 billion by 2021. Increasing demand in Asia Pacific alone shows the potential for embedded die packaging technology in the smartphone industry.
The embedded die packaging technology market is led by IC package substrate segment with highest share and is expected to dominate in the forecast period. In the semiconductor industry, ICs (integrated circuit) are using embedded die packaging technology to reduce the size and enhance the performance. In the IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefit—such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. The IC package substrate platform in embedded die packaging technology is used for a wide range of applications, such as MOSFET, regulator, DCDC, audio, sensor, optical, connectivity, memory, and image module.
The List of Companies - Embedded Die Packaging Technology Market
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- INFINEON TECHNOLOGIES AG
- Microsemi
- SCHWEIZER ELECTRONIC AG
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Taiwan Semiconductor Manufacturing Company, Limited
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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