嵌入式芯片封装技术市场基于(关键地区、市场参与者、规模和份额)- 到 2031 年的预测

  • Report Code : TIPRE00004132
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 158
Buy Now

2020 年嵌入式芯片封装技术市场价值为 6340 万美元,预计到 2028 年将达到 2.428 亿美元。在预测期内,嵌入式芯片封装技术市场预计将以 18.6% 的复合年增长率增长2021 年至 2028 年。

电子设备正在快速发展,电路板上集成了更多电子元件以实现高级功能。这些设备的尺寸越来越紧凑,采用先进的封装技术,为客户提供增强的控制和节省空间。电子设备的小型化以优化最终设备的空间正在促进市场增长。物联网 (IoT) 连接设备的出现增加了对嵌入式芯片封装技术的需求,以在同一空间集成更多物联网组件。此外,智能手机和智能可穿戴设备的日益普及进一步补充了市场的增长。智能手机和智能可穿戴设备的设计采用嵌入式芯片封装技术,以优化集成更多组件的可用空间。

越来越多地采用具有互联网连接功能的紧凑型电子产品支持嵌入式芯片封装技术,将最多的部件集成在单个封装中。全球嵌入式芯片封装技术市场根据平台、应用、垂直行业和地理位置进行细分。根据平台,嵌入式芯片封装技术市场分为IC封装基板、刚性板和柔性板。在应用方面,嵌入式芯片封装技术市场分为智能手机和平板电脑。平板电脑、医疗和可穿戴设备、工业设备和安全设备。根据行业,嵌入式芯片封装技术市场分为汽车、医疗保健、消费电子、IT 和医疗保健。电信等。按地区划分,市场分为北美、欧洲、亚太地区 (APAC) 和世界其他地区。

COVID-19 大流行对嵌入式的影响芯片封装技术市场

COVID-19 大流行阻碍了几乎每个国家的半导体行业和经济增长。由于工厂停工一段时间,疫情对制造业造成了严重影响。汽车和电子产品等各种工业产品的销售下降。办公场所、公共场所、学校、交通和其他空间也仍然关闭,由于销售量低,导致市场增长下降。由于各工业部门和最终消费者对电子元件的需求减少,半导体行业遭受重大打击。由于封锁期间没有大规模生产,微电子的收入模式已经下降。封锁后,随着生产设施在预防措施下重新运营,半导体行业开始重新夺回市场份额。

嵌入式芯片封装技术市场的利润丰厚的区域

嵌入式芯片封装技术市场洞察

电子设备小型化需求不断增长< /p>

电子产品正在使用小型电子元件来开发,以扩大空间并改进最终产品设计。客户更喜欢提供最多功能的紧凑、小尺寸手持电子设备。为了增强用户体验,公司正在开发小型电子产品,以在单个芯片上集成最多的组件。将最大数量的组件(例如传感器和处理器)集成在单个芯片中,可以为客户提供增强的功能。不断增长的精通技术的人口是电子产品小型化的主要因素之一,因为它在市场参与者中引发了激烈的竞争,以在单个设备中提供最大数量的功能。

基于平台的市场洞察

封装技术已经迅速发展,以增强单个芯片中小型电子元件的封装,从而优化最终设备中的空间。在 IC 封装基板平台中,半导体芯片在基板形成时嵌入标准 PCB(印刷电路板)材料中,例如层压层和引线框架。该平台具有多种优势,例如小型化和小型化。设计灵活性;提高可靠性和机械稳定性;并改进了散热和电热性能。从平台来看,嵌入式芯片封装技术市场分为IC封装基板、刚性板和柔性板。

嵌入式芯片封装技术市场(按平台) ; 2020 年和 2028 年

资料来源:Insight Partners Analysis

注:内圈代表 2020 年和 2020 年的市场规模外圈代表2028年。

基于应用的市场洞察

从应用来看,全球嵌入式芯片封装技术市场细分为智能手机和智能手机平板电脑、医疗和可穿戴设备、工业设备、安全设备等。汽车、医疗保健和消费电子等各个垂直行业对微电子对小型应用的新兴需求正在支撑市场增长。电子设备尺寸减小和功能改进的趋势正在推动手机和平板电脑嵌入式芯片封装技术的采用。裸片和芯片尺寸在智能手机设计中发挥着至关重要的作用,因为制造商正在敦促采用新的解决方案来占用尽可能小的空间。

基于行业的市场洞察

按行业划分,全球嵌入式芯片封装技术分为消费电子、IT 和电信、汽车、医疗保健等。智能设备和联网车辆的普及增加了对采用先进封装技术开发的物联网设备的需求。此外,智能可穿戴设备在人体健康监测中发挥着重要作用。医疗保健行业对小型电子设备的需求不断增长,支撑着市场的增长。

战略见解

嵌入式芯片封装技术市场的参与者专注于市场举措、收购和产品发布等战略,以维持其市场地位。嵌入式芯片封装技术市场主要参与者的一些发展包括:

  • 2020 年 8 月,Schweizer Electronic AG 与 Varikorea Co. 签订了销售代表协议,有限公司在韩国推广SCHWEIZER的高科技印刷电路板和嵌入解决方案。
  • 2020年8月,台积电台积电 (TSMC) 推出全新 3D 硅定位和先进封装技术。

嵌入式芯片封装技术市场细分如下:< /p>

嵌入式芯片封装技术市场 –按平台划分

  • IC封装基板
  • 刚性板
  • 柔性板

嵌入式芯片封装技术市场;按应用划分

  • 智能手机和平板电脑
  • 医疗和可穿戴设备
  • 工业设备
  • 安全设备
  • 其他应用

嵌入式芯片封装技术市场 –按行业划分

  • 消费电子产品
  • IT 和电信
  • 汽车
  • 医疗保健
  • 其他行业< /li>

嵌入式芯片封装技术市场 –按地区划分

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • < li>欧洲
    • 英国
    • 德国
    • 法国
    • 意大利
    • 俄罗斯
    • 其他欧洲
  • 亚太地区 (APAC)
    • 中国
    • 日本
    • 印度
    • < li>澳大利亚
    • 韩国
    • 亚太地区其他地区
  • 世界其他地区
    • 中东和非洲
  • 世界其他地区
    • 中东和非洲
    • li>
    • SAM

嵌入式芯片封装技术市场 -公司简介

  • Amkor Technology, Inc.
  • 日月光集团
  • AT&amp;奥地利科技公司Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • 通用电气公司
  • INFINEON TECHNOLOGIES AG
  • Microsemi
  • SCHWEIZER ELECTRONIC AG
  • 神光电机工业股份有限公司
  • 台湾积体电路制造股份有限公司
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

This text is related
to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

Frequently Asked Questions


What are reasons behind embedded die packaging technology market growth?

The growth of the embedded die packaging technology market is primarily attributed to growing demand for miniaturization of electronic devices. Moreover, the rising developments in embedded die packaging technology, thereby substantially driving the embedded die packaging technology market.

What are market opportunities for embedded die packaging technology market?

The embedded die packaging technology has a huge opportunity in the smartphone and tablet market to offer advanced processors, transmitters, and other components. Embedded die packaging technology enhances the device performance and provides better space utilization solutions. A few market players are developing ICs and other components using the embedded die packaging technology, while for others, it is an excellent opportunity to innovate new solutions for smartphones and tablets. For instance, market players such as AT&S, SHINKO, and ASE Group offer the embedded die packaging technology for smartphones. The rising consumption of smartphones is a major supporting factor for the market growth in coming years. To grab a leading position, companies need to develop new processors with compact size and high-performance level. According to Ericsson, in 2016, almost 4 billion mobile connections were present in Asia Pacific, and are expected to reach 4.6 billion by 2021. Increasing demand in Asia Pacific alone shows the potential for embedded die packaging technology in the smartphone industry.

Which Platform is expected to dominate the market in the forecast period?

The embedded die packaging technology market is led by IC package substrate segment with highest share and is expected to dominate in the forecast period. In the semiconductor industry, ICs (integrated circuit) are using embedded die packaging technology to reduce the size and enhance the performance. In the IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefit—such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. The IC package substrate platform in embedded die packaging technology is used for a wide range of applications, such as MOSFET, regulator, DCDC, audio, sensor, optical, connectivity, memory, and image module.

The List of Companies - Embedded Die Packaging Technology Market

  1. Amkor Technology, Inc.
  2. ASE Group
  3. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  4. Fujikura Ltd.
  5. General Electric Company
  6. INFINEON TECHNOLOGIES AG
  7. Microsemi
  8. SCHWEIZER ELECTRONIC AG
  9. SHINKO ELECTRIC INDUSTRIES CO., LTD.
  10. Taiwan Semiconductor Manufacturing Company, Limited

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

Your data will never be shared with third parties, however, we may send you information from time to time about our products that may be of interest to you. By submitting your details, you agree to be contacted by us. You may contact us at any time to opt-out.

Related Reports